JPH025309A - Self-adhesive type insulated wire - Google Patents

Abstract

PURPOSE:To reduce a deterioration of the adhesive strength with the rise of temperature and to improve the flexibility of an attached membrane by spreading or baking a paint made by mixing a specific amount of an amino resin or a phenol resin to a polyhydroxy ether with a led-in sulfonic radical, or a mixture of such a polyhydroxy ether and a high polymer compound including an active OH radical, on a conductor. CONSTITUTION:To 100 pts.wt. of polyhydroxy ether with a led-in sulfonic radical, or a mixture of such a polyhydroxy ether and a high polymer compound including 3wt.% or more of active OH radical, 10 to 80 pts.wt. of amino resin or a paint made by mixing less then 50 pts.wt. of phenol resin to said amino resin is spread or baked on a conductor directly or through an insulating membrane. In this case, the mean molecular weight of the polyhydroxy ether and the high polymer compound is made 10000 or higher respectively. As the polyhydroxy ether with led-in sulfonic radical, YPS-007.A30, YPS-030.A30, or the like is available. As the high polymer compound including an active OH radical, phenoxy resin, polyvinyl acetal resin, or the like can be used.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a self-adhesive insulated wire that is used for a wide range of purposes as an electric wire for equipment coils such as telecommunications equipment, and is heat-bonded after coil winding. This product has improved heat softening resistance of Tarano.

[Conventional technology]

This type of self-adhesive insulated wire has traditionally been made using a paint made by dissolving a straight polymer compound such as polyvinyl butyral resin or phenoxy resin (including highly polymerized epoxy resin) in an appropriate solvent, and applying it to other insulating wires. Either apply and bake through a film, or add to these resins from among epoxy resins, amine resins, stabilized isocyanate resins, etc.
A paint made by appropriately mixing and blending some of these is coated and baked through another insulating film as described above.

[Problem to be solved by the invention]

Among these, when applying and baking a paint made only of the linear compound silicone through a metal insulator, the baking conditions should be selected with consideration only to thermal deterioration of the resin and insulating film. , since it is possible to bake the adhesive film under the same conditions at the time of baking the insulating film and Ii1, the baking workability is improved, but on the other hand,
The adhesive strength after winding and bonding around a coil deteriorates significantly as the adhesive film softens as the temperature inside the device increases, resulting in deformation of the coil.

In order to improve these drawbacks, a paint made by blending the above-mentioned linear polymer compound singly or in appropriate combinations of epoxy resins, amino resins, stabilized isocyanate resins, etc., is used to form other insulating coatings. However, even in this case, the glass transition temperature (1 g) of the linear polymer compound is low at around 70 to 110°C, so even if epoxy resin, amine resin, or stabilized isocyanate is used, Even with crosslinking, it was not possible to satisfactorily solve the problem that the adhesive force after being wound around a coil and bonded decreased significantly as the temperature rose.

In order to solve this problem, polyhydroxy ethers having introduced sulfone groups have recently been used in place of the above-mentioned linear polymer compounds. This polyhydroxyether into which a sulfone group has been introduced has a glass transfer) j iff of 1
Since it has good heat resistance of 00 to 150℃, it can suppress the decrease in adhesive strength after winding and bonding due to temperature rise.The flexibility of the adhesive film at 8 degrees (semi-cured state) is poor. ,
It had drawbacks such as poor bendability when used as an insulated wire.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a self-adhesive insulated wire that exhibits a slight decrease in adhesive strength after the wire is attached to the wire and has good flexibility and bendability.

[Means to solve the problem]

In the present invention, a mixture of polyhydroxyether into which a sulfone group having an average molecular weight of 10,000 or more and a polymer compound having an average molecular weight of 10,000 or more and containing a sticky OH group of 3 or more percent is used. For the department,
The solution was to apply and bake a paint containing 10 to 80 parts by weight of amine resin or 50 parts by weight or less of phenol resin onto the conductor directly or through an insulating film.

The present invention will be explained in detail below.

The polyhydroxyether having a sulfone group and having an average molecular m of 10,000 or more used in the present invention is represented by the following general formula.

