JPH0251462B2 - - Google Patents
Info
- Publication number
- JPH0251462B2 JPH0251462B2 JP58123167A JP12316783A JPH0251462B2 JP H0251462 B2 JPH0251462 B2 JP H0251462B2 JP 58123167 A JP58123167 A JP 58123167A JP 12316783 A JP12316783 A JP 12316783A JP H0251462 B2 JPH0251462 B2 JP H0251462B2
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- polyether ester
- parts
- bis
- ester amide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 26
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- -1 aromatic amine compound Chemical class 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000004611 light stabiliser Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 8
- 239000004952 Polyamide Substances 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 150000002148 esters Chemical group 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 3
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical compound C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 2
- QUBNFZFTFXTLKH-UHFFFAOYSA-N 2-aminododecanoic acid Chemical compound CCCCCCCCCCC(N)C(O)=O QUBNFZFTFXTLKH-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- NOUUUQMKVOUUNR-UHFFFAOYSA-N n,n'-diphenylethane-1,2-diamine Chemical compound C=1C=CC=CC=1NCCNC1=CC=CC=C1 NOUUUQMKVOUUNR-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N omega-Aminododecanoic acid Natural products NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 1
- RYASAMCACXLSGO-UHFFFAOYSA-N 1-N,4-N-bis(5-methylnonan-3-yl)benzene-1,4-diamine Chemical compound C(C)C(CC(CCCC)C)NC1=CC=C(C=C1)NC(CC(CCCC)C)CC RYASAMCACXLSGO-UHFFFAOYSA-N 0.000 description 1
- ZAKIXFRHKAGELZ-UHFFFAOYSA-N 1-O-[4,4-bis(1,2,2,6,6-pentamethylpiperidin-4-yl)butyl] 3-O-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl] propanedioate Chemical compound C(CC(=O)OCC1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C)(=O)OCCCC(C1CC(N(C(C1)(C)C)C)(C)C)C1CC(N(C(C1)(C)C)C)(C)C ZAKIXFRHKAGELZ-UHFFFAOYSA-N 0.000 description 1
- JUHXTONDLXIGGK-UHFFFAOYSA-N 1-n,4-n-bis(5-methylheptan-3-yl)benzene-1,4-diamine Chemical compound CCC(C)CC(CC)NC1=CC=C(NC(CC)CC(C)CC)C=C1 JUHXTONDLXIGGK-UHFFFAOYSA-N 0.000 description 1
- ZJNLYGOUHDJHMG-UHFFFAOYSA-N 1-n,4-n-bis(5-methylhexan-2-yl)benzene-1,4-diamine Chemical compound CC(C)CCC(C)NC1=CC=C(NC(C)CCC(C)C)C=C1 ZJNLYGOUHDJHMG-UHFFFAOYSA-N 0.000 description 1
- PWNBRRGFUVBTQG-UHFFFAOYSA-N 1-n,4-n-di(propan-2-yl)benzene-1,4-diamine Chemical compound CC(C)NC1=CC=C(NC(C)C)C=C1 PWNBRRGFUVBTQG-UHFFFAOYSA-N 0.000 description 1
- DFNXHHNFURNWAF-UHFFFAOYSA-N 1-n,4-n-dioctylbenzene-1,4-diamine Chemical compound CCCCCCCCNC1=CC=C(NCCCCCCCC)C=C1 DFNXHHNFURNWAF-UHFFFAOYSA-N 0.000 description 1
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 description 1
- MINNIIWBFAPUKJ-UHFFFAOYSA-N 1-n-octyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1=CC(NCCCCCCCC)=CC=C1NC1=CC=CC=C1 MINNIIWBFAPUKJ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- VCOONNWIINSFBA-UHFFFAOYSA-N 4-methoxy-n-(4-methoxyphenyl)aniline Chemical compound C1=CC(OC)=CC=C1NC1=CC=C(OC)C=C1 VCOONNWIINSFBA-UHFFFAOYSA-N 0.000 description 1
