JPH0255159A - Optical printer head - Google Patents
Optical printer headInfo
- Publication number
- JPH0255159A JPH0255159A JP63207672A JP20767288A JPH0255159A JP H0255159 A JPH0255159 A JP H0255159A JP 63207672 A JP63207672 A JP 63207672A JP 20767288 A JP20767288 A JP 20767288A JP H0255159 A JPH0255159 A JP H0255159A
- Authority
- JP
- Japan
- Prior art keywords
- led array
- array
- metal plate
- plate
- printer head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 108091008695 photoreceptors Proteins 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000011148 porous material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、LEDアレイを発光源とする電子写真方式を
用いた光プリンタヘッドに係り、詳しくは光プリンタヘ
ッドの実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical printer head using an electrophotographic method using an LED array as a light emitting source, and specifically relates to a mounting structure of an optical printer head.
[従来の技術]
特開昭60−48384号公報などに開示されている公
知のIJKDアレイを用いた光プリンタヘッドは、第6
図に示すように放熱板22に固定されたセラミック基板
21上にワイヤボンディングによって実装されたLED
アレイ1と感光体の間に結像光学系を挾持し、光プリン
タヘッドに入力された画像信号に応じてLEDアレイを
発光させ感光体上に画像を結像させる構成となっていた
。[Prior Art] An optical printer head using a known IJKD array disclosed in Japanese Unexamined Patent Publication No. 60-48384, etc.
As shown in the figure, an LED is mounted by wire bonding on a ceramic substrate 21 fixed to a heat sink 22.
An imaging optical system was sandwiched between the array 1 and the photoreceptor, and the LED array was configured to emit light in response to an image signal input to the optical printer head to form an image on the photoreceptor.
[発明が解決しようとする課題]
しかしながら、従来の光プリンタヘッドにおいては、結
像素子20を必要とするため感光体までの光路長が長く
なり、LgDアレイと結像素子、及びLEDアレイと感
光体の間隔の調整を行わなければならず、非常に困難か
つ微妙であるため光プリンタヘッドの大型化、複雑化、
及び高価格化をまぬがれなかった。特に前記結像素子に
セルフォックレンズアレイ(SLA)[登録商標]のう
ちで、焦点深度が深いSLAを用いると光量不足となり
中高速印字装置への適用が不可能となり、逆に開口数が
大きいSLAを用いると焦点深度が浅(なり印字のにじ
みやぼけが生ずることになるいづれにせよ印字品質の低
下は必至であり、結像素子の間隔調整が不十分であれば
、さらに印字品質を損ねることとなった。[Problems to be Solved by the Invention] However, in the conventional optical printer head, since the imaging element 20 is required, the optical path length to the photoconductor becomes long. The distance between the bodies must be adjusted, which is very difficult and delicate, making optical printer heads larger and more complex.
And prices could not be avoided. In particular, if a Selfoc Lens Array (SLA) [registered trademark], which has a deep depth of focus, is used as the imaging element, the amount of light will be insufficient, making it impossible to apply it to medium-high speed printing devices, and conversely, the numerical aperture will be large. When SLA is used, the depth of focus is shallow (which causes smearing and blurring of the print, which inevitably lowers the print quality, and if the interval between the imaging elements is not properly adjusted, the print quality will deteriorate further. It became a thing.
上記問題点を解決すべく、特開昭62−251970号
公報に開示される提案がなされた。しかし、これにおい
てはLEDアレイの入力電極の厚み及び光透過性樹脂の
厚みを実用的に薄くすることが困難であり、実現の可能
性は極めて低いものであった。In order to solve the above problems, a proposal was made as disclosed in Japanese Patent Application Laid-Open No. 62-251970. However, in this case, it is difficult to practically reduce the thickness of the input electrode of the LED array and the thickness of the light-transmitting resin, and the possibility of realization is extremely low.
そこで本発明は、このような問題点を解決するもので、
その目的とするところは高印字品質画像を得て、結像素
子等の光学系を持たない簡単な構成の光プリンタヘッド
を提供することである。Therefore, the present invention aims to solve these problems.
The purpose is to provide an optical printer head with a simple structure that provides high print quality images and does not have an optical system such as an imaging element.
