JPH0254245U - - Google Patents
Info
- Publication number
- JPH0254245U JPH0254245U JP13349888U JP13349888U JPH0254245U JP H0254245 U JPH0254245 U JP H0254245U JP 13349888 U JP13349888 U JP 13349888U JP 13349888 U JP13349888 U JP 13349888U JP H0254245 U JPH0254245 U JP H0254245U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding surface
- die bonding
- lead frame
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13349888U JPH0254245U (bg) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13349888U JPH0254245U (bg) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254245U true JPH0254245U (bg) | 1990-04-19 |
Family
ID=31391413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13349888U Pending JPH0254245U (bg) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254245U (bg) |
-
1988
- 1988-10-12 JP JP13349888U patent/JPH0254245U/ja active Pending