JPH0256355U - - Google Patents
Info
- Publication number
- JPH0256355U JPH0256355U JP13623888U JP13623888U JPH0256355U JP H0256355 U JPH0256355 U JP H0256355U JP 13623888 U JP13623888 U JP 13623888U JP 13623888 U JP13623888 U JP 13623888U JP H0256355 U JPH0256355 U JP H0256355U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- shield
- lead wire
- connector
- bundled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13623888U JPH0256355U (fr) | 1988-10-18 | 1988-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13623888U JPH0256355U (fr) | 1988-10-18 | 1988-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256355U true JPH0256355U (fr) | 1990-04-24 |
Family
ID=31396559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13623888U Pending JPH0256355U (fr) | 1988-10-18 | 1988-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256355U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010149467A (ja) * | 2008-12-26 | 2010-07-08 | Seiko Epson Corp | 吐出検査装置、流体吐出装置及びシールドケーブルの加工方法 |
-
1988
- 1988-10-18 JP JP13623888U patent/JPH0256355U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010149467A (ja) * | 2008-12-26 | 2010-07-08 | Seiko Epson Corp | 吐出検査装置、流体吐出装置及びシールドケーブルの加工方法 |