JPH0255107A - Method for dividing ceramic substrate - Google Patents
Method for dividing ceramic substrateInfo
- Publication number
- JPH0255107A JPH0255107A JP20702988A JP20702988A JPH0255107A JP H0255107 A JPH0255107 A JP H0255107A JP 20702988 A JP20702988 A JP 20702988A JP 20702988 A JP20702988 A JP 20702988A JP H0255107 A JPH0255107 A JP H0255107A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- dividing
- elasticity
- receiving stand
- edge part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チップ部品の領域に区画する分割用溝が設け
られたセラミック基板の分割方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for dividing a ceramic substrate provided with dividing grooves that define regions of chip components.
従来の技術
従来、この種のセラミック基板は、次に述べるような分
割方法であった。BACKGROUND OF THE INVENTION Conventionally, this type of ceramic substrate has been divided by the following method.
第２図は、従来の分割方法を示した図であり、１はエツ
ジ部１ａを有する受け台、２は分割駆動治具、３はセラ
ミック基板支持体、４はセラミック基板、５は抗折加重
の方向である。第３図は分割しようとするセラミック基
板４であり、６は分割用溝である。第４図は、従来のセ
ラミック基板の分割方法での力の作用を示した図で、Ａ
点がセラミック基板４に分割する力が作用する支点とな
る。第５図はセラミック基板の分割後の状態を示した図
で、４′は分割後の短冊状セラミック基板である。受け
台１とセラミック基板支持体３とのすき間に第３図に示
すようなセラミック基板４を分割用溝６が、分割の支点
となる受け台１のエツジ部１乙に沿った状態で、分割駆
動治具２で抗折加重６を加え、第４図のような力の作用
で第５図の示すような短冊状に分割するセラミック基板
の分割方法であった。FIG. 2 is a diagram showing a conventional dividing method, in which 1 is a pedestal having an edge portion 1a, 2 is a dividing drive jig, 3 is a ceramic substrate support, 4 is a ceramic substrate, and 5 is a bending load. The direction is FIG. 3 shows a ceramic substrate 4 to be divided, and 6 is a dividing groove. Figure 4 is a diagram showing the effect of force in the conventional method of dividing ceramic substrates.
The point becomes a fulcrum on which the force that divides the ceramic substrate 4 acts. FIG. 5 is a diagram showing the state of the ceramic substrate after being divided, and 4' is the rectangular ceramic substrate after being divided. The ceramic substrate 4 as shown in FIG. 3 is divided into the gap between the pedestal 1 and the ceramic substrate support 3 with the dividing groove 6 along the edge part 1B of the pedestal 1, which is the fulcrum of the division. This was a method of dividing a ceramic substrate in which a transverse bending load 6 was applied by a driving jig 2, and the force as shown in FIG. 4 was applied to divide the ceramic substrate into strips as shown in FIG.
発明が解決しようとする課題
上述の従来のセラミック基板の分割方法では、次に述べ
るような課題があった。Problems to be Solved by the Invention The conventional ceramic substrate dividing method described above has the following problems.
第６図は、従来の分割方法にて発生した短冊状セラミッ
ク基板４′の縦方向割れを示した図であリ、第７図は、
従来の分割方法にて発生したパリを有した短冊状セラミ
ック基板４′である。従来のセラミック基板の分割方法
では分割の瞬間に、セラミック基板と、支点となる受け
台のエツジ部と接する面積が、セラミック基板の反り等
のために極めて小さくなり、分割時に発生する反力を集
中して受けてしまうため、第６図に示すように短冊状セ
ラミック基板４′が縦方向溝に沿って割れてしまう不良
（以降、縦割れと略称する。）が発生したり、第７図に
示すように短冊状セラミック基板４′の反力が集中した
部分にバリアが発生し、以降の工程でパリのために不具
合が生じたり、品質の悪い製品が完成されてしまうとい
う欠点を有していた。また、セラミック基板の分割用溝
深さの規格が狭い範囲でしか使用できずセラミック基板
の確保が難しいという課題があった。FIG. 6 is a diagram showing longitudinal cracks in the strip-shaped ceramic substrate 4' caused by the conventional dividing method, and FIG.
This is a rectangular ceramic substrate 4' having cracks generated by a conventional dividing method. In the conventional method of dividing ceramic substrates, at the moment of division, the area of contact between the ceramic substrate and the edge of the pedestal, which serves as a fulcrum, becomes extremely small due to warpage of the ceramic substrate, etc., and the reaction force generated at the time of division is concentrated. As a result, as shown in Fig. 6, defects such as the strip-shaped ceramic substrate 4' cracking along the vertical grooves (hereinafter abbreviated as vertical cracking) may occur, or as shown in Fig. 7. As shown, a barrier is generated in the part of the rectangular ceramic substrate 4' where the reaction force is concentrated, and this has the disadvantage that defects may occur in subsequent processes due to the barrier, or a product of poor quality may be completed. Ta. Additionally, the standard for the depth of the groove for dividing ceramic substrates can only be used within a narrow range, making it difficult to secure ceramic substrates.
