JPH0252371U - - Google Patents
Info
- Publication number
- JPH0252371U JPH0252371U JP13032688U JP13032688U JPH0252371U JP H0252371 U JPH0252371 U JP H0252371U JP 13032688 U JP13032688 U JP 13032688U JP 13032688 U JP13032688 U JP 13032688U JP H0252371 U JPH0252371 U JP H0252371U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- printed wiring
- separation
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13032688U JPH0252371U (cs) | 1988-10-05 | 1988-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13032688U JPH0252371U (cs) | 1988-10-05 | 1988-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252371U true JPH0252371U (cs) | 1990-04-16 |
Family
ID=31385397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13032688U Pending JPH0252371U (cs) | 1988-10-05 | 1988-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252371U (cs) |
-
1988
- 1988-10-05 JP JP13032688U patent/JPH0252371U/ja active Pending