[課題を解決するための手段]
上記問題点を解決するために本発明は、LEDアレイを
発光源とし感光体を露光して印字を行う光プリンタヘッ
ドにおいて、
多数の貫通小孔を有する金属板KLKDアレイの発光面
を固着接続させ、絶縁板上に形成された配線パターンと
該LEDアレイを固着接続し、該金属板をLEDアレイ
の共通電極としたことを特徴とする。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides an optical printer head that uses an LED array as a light emitting source and prints by exposing a photosensitive member to a metal plate having a large number of through holes. The light emitting surface of the KLKD array is fixedly connected, the wiring pattern formed on the insulating plate and the LED array are fixedly connected, and the metal plate is used as a common electrode of the LED array.
[作用]
本発明の構成によれば、LEDアレイから発せられた光
が金属板に設けられた多数の貫通小孔より出射し、該金
属板に密接して配置された感光ドラム面上を光学系を介
することなく露光する。[Function] According to the configuration of the present invention, light emitted from the LED array is emitted from a large number of small through holes provided in a metal plate, and optically passes over the surface of the photosensitive drum disposed in close proximity to the metal plate. Expose without going through a system.
[実施例]
そこで、以下に本発明の詳細を実施例に基づいて説明す
る。[Example] Therefore, details of the present invention will be explained below based on an example.
第1図は、本発明による第1の実施例の光プリンタヘッ
ドの要部断面を示した斜視図、第2図はA−A′におけ
る断面図である。図中符号1はLEDアレイで、金属板
2に固着されている。該金属板2には多数の貫通小孔3
が設けられており、該貫9通小孔6の配列間隔は所望す
る印刷ドツト密度に対応した間隔で一列もしくは千鳥状
二列に配列される。本発明においては、第3図に示すよ
うに240DPI(Dot Per 工nch)及
び300DP工の印刷ドツト密度の実施例について説明
する。但し、本発明がこれに限定されるわけではなく、
同様な方法を持ってすれば異なる印刷ドツト密度の光プ
リンタヘッドを構成できるのは言うまでもない。FIG. 1 is a perspective view showing a sectional view of a main part of an optical printer head according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line A-A'. Reference numeral 1 in the figure is an LED array, which is fixed to a metal plate 2. The metal plate 2 has a large number of through holes 3.
The nine through holes 6 are arranged in one row or in two staggered rows at intervals corresponding to the desired printing dot density. In the present invention, examples of printing dot densities of 240DPI (Dots Per Mach) and 300DPI will be described as shown in FIG. However, the present invention is not limited to this,
It goes without saying that optical printer heads with different printing dot densities can be constructed using a similar method.
(実施例1)
前記貫通小孔3は第6図(α)に示されるように、直線
状に106μmの間隔で配置されているなお、寸法aは
106106pは150μm。(Example 1) As shown in FIG. 6(α), the small through holes 3 are arranged linearly at intervals of 106 μm.The dimension a is 106106p and 150 μm.
Cは170prn、clは60pm、eは85/jF7
Lである。該貫通小孔5が配設されている金属板2の裏
面側にLEDアレイ1が導電性接着剤によって固着され
ている。該I、EDアレイ10表面上には前記金属板3
に配設された貫通小孔3に対応して発光窓10が設けら
れている。該発光窓10及び貫通小孔3の直径について
各々3水準の値を用いて試作実験を行ったところ、下表
に示す結果を得た。C is 170prn, cl is 60pm, e is 85/jF7
It is L. The LED array 1 is fixed with a conductive adhesive to the back side of the metal plate 2 where the small through hole 5 is provided. The metal plate 3 is placed on the surface of the I, ED array 10.
A light emitting window 10 is provided corresponding to the small through hole 3 disposed in the . Prototype experiments were conducted using three different values for the diameters of the light emitting window 10 and the small through hole 3, and the results shown in the table below were obtained.
尚、下表中の◎○Δ×は良から不良へ段階的に変化する
評価である。以下の結果より、本実施例においては貫通
小孔3の直径は50μmで、発光窓10の直径は70μ
mとして良好な印字を得た。ただし、表中め○印等の組
合せを用いて行ってもよい。Note that ◎○Δ× in the table below is an evaluation that changes stepwise from good to poor. From the results below, in this example, the diameter of the small through hole 3 is 50 μm, and the diameter of the light emitting window 10 is 70 μm.
Good printing was obtained as m. However, combinations such as those marked with ○ in the table may be used.
