JPH0258370U - - Google Patents
Info
- Publication number
- JPH0258370U JPH0258370U JP13760188U JP13760188U JPH0258370U JP H0258370 U JPH0258370 U JP H0258370U JP 13760188 U JP13760188 U JP 13760188U JP 13760188 U JP13760188 U JP 13760188U JP H0258370 U JPH0258370 U JP H0258370U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pad portion
- solder
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000006071 cream Substances 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13760188U JPH0258370U (cs) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13760188U JPH0258370U (cs) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258370U true JPH0258370U (cs) | 1990-04-26 |
Family
ID=31399170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13760188U Pending JPH0258370U (cs) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258370U (cs) |
-
1988
- 1988-10-21 JP JP13760188U patent/JPH0258370U/ja active Pending