JPH0256168U - - Google Patents
Info
- Publication number
- JPH0256168U JPH0256168U JP13406988U JP13406988U JPH0256168U JP H0256168 U JPH0256168 U JP H0256168U JP 13406988 U JP13406988 U JP 13406988U JP 13406988 U JP13406988 U JP 13406988U JP H0256168 U JPH0256168 U JP H0256168U
- Authority
- JP
- Japan
- Prior art keywords
- region
- adhesive
- adhesive tape
- width
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａ及びｂは本発明の第１の実施例を示す
粘着テープの斜視図及び断面図、第２図は本発明
の第２の実施例を示す粘着テープの斜視図である
。 １……樹脂製テープ、２……接着剤、３，３ａ
，３ｂ……導電箔、４……電子部品、５……接着
剤塗布領域。
粘着テープの斜視図及び断面図、第２図は本発明
の第２の実施例を示す粘着テープの斜視図である
。 １……樹脂製テープ、２……接着剤、３，３ａ
，３ｂ……導電箔、４……電子部品、５……接着
剤塗布領域。
Claims (1)
- 樹脂製テープの一主面に電子部品を接着固定す
る接着剤が塗布された領域を有する粘着テープに
おいて、前記領域内にこの領域幅より狭い領域幅
をもつ導電箔が貼りつけられたことを特徴とする
粘着テープ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13406988U JPH0256168U (ja) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13406988U JPH0256168U (ja) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256168U true JPH0256168U (ja) | 1990-04-24 |
Family
ID=31392487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13406988U Pending JPH0256168U (ja) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256168U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997025848A1 (fr) * | 1996-01-08 | 1997-07-17 | Oji Paper Co., Ltd. | Papier de bande support pour composants electroniques en forme de puces |
-
1988
- 1988-10-13 JP JP13406988U patent/JPH0256168U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997025848A1 (fr) * | 1996-01-08 | 1997-07-17 | Oji Paper Co., Ltd. | Papier de bande support pour composants electroniques en forme de puces |
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