Or, H and R1 is ○ In the formula, A is , R2 is or , B is ○R2 H3 , and J, m, and n are J≧Q, m≧1゜n≧
It is an integer of 1. ) The average molecular weight of this polyhydroxyether is 1oooo
The above setting was made in order to obtain sufficient heat resistance, and 10
000) 1 is disadvantageous because the adhesive strength decreases greatly due to temperature changes. Such an average molecule m 10
A specific example of a polyhydroxy ether with 000 or more sulfone groups introduced is YPS-007^30.
, YPS-030Δ30 (Tobu Kasei Co., Ltd., trade name).

In addition, if the average molecular weight is ioooo or more and the active OH group is 3
Examples of polymeric compounds containing 71% or more include 71noxy resin (corhydrin bisphenol △ condensate)
, polyvinyl acetal resins such as polyvinyl polymer resin and polyvinyl butyral resin. Here, the reason why the average molecular weight is set to 10,000 or more is to obtain sufficient flexibility, and the content of active 0f-1 groups is set to 3% or more to obtain sufficient heat resistance. It's for a reason.

Specific examples of this polymer compound include Ebiko 1 to 0f.
-53-all-35, 1255-11X-30 (product name of Yuka Shell Epoxy Co., Ltd.), PKIIC, PKII
II, PKIIJ (product name of UCC company), YP
-50, YP-50EK35, YP-50C3
25B, YP608C25 (Tokuto Kaseisha, product name)
.

Denka Butyral 12000-L, 13000-1
.

Zeng 3000-2, 13000-4, $3
000-, cloud 4000-1.

No. 4000-2, Hot 5000-A, 16000-
C, Denka Formal 201 No. 30. Book 100.12
00 (Deki Kagaku Kogyo brand name), etc. are exemplified.

Furthermore, among polymer compounds having an average molecular weight of 10,000 or more and containing 3% by weight or more of active OH groups, those having a branched structure and having a specific viscosity (at 25°C) of 0.44
Particular preference is given to using the following: By using a polymer compound having such a branched structure and having a reduced viscosity of 0.44 or less, the flexibility of the baked coating film is improved without impairing the heat resistance, which is preferable. - A specific example of a polymer compound that satisfies this condition is YP-40ASH40 (
Tobu Kasei Co., Ltd., product name), etc.

In addition, as the amino resin, urea formaldehyde condensate, melamine formaldehyde condensate, acetoguanamine formaldehyde condensate, aniline formaldehyde condensate, benzoguanamine formaldehyde condensate, or alcohol-denatured products of these are used.
For example, knee pants 1ts-Go, 1OR, 20SB,
20SE-60, 20H8, 218ν.

211t, 22R, 22R-60, 120, 122
,220,134°435, 136.6OR,62,
69-1,163,164,165゜805, 91-
55. Cymel 300. 301. 303. 325
゜350, 370.1116.1130. , 1123
．． 1125. UFR65 (San1 + Toatsu Kagakusha trade name), Beckamin P-138.

P-196-H, G-1800, G-1850, Super Beckamine 00-1. -131-60, ! , -8
06, J-820-60, L-109-65, L-11
7-00,1,-127-60,G-821-60,L
-101-60,L-110-60,,17-508-
60,L-146-70,L-118-60,1,-1
21-60゜L-120-60, TO-139, 17-
590, L-105-60, TO-126゜P-198
(Product name of Nippon Ink Co., Ltd.) etc. are exemplified.

Furthermore, phenolic resins include phenols such as phenol, cresol, xylenol, isopropylphenol, and resorcinol, as well as formaldehyde and alumina 1-
Used are aldehydes, condensates with aldehydes such as furfural, and phenolic resins such as P-vinylphenol. An example of this phenolic resin is CKH-1
634, 1636, 1737, 1282, 904, 90
7,908,983,2400,941,2103゜2
432, 5254. BKM-2620, BRP-59
04, CRH-0909, B to S-2600, 2710
C, 2750, 307, 316, 355, CKS-71
0, 813-2030, 3574, 3122, 362,
356, 3135° CLS-3940, 3950, BH
3-324, 621, BLL-3085, 8RL-11
3, 114, 116, 117, 134, 274, 285
4゜112^, 120Z (Showa Union Gosei Co., Ltd., trade name), Briophen 5010.5030. TO-4
47 (Dainippon Ink & Chemicals Co., Ltd. trade name).

Regarding the formulation of these resins, the average molecular weight is 10
Polyhydroxyether into which 000 or more sulfone groups have been introduced and the average molecule 1 is i oo.

