JPH0253864U - - Google Patents
Info
- Publication number
- JPH0253864U JPH0253864U JP13396088U JP13396088U JPH0253864U JP H0253864 U JPH0253864 U JP H0253864U JP 13396088 U JP13396088 U JP 13396088U JP 13396088 U JP13396088 U JP 13396088U JP H0253864 U JPH0253864 U JP H0253864U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- soldering
- pasting
- masking material
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13396088U JPH0253864U (ko) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13396088U JPH0253864U (ko) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0253864U true JPH0253864U (ko) | 1990-04-18 |
Family
ID=31392303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13396088U Pending JPH0253864U (ko) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0253864U (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393194A (ja) * | 1986-10-07 | 1988-04-23 | 東北金属工業株式会社 | マスキングテ−プを用いた部品実装方法 |
| JPH01278795A (ja) * | 1988-04-30 | 1989-11-09 | Nec Home Electron Ltd | プリント基板のマスキング方法およびマスキングテープ |
-
1988
- 1988-10-12 JP JP13396088U patent/JPH0253864U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393194A (ja) * | 1986-10-07 | 1988-04-23 | 東北金属工業株式会社 | マスキングテ−プを用いた部品実装方法 |
| JPH01278795A (ja) * | 1988-04-30 | 1989-11-09 | Nec Home Electron Ltd | プリント基板のマスキング方法およびマスキングテープ |