本発明は、分割性を向上させることにより、短冊状セラ
ミック基板の縦割れ不良やパリを大幅に減少させ、歩留
りの向上と製品の品質レベルを向上させ、またセラミッ
ク基板の分割用溝深さの対応できる規格範囲を広げ、セ
ラミンク基板の確保を容易にすることを目的とする。The present invention significantly reduces vertical cracking defects and cracks in strip-shaped ceramic substrates by improving splitting properties, improves yield and product quality level, and also reduces the depth of grooves for dividing ceramic substrates. The purpose is to expand the range of applicable standards and make it easier to secure ceramic substrates.
課題を解決するための手段
本発明は、受け台のエツジ部に弾性を有した部材を貼布
し、または弾性を有した部材あるいはばねを受け台の内
部に設けて受け台のエツジ部に弾性を持たせ、そのエツ
ジ部を支点とし、セラミック基板を分割することにより
、以上の課題を解決するものである。Means for Solving the Problems The present invention provides elasticity on the edges of the cradle by pasting an elastic member on the edge of the pedestal, or by providing an elastic member or spring inside the cradle. The above problems are solved by dividing the ceramic substrate using the edge portion as a fulcrum.
作用
以上の手段によシ、分割する瞬間にセラミック基板と支
点となる受け台のエツジ部との接する面積が大きくなり
、分割時に発生する反力を分散させ、または吸収する作
用が働き、反力が集中して発生する縦割れ不良とパリを
低減させる等、分割性の向上を図ることが可能となる。By means of more effective means, at the moment of splitting, the contact area between the ceramic substrate and the edge of the pedestal that serves as a fulcrum increases, which works to disperse or absorb the reaction force generated at the time of splitting, and the reaction force is reduced. It is possible to improve the divisibility by reducing vertical crack defects and cracks that occur in a concentrated manner.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は、本発明によるセラミック基板の分割方法を示
した図であり、第２図と同一部分については同一番号を
付している。８は弾性を有した部材である。第１図に示
すように、材質が超硬である受け台１の表面忙弾性を有
した部材８（本実施例では、約０．１１ＪＩのテープの
上にＯ−０５１ＲＭの紙を貼布したものを使用）を貼布
し、板厚的０．５ｆｌのセラミック基板４の分割用溝６
が、支点となる受け台１のエツジ部１ａに浴った状態で
、抗折加重６を加えてセラミック基板４０分割を行う。FIG. 1 is a diagram showing a method of dividing a ceramic substrate according to the present invention, and the same parts as in FIG. 2 are given the same numbers. 8 is a member having elasticity. As shown in FIG. 1, a member 8 having surface elasticity of a cradle 1 made of carbide (in this example, O-051RM paper was pasted on a tape of about 0.11 JI). (using a material) and the dividing groove 6 of the ceramic substrate 4 with a board thickness of 0.5 fl.
is applied to the edge portion 1a of the pedestal 1, which serves as a fulcrum, and a bending load 6 is applied to divide the ceramic substrate into 40 parts.
この分割方法で、実際に次のような実験を行った。１シ
ートチップ部品１２ｏＯ個取り数のある同一ロットのセ
ラＳ’）り基板を、従来の分割方法と本発明の実施例の
分割方法で、各２５０シートづつ分割を行い、縦割れ不
良の発生率と、短冊状セラミック基板をｎ＝１００本づ
つ抜き取りパリ寸法を測定したところ、結果は以Ｆの通
りであった。縦割れ不良発生率は、従来の分割方法が１
．２％１本発明による分割方法が０．５％と半減した。Using this division method, we actually conducted the following experiment. The same lot of ceramic S') substrates with 1200 chip parts per sheet were divided into 250 sheets each using the conventional dividing method and the dividing method of the embodiment of the present invention, and the incidence of vertical crack defects was determined. When n = 100 strip-shaped ceramic substrates were extracted and the Paris dimension was measured, the results were as shown in F below. The conventional dividing method has a vertical crack failure rate of 1.
．． 2%1 The splitting method according to the present invention reduced it by half to 0.5%.
パリ寸法測定結果は、従来の分割方法がＸ ＝ ０．０
４ ｊｆｆｉ。The Paris dimension measurement result is that the conventional dividing method is X = 0.0
4 jffi.
