JPH0252239U - - Google Patents
Info
- Publication number
- JPH0252239U JPH0252239U JP13044188U JP13044188U JPH0252239U JP H0252239 U JPH0252239 U JP H0252239U JP 13044188 U JP13044188 U JP 13044188U JP 13044188 U JP13044188 U JP 13044188U JP H0252239 U JPH0252239 U JP H0252239U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- contact piece
- cover
- film
- recessed part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Switch Cases, Indication, And Locking (AREA)
Description
第１図及び第２図は本考案の実施例の説明図で
、第１図は、本考案の密封構造を具備したスイツ
チのカバーの一部を破断した分解斜視図、第２図
は、同断面図、第３図は、従来例のスイツチの密
封構造を示す断面図、第４図は、スイツチに貼着
されたテープの剥離動作を示す斜視図である。
３１……ウエハー、３５……凹部、３６……可
動接片、６ａ……端子、４１……固定接片、４１
ａ……端子、４４……フイルム、４５……カバー
、６３……樹脂。
1 and 2 are explanatory diagrams of an embodiment of the present invention. FIG. 1 is an exploded perspective view with a part of the cover of a switch equipped with the sealing structure of the present invention cut away, and FIG. 2 is the same. 3 is a cross-sectional view showing the sealing structure of a conventional switch, and FIG. 4 is a perspective view showing the operation of peeling off the tape stuck to the switch. 31... Wafer, 35... Recess, 36... Movable contact piece, 6a... Terminal, 41... Fixed contact piece, 41
a...Terminal, 44...Film, 45...Cover, 63...Resin.
Claims (1)
片を一体成形し、該凹部内に可動、固定の両接片
を収納し、前記ウエハーの凹部を覆うようにフイ
ルムを被着し、ウエハーに嵌合されるカバーと前
記ウエハーとで前記フイルムの端部全周を挾持し
、ウエハーへの可動接片及び固定接片の端子イン
サート部に塗布した樹脂にてウエハーとカバーの
接合部をも接着したことを特徴とする電気部品の
密封構造。 A movable contact piece and a fixed contact piece are integrally molded on a wafer having a recessed part, both the movable and fixed contact pieces are housed in the recessed part, a film is applied so as to cover the recessed part of the wafer, and the film is fitted onto the wafer. The entire circumference of the end of the film was sandwiched between the cover to be fitted and the wafer, and the joint between the wafer and the cover was also bonded with resin applied to the terminal insert portion of the movable contact piece and the fixed contact piece to the wafer. A sealed structure for electrical components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988130441U JPH073549Y2 (en) | 1988-10-06 | 1988-10-06 | Sealing structure for electrical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988130441U JPH073549Y2 (en) | 1988-10-06 | 1988-10-06 | Sealing structure for electrical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0252239U true JPH0252239U (en) | 1990-04-16 |
| JPH073549Y2 JPH073549Y2 (en) | 1995-01-30 |
Family
ID=31385612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988130441U Expired - Lifetime JPH073549Y2 (en) | 1988-10-06 | 1988-10-06 | Sealing structure for electrical components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073549Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157023U (en) * | 1986-03-27 | 1987-10-06 |
-
1988
- 1988-10-06 JP JP1988130441U patent/JPH073549Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62157023U (en) * | 1986-03-27 | 1987-10-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073549Y2 (en) | 1995-01-30 |
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