- JQPGEGUDCVNIDL-UHFFFAOYSA-N 4-n-pentan-2-ylbenzene-1,4-diamine Chemical compound CCCC(C)NC1=CC=C(N)C=C1 JQPGEGUDCVNIDL-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- RLVKZFOXSWDGCL-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2,2-diethylpropanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(CC)(CC)C(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RLVKZFOXSWDGCL-UHFFFAOYSA-N 0.000 description 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- RSDBZQKUILQTCZ-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) 2,2-dibenzylpropanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 RSDBZQKUILQTCZ-UHFFFAOYSA-N 0.000 description 1
- CLNPPECTKJVEIM-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) 2-(3-phenylpropyl)propanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CCCC1=CC=CC=C1 CLNPPECTKJVEIM-UHFFFAOYSA-N 0.000 description 1
- IDMQTKKFMWPCMU-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) benzene-1,2-dicarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1C(=O)OC1CC(C)(C)NC(C)(C)C1 IDMQTKKFMWPCMU-UHFFFAOYSA-N 0.000 description 1
- IQDCMBZQRCNIOW-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) benzene-1,3-dicarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC(C(=O)OC2CC(C)(C)NC(C)(C)C2)=C1 IQDCMBZQRCNIOW-UHFFFAOYSA-N 0.000 description 1
- GHJBIWHWRNKOFW-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) benzene-1,4-dicarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=C(C(=O)OC2CC(C)(C)NC(C)(C)C2)C=C1 GHJBIWHWRNKOFW-UHFFFAOYSA-N 0.000 description 1
- UROGBLCMTWAODF-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) hexanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 UROGBLCMTWAODF-UHFFFAOYSA-N 0.000 description 1
- RDGCUTVALSXPHX-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) octanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 RDGCUTVALSXPHX-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- OQAUCVGWSNUAAP-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexanediamide Chemical compound C1C(C)(C)NC(C)(C)CC1NC(=O)CCCCC(=O)NC1CC(C)(C)NC(C)(C)C1 OQAUCVGWSNUAAP-UHFFFAOYSA-N 0.000 description 1
- CSFJHJLPCWAQHC-UHFFFAOYSA-N n,n'-bis(4-methylphenyl)ethane-1,2-diamine Chemical compound C1=CC(C)=CC=C1NCCNC1=CC=C(C)C=C1 CSFJHJLPCWAQHC-UHFFFAOYSA-N 0.000 description 1
- RDORKYWHCCIKAM-UHFFFAOYSA-N n,n'-diphenylhexane-1,6-diamine Chemical compound C=1C=CC=CC=1NCCCCCCNC1=CC=CC=C1 RDORKYWHCCIKAM-UHFFFAOYSA-N 0.000 description 1
- XQPCBFAEXQDCDF-UHFFFAOYSA-N n-phenyl-n-propan-2-yloxyaniline Chemical compound C=1C=CC=CC=1N(OC(C)C)C1=CC=CC=C1 XQPCBFAEXQDCDF-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- NYKHQQHUHLNYLW-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,1,1,2-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(CC)C(=O)OC1CC(C)(C)NC(C)(C)C1 NYKHQQHUHLNYLW-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、耐熱性および耐候性に優れた性能を