σ＝ ０．０１２ ｎ、本発明による分割方法がＸｏ、
０１ ＩｌＭ、 σ＝Ｏ５ＯＯ３ｚｘｔと大幅に良化
した。以−トのことより、本発明により大幅な分割性の
向上が図れることが確認できた。σ = 0.012 n, the division method according to the present invention is Xo,
01 ILM, σ=O5OO3zxt, which was significantly improved. From the above, it was confirmed that the present invention can significantly improve the divisibility.
発明の効果
以上のように本発明によれば、分割性の大幅向上が図れ
、縦割れ不良率の低減、分割寸法形状の良化を図れるこ
とが可能となり、高品質の製品が確実に得られ、更に５
セラミツク基板の分割用溝深さ規格を広く設定すること
が可能となり、セラミック基板の確保が容易になるとい
った効果が得られることになる。Effects of the Invention As described above, according to the present invention, it is possible to significantly improve the splitting properties, reduce the vertical crack defect rate, and improve the split size and shape, thereby ensuring that high-quality products are obtained. , and 5 more
It becomes possible to set a wide standard for the depth of the groove for dividing the ceramic substrate, and it is possible to obtain the effect that it becomes easier to secure the ceramic substrate.
第１図は本発明によるセラミック基板の分割方法の一実
施例を示す概略構成図、第２図は従来のセラミック基板
の分割方法を示す概略構成図、第３図はセラミック基板
の平面図、第４図は従来のセラミック基板の分割方法の
力の作用を示した説明図、第５図は短冊状セラミック基
板を示した平面図、第６図は縦割れ不良を示した平面図
、第７図はパリを有した短冊状セラミック基板を示した
平面図である。
１・・・・・受け台、２・・・・・・分割駆動治具、３
・・・・・・セラミック基板支持体、４・・・・・・セ
ラミック板基、６・・・・・・抵抗加重の方向、８・・
・・・弾性を有した部材。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名図
／
ノー−一受ワ自FIG. 1 is a schematic diagram showing an embodiment of the ceramic substrate dividing method according to the present invention, FIG. 2 is a schematic diagram showing a conventional ceramic substrate dividing method, and FIG. 3 is a plan view of the ceramic substrate. Figure 4 is an explanatory diagram showing the effect of force in the conventional ceramic substrate dividing method, Figure 5 is a plan view showing a rectangular ceramic substrate, Figure 6 is a plan view showing vertical crack defects, and Figure 7. FIG. 2 is a plan view showing a rectangular ceramic substrate having a plate. 1... cradle, 2... divided drive jig, 3
... Ceramic substrate support, 4 ... Ceramic board substrate, 6 ... Direction of resistance loading, 8 ...
...An elastic member. Name of agent: Patent attorney Shigetaka Awano and 1 other person
Claims (1)
、セラミック基板を分割用溝がエッジ部に沿った状態で
載置し、エッジ部を境に受け台に載置されたセラミック
基板側を支持した状態で、他方に加重を加えてセラミッ
ク基板を分割用溝に沿って分割するセラミック基板の分
割方法。The edge of the pedestal, which serves as a fulcrum during splitting, has elasticity, and the ceramic substrate is placed with the dividing groove along the edge, and the ceramic substrate is placed on the pedestal with the edge as a boundary. A method of dividing a ceramic substrate in which one side is supported and a weight is applied to the other side to divide the ceramic substrate along dividing grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20702988A JPH0255107A (en) | 1988-08-19 | 1988-08-19 | Method for dividing ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20702988A JPH0255107A (en) | 1988-08-19 | 1988-08-19 | Method for dividing ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0255107A true JPH0255107A (en) | 1990-02-23 |
Family
ID=16533025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20702988A Pending JPH0255107A (en) | 1988-08-19 | 1988-08-19 | Method for dividing ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0255107A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011070410A1 (en) * | 2009-12-09 | 2011-06-16 | Toyota Jidosha Kabushiki Kaisha | Motor including cleft magnet and method of manufacturing the motor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756541U (en) * | 1980-09-22 | 1982-04-02 | ||
| JPS6116506B2 (en) * | 1976-12-09 | 1986-04-30 | Furanseezu De Purodeyui Puuru Katariizu Soc | |
| JPS62275708A (en) * | 1986-05-26 | 1987-11-30 | 株式会社シ−・テイ−・エム | Ceramic substrate divider |
-
1988
- 1988-08-19 JP JP20702988A patent/JPH0255107A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116506B2 (en) * | 1976-12-09 | 1986-04-30 | Furanseezu De Purodeyui Puuru Katariizu Soc | |
| JPS5756541U (en) * | 1980-09-22 | 1982-04-02 | ||
| JPS62275708A (en) * | 1986-05-26 | 1987-11-30 | 株式会社シ−・テイ−・エム | Ceramic substrate divider |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011070410A1 (en) * | 2009-12-09 | 2011-06-16 | Toyota Jidosha Kabushiki Kaisha | Motor including cleft magnet and method of manufacturing the motor |
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