JPH0252350U - - Google Patents
Info
- Publication number
- JPH0252350U JPH0252350U JP1988129712U JP12971288U JPH0252350U JP H0252350 U JPH0252350 U JP H0252350U JP 1988129712 U JP1988129712 U JP 1988129712U JP 12971288 U JP12971288 U JP 12971288U JP H0252350 U JPH0252350 U JP H0252350U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- adhesive layer
- separator
- thermally conductive
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988129712U JPH0252350U (US06168776-20010102-C00041.png) | 1988-10-03 | 1988-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988129712U JPH0252350U (US06168776-20010102-C00041.png) | 1988-10-03 | 1988-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252350U true JPH0252350U (US06168776-20010102-C00041.png) | 1990-04-16 |
Family
ID=31384241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988129712U Pending JPH0252350U (US06168776-20010102-C00041.png) | 1988-10-03 | 1988-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252350U (US06168776-20010102-C00041.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157244A (ja) * | 1984-11-10 | 1985-08-17 | Denki Kagaku Kogyo Kk | 粘着剤付絶縁放熱シ−ト |
-
1988
- 1988-10-03 JP JP1988129712U patent/JPH0252350U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157244A (ja) * | 1984-11-10 | 1985-08-17 | Denki Kagaku Kogyo Kk | 粘着剤付絶縁放熱シ−ト |