有するポリエーテルエステルアミド樹脂組成物に
関する。
ポリマー主鎖中にポリアミド繰返し単位、ポリ
エーテル繰返し単位およびエステル結合を有する
ポリエーテルエステルアミドは公知であり、ポリ
エーテルエステルあるいはポリエステルアミド同
様、すぐれた耐衝撃性やゴム弾性を有するためエ
ラストマー分野における新しい素材として近年注
目されている。
とりわけ、ポリエーテルエステルアミドは軽量
性、透明性、低温耐衝撃性にすぐれ、また成形時
にバリ、ヒゲ等が生じにくいため各種成型用途に
有望である。しかしポリエーテルエステルアミド
はきわめて酸化劣化を受けやすく、重合度の低下
に伴つて機械的性質の低下、表面の亀裂発生、着
色などの好ましくない現象を起こす。特にこの酸
化劣化は熱や光などによつて促進され、屋外曝露
や高温雰囲気下ではその使用は制限を受けてい
る。従つてこれらの劣化現象を防止する目的でポ
リエーテルエステルアミドに種々の安定剤を添加
することが検討されている。しかるにポリエーテ
ルエステルアミドの安定化に関しては知見も少な
く、効果的に満足できるものではなかつた。本発
明者らはこれらの点に鑑み、鋭意検討を重ねた結
果、ポリエーテルエステルアミドに対し安定剤と
して特定の化合物群を添加することによつて、従
来得ることのできなかつた耐熱性および耐候性と
もに極めて優れたポリエーテルエステルアミド樹
脂組成物が得られることを見出し、本発明に到達
した。
すなわち、本発明はポリエーテルエステルアミ
ド(A)100重量部に対し、下記一般式(B)、(C)、(D)あ
るいは(E)で示される芳香族アミン系化合物を0.05
〜5重量部および下記一般式(F)で示されるヒンダ
ードアミン系光安定剤を0.05〜5重量部の各割合
で添加してなるポリエーテルエステルアミド組成
物に関するものである。
(ただし、R1、R1′は水素原子、炭素数1〜18の
炭化水素基あるいは−O−結合を有する炭素数1
〜18の炭化水素基のいずれかであり、それぞれ同
一であつても異なつていてもよい。R2は炭素数
1〜12のアルキル基を示す。)
(ただし、R3は水素原子あるいは炭素数1〜12
のアルキル基、R4は炭素数1〜6の直鎖あるい
は枝分れ鎖アルキル基であり、R4′はR4と同様の
アルキル基であつてそれぞれ同一であつても異な
つていてもよい。Xは−O−あるいは
H
−N−
でありR5は水酸基で置換されていても
よい、炭素数1〜23の炭化水素基、あるいは−S
−、
The present invention relates to a polyetheresteramide resin composition having excellent heat resistance and weather resistance. Polyether ester amide, which has polyamide repeating units, polyether repeating units, and ester bonds in the polymer main chain, is well known, and like polyether ester or polyester amide, it has excellent impact resistance and rubber elasticity, so it is a new product in the elastomer field. It has been attracting attention as a material in recent years. In particular, polyether ester amide has excellent lightness, transparency, and low-temperature impact resistance, and is less likely to cause burrs, burrs, etc. during molding, so it is promising for various molding applications. However, polyetheresteramide is extremely susceptible to oxidative deterioration, and as the degree of polymerization decreases, undesirable phenomena such as a decrease in mechanical properties, surface cracking, and coloration occur. In particular, this oxidative deterioration is accelerated by heat, light, etc., and its use is restricted when exposed outdoors or in a high-temperature atmosphere. Therefore, in order to prevent these deterioration phenomena, it has been considered to add various stabilizers to polyetheresteramide. However, there is little knowledge regarding the stabilization of polyetheresteramide, and the effectiveness has not been satisfactory. In view of these points, the inventors of the present invention conducted extensive studies and found that by adding a specific group of compounds as stabilizers to polyether esteramide, heat resistance and weather resistance that could not be obtained conventionally were achieved. It was discovered that a polyether ester amide resin composition having extremely excellent properties can be obtained, and the present invention was achieved. That is, in the present invention, 0.05 parts by weight of an aromatic amine compound represented by the following general formula (B), (C), (D) or (E) is added to 100 parts by weight of polyether ester amide (A).