When used in combination with a polymer compound containing 0 or more active OH groups and 3% by weight or more, the blending ratio is not particularly limited, and the adhesion temperature conditions of the resulting self-adhesive insulated wire and 8
It is determined as appropriate depending on the retention rate of adhesive strength at high temperatures. Generally, when the n1 ratio of polyhydro[]xy-1-tyl into which a sulfone group having an average molecular weight of 10,000 or more is introduced is increased, the adhesion temperature can be increased and the retention rate of adhesive strength at high temperatures can be increased. and 100 of the specific polyhydroxyether or a mixture of this and the polymer compound.
The amino resin is 10 to 8 OIf per 1 part of heavy FF.
1 part, 20 or less of the phenol resin is blended. If the amino resin content is less than 10%, it becomes difficult to maintain adhesive strength at high temperatures, which leads to a decrease in heat softening resistance and heat deterioration resistance as an insulated wire. Furthermore, if the amino resin exceeds 80 degrees and the phenol resin exceeds 20 degrees, the flexibility of the adhesive coating will decrease, which is not preferable.

In addition, depending on the bonding force and adhesive heat resistance required for self-adhesive insulated electric wires, it may be necessary to not include the above-mentioned phenolic resin, and if the phenolic resin is not included, the adhesive strength and adhesive heat resistance may be slightly reduced. However, it has higher adhesive strength and adhesive heat resistance than conventional self-adhesive insulated wires.

To such a resin mixture, a right +i acid catalyst such as phosphoric acid monoalkyl ester is further added as required, and this is mixed with m-cresol, furfural, cyclobekyl ester, etc.
The self-destructive insulated wire of the present invention is obtained by coating and baking a paint dissolved in an organic solvent such as nano or methyl ethyl ketone on the conductor directly or through another insulating film.

The self-adhesive insulated wire thus obtained exhibits its function over a wide range of 4 degrees, exhibits adhesiveness relatively easily by heating after winding the coil, and exhibits almost no heat deterioration resistance.

Next, the present invention will be explained with reference to examples, but the present invention is not limited to these examples, and the composition ratio of the paint, The material can be changed.

〔Example〕

A resin mixture having the composition shown in Table 1 was dissolved in a mixed solvent of m-cresol/turben]-naphtha (1:1) to prepare a paint with a resin concentration of 20%.
m polynisdel enameled wire (insulating coating thickness 15 μm)
A self-adhesive insulated wire was obtained by coating and baking to form an adhesive film with a thickness of 10 μm.

These self-adhesive insulated wires were measured for flexibility by self-diameter winding, dielectric breakdown voltage, adhesive strength, heat-resistant adhesive strength, and appearance. The results are also shown in Table 1.

The adhesive strength was measured by winding 100 turns of self-adhesive insulated wire around a mandrel with a diameter of 5 shoes, heating it at 150°C to bond the windings together to form a helical coil, and then winding the helical coil at 9 r. I went to find the bending force.

Further, the heat-resistant adhesive strength was determined by measuring the bending force of the helical coil in an atmosphere of 90°C. Further, the resin formulations in Table 1 are expressed in terms of 1 part by weight.

〔Effect of the invention〕

In the self-adhesive insulated wire of the present invention, there is little decrease in the adhesive strength of the wound adhesive due to temperature changes, the heat resistance is improved, and the adhesive coating has good flexibility, making it easy to bend as an insulated wire. The properties are also improved. In addition, since the adhesive strength is high, it has good adhesive strength even if the thickness of the adhesive coating is made thinner than that of conventional self-adhesive insulated wires, and therefore the space factor of the coil can be increased.

Claims (2)

[Claims] (1) For 100 parts by weight of polyhydroxy ether with an average molecular weight of 10,000 or more and a sulfone group-introduced mixture, or a mixture of this and a polymer compound with an average molecular weight of 10,000 or more and containing 3% by weight or more of active OH groups, A self-adhesive insulated wire characterized in that a paint containing 10 to 80 parts by weight of a resin is applied onto a conductor directly or via an insulating film and baked. (2) With respect to 100 parts by weight of polyhydroxyether having an average molecular weight of 10,000 or more and a sulfone group introduced therein, or a mixture of this and a polymer compound having an average molecular weight of 10,000 or more and containing 3% by weight or more of active OH groups, A self-adhesive insulated wire characterized in that a paint containing 10 to 80 parts by weight of a resin and 20 parts by weight or less of a phenol resin is applied onto a conductor directly or via an insulating film and baked.