金属板3に固着されたL]18Dアレイ1は裏面側より
ダイシングされ電気的に各発光素子を分離するが、この
ときダイシング溝8は少なくとも9層7まで達している
必要があり、本実施例では該ダイシング溝8は導電性接
着剤層14まで達するよう形成している。これによって
、隣接間の漏洩光の発生を防止できる。場合によっては
、該ダイシング溝8が金属板2の一部に達するようにし
てもよい。このように発光素子毎に分離されたLEDア
レイ1及び金属板2は回路基板11に載置固着される。The L]18D array 1 fixed to the metal plate 3 is diced from the back side to electrically separate each light emitting element, but at this time, the dicing grooves 8 must reach at least nine layers 7. Here, the dicing groove 8 is formed to reach the conductive adhesive layer 14. This makes it possible to prevent leakage of light between adjacent devices. In some cases, the dicing groove 8 may reach a part of the metal plate 2. The LED array 1 and metal plate 2 separated into light emitting elements in this way are placed and fixed on the circuit board 11.
回路基板11は、金属より成る放熱板4上に熱伝達率が
良好な絶縁層12が形成され、該絶縁層12上に配線パ
ターン5及びレジスト9が形成されている。配線パター
ン5は奇数番目と偶数番目が異なる方向に配設され回路
基板11の端部において信号入力電極13として外部へ
解放されている。放熱板4を構成する金属は本実施例で
は安価な材料であり加工性に富み軽量化が可能なアルミ
を用いたがアルミ合金等地の金属を用いてもよい。また
前記絶縁層12はセラミンク溶液を塗布後焼結形成した
ものであり、他には若干放熱性は低下するがエポキシ樹
脂を含浸させたガラス織布を貼付してもよい。LEDア
レイ1のn矛電極が前記配線パターン5に導電性接着剤
゛15によって固着されており、この工程は光プリンタ
ヘッド内の全てのLEDアレイを一括して行うため、従
来のワイヤボンディングによる実装に比べて短時間で完
了することができる。また金属板2は凸状に湾曲形成さ
れ回路基板11のレジスト9上に接着剤で固定しLED
アレイ1を気密封止する構造となる。これにより、電子
写真プロセスより発生するトナー粉等による汚染から保
護している。In the circuit board 11, an insulating layer 12 having a good heat transfer coefficient is formed on a heat sink 4 made of metal, and a wiring pattern 5 and a resist 9 are formed on the insulating layer 12. The odd-numbered wiring patterns 5 and the even-numbered wiring patterns 5 are arranged in different directions, and are exposed to the outside as signal input electrodes 13 at the ends of the circuit board 11. In this embodiment, aluminum is used as the metal constituting the heat dissipation plate 4, which is an inexpensive material, has good workability, and can be made lightweight, but other metals such as aluminum alloys may also be used. Further, the insulating layer 12 is formed by applying a ceramic solution and then sintering it. Alternatively, a glass woven cloth impregnated with an epoxy resin may be attached, although the heat dissipation property will be slightly lowered. The n-shaped electrodes of the LED array 1 are fixed to the wiring pattern 5 with a conductive adhesive 15, and since this process is performed for all the LED arrays in the optical printer head at once, mounting using conventional wire bonding is not possible. It can be completed in a shorter time compared to Further, the metal plate 2 is curved into a convex shape and fixed on the resist 9 of the circuit board 11 with adhesive.
The structure is such that the array 1 is hermetically sealed. This protects it from contamination by toner powder and the like generated during the electrophotographic process.
さらに、発光時のLEDアレイの発熱は発光部である9
層7で生ずるもので、本発明の構造によれは該9層7が
放熱部材を兼ねる金属板2に最短距離で密接固着される
ためLEDアレイの発熱を効率良く放熱できるという従
来にはない特有の効果を有する。上記により構成された
後、外部のLEDアレイ駆動回路からの駆動信号を信号
入力電極16へ配線し入力するとともに、金属板2を共
通電極として配線することにより、LEDアレイを発光
させるのである。Furthermore, the heat generated by the LED array when emitting light is generated by the light emitting part 9
This occurs in the layer 7, and according to the structure of the present invention, the nine layers 7 are closely fixed to the metal plate 2, which also serves as a heat dissipation member, at the shortest distance, so that the heat generated by the LED array can be efficiently dissipated, which is a unique feature not seen in the past. It has the effect of After the above configuration is completed, a drive signal from an external LED array drive circuit is wired and inputted to the signal input electrode 16, and the metal plate 2 is wired as a common electrode, thereby causing the LED array to emit light.