The present invention relates to a polyether ester amide composition in which a hindered amine light stabilizer represented by the following general formula (F) is added in a proportion of 0.05 to 5 parts by weight. (However, R 1 and R 1 ' are hydrogen atoms, hydrocarbon groups having 1 to 18 carbon atoms, or 1 to 1 carbon atoms having an -O- bond.
~18 hydrocarbon groups, which may be the same or different. R 2 represents an alkyl group having 1 to 12 carbon atoms. ) (However, R 3 is a hydrogen atom or has 1 to 12 carbon atoms.
an alkyl group, R 4 is a straight chain or branched alkyl group having 1 to 6 carbon atoms, and R 4 ' is the same alkyl group as R 4 , whether they are the same or different. good. X is -O- or H-N-, and R5 is a hydrocarbon group having 1 to 23 carbon atoms, which may be substituted with a hydroxyl group, or -S
-,
【式】のいずれかを有する、炭素数
1〜18の炭化水素基を示す。lは1〜4の整数で
ある。)
以下具体的に本発明の組成物について述べる。
本発明におけるポリエーテルエステルアミド(A)
とは、ポリアミド単位とポリエーテルエステル単
位とから構成され、分子鎖中にアミド結合、エー
テル結合、およびエステル結合を有する重合体で
ある。
ポリアミド単位はアミノカルボン酸、ラクタ
ム、ジカルボン酸とジアミンとの塩、あるいはジ
カルボン酸とジイソシアネートの組合わせなどか
ら誘導される。
ポリエーテルエステル単位は数平均分子量300
〜6000のポリ(アルキレンオキシド)グリコール
および炭素数4〜20のジカルボン酸から導かれ
る。ポリアミド単位とポリエーテルエステル単位
の共重合比率は重量比で大よそ5対90から95対10
である。
ポリエーテルエステルアミド(A)の重合方法は特
に限定されず公知の方法を利用することができ
る。たとえば、アミノカルボン酸、ラクタムまた
はジカルボン酸−ジアミンの塩(a)とジカルボン酸
(c)を約等モル比で反応させて両末端がカルボン酸
基のポリアミドプレポリマーをつくり、これにポ
リ(アルキレンオキシド)グリコール(b)を真空下
に反応させる方法、あるいは上記(a)、(b)、(c)の化
合物を反応槽に仕込み、水の存在下または非存在
下に高温で加圧反応させることによりカルボン酸
末端のポリアミドプレポリマーを生成させ、その
後、常圧または減圧下で重合を進める方法が知ら
れている。また、上記(a)、(b)、(c)の化合物を同時
に反応槽に仕込み溶融混合したのち高真空下で一
挙に重合をすすめる方法もあり、むしろこの方法
がポリマーの着色も少なく好ましい。
また、ポリ(アルキレンオキシド)グリコール
に約2倍モルのジカルボン酸を反応させて両末端
がカルボン酸基のプレポリマーをつくり、これと
ジカルボン酸およびジイソシアネートを不活性溶
媒中で反応させる溶液重合法によつてもよい。
本発明の組成物を構成する他の一成分である芳
香族アミン系化合物は前記一般式(B)、(C)、(D)ある
いは(E)で示される。
一般式(B)で示される化合物の例としてはフエニ
ル−α−ナフチルアミン、フエニル−β−ナフチ
ルアミンなどが挙げられる。
一般式(C)で示される化合物の例としてはN,
N′−ジフエニル−p−フエニレンジアミン、N,
N′−ジ−β−ナフチル−p−フエニレンジアミ
ン、N,N′−ビス((1−メチルブチル)−p−
フエニレンジアミン、N,N′−ビス(1−エチ
ル−3−メチルヘプチル)−p−フエニレンジア
ミン、N,N′−ビス(1−エチル−3−メチル
ペンチル)−p−フエニレンジアミン、N,N′−
ビス(1,4−ジメチルペンチル)−p−フエニ
レンジアミン、N−シクロヘキシル−N′−フエ
ニル−p−フエニレンジアミン、N−オクチル−
N′−フエニル−p−フエニレンジアミン、p−
イソプロポキシジフエニルアミン、N,N′−ジ
−イソプロピル−p−フエニレンジアミン、ジオ
クチル−p−フエニレンジアミンなどが挙げられ
る。中でも特にN,N′−ジ−β−ナフチル−p
−フエニレンジアミンが好ましい。一般式(D)で示
される化合物の例としては4,4′−ビス(4−
α,α−ジメチルベンジルフエニルアミン)、p,
p′−ジオクチルジフエニルアミン、p,p′−ジメ
トキシジフエニルアミンなどが挙げられる。中で
も特に4,4′−ビス(4−α,α−ジメチルベン
ジルジフエニルアミン)が好ましい。一般式(E)で
示される化合物の例としては、N,N′−ジフエ
ニルエチレンジアミン、N,N′−ジフエニルヘ
キサメチレンジアミン、ジ−p−トルイルエチレ
ンジアミン、ジ−p−トルイルヘキサメチレンジ
アミンなどが挙げられる。中でもN,N′−ジフ
エニルエチレンジアミンが好ましい。これらの芳
香族アミン系化合物の中でも特に4,4′−ビス
(4−α,α−ジメチルベンジルフエニルアミン)
の使用が好適である。
また、本発明の組成物を構成する他の一成分で
あるヒンダードアミン系光安定剤は前記一般式(F)
で示される。一般式(F)で示される化合物の例とし
ては、4−ベンゾイルオキシ−2,2,6,6−
テトラメチルピペリジン、ビス−(2,2,6,
6−テトラメチル−4−ピペリジニル)アジペー
