JPH0256445U - - Google Patents
Info
- Publication number
- JPH0256445U JPH0256445U JP1988134610U JP13461088U JPH0256445U JP H0256445 U JPH0256445 U JP H0256445U JP 1988134610 U JP1988134610 U JP 1988134610U JP 13461088 U JP13461088 U JP 13461088U JP H0256445 U JPH0256445 U JP H0256445U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor chip
- resin
- package
- airtight package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134610U JPH0256445U (enrdf_load_stackoverflow) | 1988-10-14 | 1988-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134610U JPH0256445U (enrdf_load_stackoverflow) | 1988-10-14 | 1988-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256445U true JPH0256445U (enrdf_load_stackoverflow) | 1990-04-24 |
Family
ID=31393527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988134610U Pending JPH0256445U (enrdf_load_stackoverflow) | 1988-10-14 | 1988-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256445U (enrdf_load_stackoverflow) |
-
1988
- 1988-10-14 JP JP1988134610U patent/JPH0256445U/ja active Pending