以上のように構成された光プリンタヘッドを感光体に接
触もしくは近接して配置することにより光学系を必要と
しない光書き込み装置を構成することが可能となる。By arranging the optical printer head configured as described above in contact with or close to the photoreceptor, it is possible to configure an optical writing device that does not require an optical system.
(実施例2)
第4図は本実施例による光プリンタヘッドの要部断面を
示した斜視図であり、貫通小孔3は第5図(b)に示さ
れるように、600μmの間隔を開けて二列に170μ
mの間隔で千鳥状に配置されている。該貫通小孔3が配
設されている金属板2の裏面側には、第1の実施例と同
様にLEDアレイ1が二列状を成すよう導電性接着剤に
よって固着されているが、第1の実施例と異なる点はL
EDアレイ1が金属板2に固着される前にダイシング溝
8が9層7まで達するように形成されているのである。(Example 2) FIG. 4 is a perspective view showing a cross section of the main part of the optical printer head according to this example, and the through holes 3 are spaced at intervals of 600 μm as shown in FIG. 5(b). 170μ in two rows
They are arranged in a staggered manner at intervals of m. On the back side of the metal plate 2 where the small through holes 3 are arranged, the LED arrays 1 are fixed with a conductive adhesive so as to form two rows as in the first embodiment. The difference from Embodiment 1 is L.
The dicing grooves 8 are formed to reach nine layers 7 before the ED array 1 is fixed to the metal plate 2.
このときの該発光窓10及び貫通小孔6の直径について
、第1の実施例と同様に試作実験を行い下表に示す結果
を得た。Regarding the diameters of the light emitting window 10 and the small through hole 6 at this time, a trial production experiment was conducted in the same manner as in the first example, and the results shown in the table below were obtained.
尚、上記表中の◎○Δ×は良から不良へ段階的に変化す
る評価である。以上の結果より、本実施例においては貫
通小孔乙の直径は50μmで、発光窓10の直径は70
μmとして良好な印字を碍た。ただし、表中の○印等の
組合せを用いて行ってもよい。金属板乙に固着されたL
EDアレイjIEは一括して回路基板11に載置固着さ
れる。回路基板11上の配線パターン5は、LKDアレ
イ1の発光窓10と同一の間隔で配設され回路基板11
の端部において信号入力電極13として外部に開放され
ている。In addition, ◎○Δ× in the above table is an evaluation that changes stepwise from good to poor. From the above results, in this example, the diameter of the through hole B is 50 μm, and the diameter of the light emitting window 10 is 70 μm.
Good printing was achieved in μm. However, combinations such as those marked with ○ in the table may also be used. L fixed to metal plate O
The ED array jIE is placed and fixed on the circuit board 11 all at once. The wiring patterns 5 on the circuit board 11 are arranged at the same intervals as the light emitting windows 10 of the LKD array 1.
The end portion of the electrode is opened to the outside as a signal input electrode 13.
(実施例3)
第5図は本実施例による光プリンタヘッドの要部断面を
示した斜視図である。前記第2の実施例において、略凸
状の金属板2と回路基板110間に形成される空間内に
LEDIDアレイびLEDアレイ駆動素子16を実装し
たものである。該I、KDアレイ駆動素子16の電極上
にバンプが形成されておりLEDIDアレイ同様に導電
性接着剤によって配線パターンに固着されている。逆に
、配線パターン側にペデスタルを設けて実装してもよい
。このように同一基板上にLEDIDアレイLEDアレ
イ駆動素子16を実装しているため第2の実施例に比べ
て信号入力電極130本数を極端に減少させることが可
能となり、信号入力電極15への配線作業を容易に行う
ことができる。(Embodiment 3) FIG. 5 is a perspective view showing a cross section of a main part of an optical printer head according to this embodiment. In the second embodiment, the LED ID array and the LED array drive element 16 are mounted in the space formed between the substantially convex metal plate 2 and the circuit board 110. Bumps are formed on the electrodes of the I and KD array drive elements 16, and are fixed to the wiring pattern with a conductive adhesive like the LED ID array. Conversely, a pedestal may be provided on the wiring pattern side for mounting. Since the LED array drive element 16 is mounted on the same substrate in this way, it is possible to drastically reduce the number of signal input electrodes 130 compared to the second embodiment, and the wiring to the signal input electrodes 15 can be significantly reduced. Work can be done easily.