ト、ビス(2,2,6,6−テトラメチル−4−
ピペリジニル)スベレート、ビス(2,2,6,
6−テトラメチル−4−ピペリジニル)セバケー
ト、ビス(2,2,6,6−テトラメチル−4−
ピペリジニル)フタレート、ビス(2,2,6,
6−テトラメチル−4−ピペリジニル)イソフタ
レート、ビス(2,2,6,6−テトラメチル−
4−ピペリジニル)テレフタレート、ビス(1,
2,2,6,6−ペンタメチル−4−ピペリジニ
ル)セバケート、N,N′−ビス(2,2,6,
6−テトラメチル−4−ピペリジニル)アジパミ
ド、ビス(1,2,2,6,6−ペンタメチル−
4−ピペリジニル)−n−ブチル(3,5−ジ第
3ブチル−4−ヒドロキシベンジル)マロネー
ト、ビス(1,2,2,6,6−ペンタメチル−
4−ピペリジニルジベンジル)マロネート、ビス
(1,2,2,6,6−ペンタメチル−4−ピペ
リジニル)ジエチルマロネート、ビス(2,2,
6,6−テトラメチル−4−ピペリジニル)ジベ
ンジルマロネート、ビス(2,2,6,6−テト
ラメチル−4−ピペリジニル)ベンジルエチルマ
ロネート、ビス(2,2,6,6−テトラメチル
−4−ピペリジニル)−n−ブチル(3,5−ジ
第3ブチル−4−ヒドロキシベンジル)マロネー
ト、ブタンテトラカルボン酸のテトラ(2,2,
6,6−テトラメチル−4−ピペリジニル)エス
テルなどが挙げられるが、なかでも特にビス
(2,2,6,6−テトラメチル−4−ピペリジ
ニル)セバケートおよびブタンテトラカルボン酸
のテトラ(2,2,6,6−テトラメチル−4−
ピペリジニル)エステルを好ましい化合物として
挙げることができる。
これら各安定剤は、ポリエーテルエステルアミ
ド(A)100重量部に対して、それぞれ0.05〜5重量
部、好ましくは0.1〜2重量部の割合で使用され
る。各安定剤の添加量がこれより少ない場合には
効果が十分発現されず、添加量がこれより多い場
合には組成物の物性に悪い影響を与え、またブル
ーミングなどの好ましくない現象も呈するように
なる。
なお、本発明のポリエーテルエステルアミド(A)
を熱酸化劣化および光酸化劣化の両方において安
定な組成物とするためにはポリエーテルエステル
アミド(A)に対し、前記一般式(B)、(C)、(D)あるいは
(E)で示される芳香族アミン系化合物および前記一
般式(F)で示されるヒンダードアミン系光安定剤の
両者を添加する必要があり、これらのうちのどち
らかが欠けた場合には、本発明の組成物と比較し
て耐熱性または耐候性があるいはそのどちらもが
大きく劣つた組成物しか得ることができない。
また、これらの各安定剤をポリエーテルエステ
ルアミドに添加する方法は、特に制限がなく、ポ
リエーテルエステルアミドの重合中、または重合
後の任意の時期に加えることができるが、特に好
ましい態様は重合後(成形前)に溶融混合する方
法である。
なお、本発明の組成物の調整に際しては目的と
する耐熱および耐候安定性を阻害しない限りにお
いて、他の一般的な添加剤、たとえば耐加水分解
改良剤、着色剤(顔料、染料)、帯電防止剤、導
電剤、結晶核剤、滑剤、充填剤、補強材、接着助
剤、可塑剤、離型剤、難燃剤などの添加剤を任意
に配合することができる。
以下、実施例によつて本発明を説明する。
なお、実施例中「部」または「%」で表示した
ものは、すべて重量比率で表わしたものである。
また、本文中および例中に示す相対粘度はオルト
クロロフエノール中25℃、0.5%濃度の条件で測
定した値であり、融点も特に断わらない限り
DSC(Perkin Elmer DSC−1B)で測定される融
解ピーク温度である。
参考例
ポリマー(A−1)の重合
アミノドデカン酸65.5部、数平均分子量が680
のポリテトラメチレンオキシドグリコール33.6部
およびテレフタル酸8.2部を“イルガノツクス”
1098(酸化防止剤)0.20部およびテトラブチルチ
タネート触媒0.05部とともにヘリカルリボン撹拌
翼を備えた反応容器に仕込み、N2パージして240
℃で40分間加熱撹拌してほぼ透明な均質溶液とし
た後、昇温および減圧プログラムに従つて270℃、
0.5mmHg以下の重合条件にもたらした。この条件
にて3時間50分重合反応せしめた。
得られたポリエーテルエステルアミド(A−
1)の融点は166℃、相対粘度は1.65であつた。
ポリマー(A−2)の重合
アミノドデカン酸43.6部、数平均分子量が1000
のポリテトラメチレンオキシドグリコール53.1部
およびテレフタル酸8.8部を出発原料として実施
例1と同様の方法によつて4時間30分重合反応せ
しめてポリマー(A−2)を得た。
得られたポリエーテルエステルアミド(A−
2)の融点は142℃、相対粘度は1.79であつた。
安定剤
実施例において使用した安定剤の構造とその略
号は次のとおりである。Indicates a hydrocarbon group having 1 to 18 carbon atoms and having any of the following formulas. l is an integer from 1 to 4. ) The composition of the present invention will be specifically described below. Polyether ester amide (A) in the present invention
is a polymer composed of polyamide units and polyether ester units and having amide bonds, ether bonds, and ester bonds in the molecular chain. The polyamide units are derived from aminocarboxylic acids, lactams, salts of dicarboxylic acids and diamines, or combinations of dicarboxylic acids and diisocyanates. Polyether ester units have a number average molecular weight of 300
~6000 poly(alkylene oxide) glycol and a dicarboxylic acid having 4 to 20 carbon atoms. The copolymerization ratio of polyamide units and polyether ester units is approximately 5:90 to 95:10 by weight.
