JPH0254236U - - Google Patents
Info
- Publication number
- JPH0254236U JPH0254236U JP1988134061U JP13406188U JPH0254236U JP H0254236 U JPH0254236 U JP H0254236U JP 1988134061 U JP1988134061 U JP 1988134061U JP 13406188 U JP13406188 U JP 13406188U JP H0254236 U JPH0254236 U JP H0254236U
- Authority
- JP
- Japan
- Prior art keywords
- wedge
- bonding wire
- feeding hole
- feeding
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図Ａ，Ｂは、本考案の第１の実施例を示す
図、第２図Ａ，Ｂは、本考案の第２の実施例を示
す図、第３図Ａ，Ｂは、従来のウエツジを示す図
で、各図とも図Ａは側面図、図Ｂは図ＡのＸ―Ｘ
断面を矢視方向から見た部分斜視図である。
１，１ａ……ボンデイングワイヤー誘導溝、２
……ボンデイングワイヤー送り出し穴、３……ウ
エツジ側面。
Figures 1A and B show the first embodiment of the present invention, Figures 2A and B show the second embodiment of the invention, and Figures 3A and B show the conventional These are diagrams showing the wedge. In each figure, Figure A is a side view, and Figure B is the X-X of Figure A.
FIG. 3 is a partial perspective view of a cross section viewed from the arrow direction. 1, 1a... bonding wire guide groove, 2
...Bonding wire feed hole, 3...Wedge side.
Claims (1)
イングワイヤー送り出し穴の送り込み側のウエツ
ジ側面に沿つて、前記送り出し穴に連なるボンデ
イングワイヤー誘導溝を設けたことを特徴とする
ボンデイング装置のウエツジ。 1. A wedge for a bonding apparatus, characterized in that a bonding wire guiding groove is provided along a side surface of the wedge on the feeding side of the bonding wire feeding hole and continuous with the feeding hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134061U JPH0254236U (en) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134061U JPH0254236U (en) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254236U true JPH0254236U (en) | 1990-04-19 |
Family
ID=31392471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988134061U Pending JPH0254236U (en) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254236U (en) |
-
1988
- 1988-10-13 JP JP1988134061U patent/JPH0254236U/ja active Pending