[発明の効果コ
本発明の光プリンタヘッドによれば、光学系を必要とし
ないで高品位印字が可能な光プリンタへラドを容易に提
供できる。また、LIDアレイの発熱部が最短距離で放
熱部材に固着されているので効率的な放熱が可能となり
特別な放熱装置を必要としないので光プリンタヘッドを
小型化できるという特有の効果を有する。[Effects of the Invention] According to the optical printer head of the present invention, it is possible to easily provide rad to an optical printer capable of high-quality printing without requiring an optical system. Furthermore, since the heat generating part of the LID array is fixed to the heat dissipating member at the shortest distance, efficient heat dissipation is possible, and since a special heat dissipation device is not required, the optical printer head can be miniaturized, which is a unique effect.
第1図は本発明による光プリンタヘッドの要部断面を示
した斜視図、第2図はA−A’における断面図である。
第6図(α)(b)は本発明における貫通小孔の配列例
を示す図である。
第4図は本発明の第2の実施例による光プリンタヘッド
の要部断面を示した斜視図である。
第5図は本発明の第5の実施例による光プリンタヘッド
の要部断面を示した斜視図である。
第6図は従来の光プリンタヘッドの要部断面を示した斜
視図である。
1・・・・・・・・・LEDIDア
レイ・・・・・・・・金属板
3・・・・・・・・・貫通小孔
4・・・・・・・・放熱板
10・・・・・・・・・発光窓
11・・・・・・・・・回路基板
16・・・・・・・・・LEDアレイ駆動素子以上FIG. 1 is a perspective view showing a cross section of a main part of an optical printer head according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA'. FIGS. 6(α) and 6(b) are diagrams showing examples of arrangement of small through holes in the present invention. FIG. 4 is a perspective view showing a cross section of a main part of an optical printer head according to a second embodiment of the present invention. FIG. 5 is a perspective view showing a cross section of a main part of an optical printer head according to a fifth embodiment of the present invention. FIG. 6 is a perspective view showing a cross section of a main part of a conventional optical printer head. 1......LED ID array...Metal plate 3......Through small hole 4...Heat sink plate 10... ......Light emitting window 11......Circuit board 16......LED array drive element or more
Claims (1)
とし感光体を露光して印字を行う光プリンタヘッドにお
いて、 多数の貫通小孔を有する金属板にLEDアレイの発光面
を固着接続させ、絶縁板上に形成された配線パターンと
該LEDアレイを固着接続し、該金属板をLEDアレイ
の共通電極としたことを特徴とする光プリンタヘッド。[Claims] In an optical printer head that uses a light emitting diode array (hereinafter referred to as an LED array) as a light source and prints by exposing a photoreceptor to light, the light emitting surface of the LED array is fixed to a metal plate having a large number of through holes. An optical printer head characterized in that the LED array is fixedly connected to a wiring pattern formed on an insulating plate, and the metal plate is used as a common electrode of the LED array.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63207672A JPH0255159A (en) | 1988-08-22 | 1988-08-22 | Optical printer head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63207672A JPH0255159A (en) | 1988-08-22 | 1988-08-22 | Optical printer head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0255159A true JPH0255159A (en) | 1990-02-23 |
Family
ID=16543653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63207672A Pending JPH0255159A (en) | 1988-08-22 | 1988-08-22 | Optical printer head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0255159A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19528459A1 (en) * | 1995-08-03 | 1997-02-13 | Garufo Gmbh | LED display apparatus with carrier plate - has heat carrier plates connected to transfer heat from carrier plate to heat dissipation surface |
-
1988
- 1988-08-22 JP JP63207672A patent/JPH0255159A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19528459A1 (en) * | 1995-08-03 | 1997-02-13 | Garufo Gmbh | LED display apparatus with carrier plate - has heat carrier plates connected to transfer heat from carrier plate to heat dissipation surface |
DE19528459C2 (en) * | 1995-08-03 | 2001-08-23 | Garufo Gmbh | Cooling for a light unit equipped with LEDs |
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