It is. The method for polymerizing polyether ester amide (A) is not particularly limited, and any known method can be used. For example, aminocarboxylic acids, lactams or dicarboxylic acid-diamine salts (a) and dicarboxylic acids
(c) is reacted in an approximately equimolar ratio to produce a polyamide prepolymer having carboxylic acid groups at both ends, and this is reacted with poly(alkylene oxide) glycol (b) under vacuum, or (a) above. The compounds (b) and (c) are charged into a reaction tank and reacted under pressure at high temperature in the presence or absence of water to produce a carboxylic acid-terminated polyamide prepolymer, and then under normal pressure or reduced pressure. A method of proceeding with polymerization is known. There is also a method in which the compounds (a), (b), and (c) are simultaneously charged into a reaction tank, melt-mixed, and then polymerized all at once under high vacuum; this method is preferable since it causes less coloring of the polymer. In addition, we have developed a solution polymerization method in which poly(alkylene oxide) glycol is reacted with about twice the molar amount of dicarboxylic acid to create a prepolymer with carboxylic acid groups at both ends, and this is reacted with dicarboxylic acid and diisocyanate in an inert solvent. You can read it. The aromatic amine compound, which is another component constituting the composition of the present invention, is represented by the general formula (B), (C), (D) or (E). Examples of the compound represented by the general formula (B) include phenyl-α-naphthylamine and phenyl-β-naphthylamine. Examples of compounds represented by general formula (C) include N,
N'-diphenyl-p-phenylenediamine, N,
N'-di-β-naphthyl-p-phenylenediamine, N,N'-bis((1-methylbutyl)-p-
Phenylenediamine, N,N'-bis(1-ethyl-3-methylheptyl)-p-phenylenediamine, N,N'-bis(1-ethyl-3-methylpentyl)-p-phenylenediamine, N, N'-
Bis(1,4-dimethylpentyl)-p-phenylenediamine, N-cyclohexyl-N'-phenyl-p-phenylenediamine, N-octyl-
N'-phenyl-p-phenylenediamine, p-
Examples include isopropoxydiphenylamine, N,N'-di-isopropyl-p-phenylenediamine, and dioctyl-p-phenylenediamine. Especially N,N'-di-β-naphthyl-p
-Phenylene diamine is preferred. Examples of compounds represented by formula (D) include 4,4'-bis(4-
α,α-dimethylbenzylphenylamine), p,
Examples include p'-dioctyldiphenylamine and p,p'-dimethoxydiphenylamine. Among these, 4,4'-bis(4-α,α-dimethylbenzyldiphenylamine) is particularly preferred. Examples of compounds represented by general formula (E) include N,N'-diphenylethylenediamine, N,N'-diphenylhexamethylenediamine, di-p-tolylethylenediamine, di-p-tolylhexamethylenediamine, etc. can be mentioned. Among them, N,N'-diphenylethylenediamine is preferred. Among these aromatic amine compounds, 4,4'-bis(4-α,α-dimethylbenzylphenylamine)
It is preferable to use Further, the hindered amine light stabilizer, which is another component constituting the composition of the present invention, has the general formula (F).
It is indicated by. Examples of compounds represented by general formula (F) include 4-benzoyloxy-2,2,6,6-
Tetramethylpiperidine, bis-(2,2,6,
6-tetramethyl-4-piperidinyl)adipate, bis(2,2,6,6-tetramethyl-4-
piperidinyl)suberate, bis(2,2,6,
6-tetramethyl-4-piperidinyl) sebacate, bis(2,2,6,6-tetramethyl-4-
piperidinyl) phthalate, bis(2,2,6,
6-tetramethyl-4-piperidinyl)isophthalate, bis(2,2,6,6-tetramethyl-
4-piperidinyl) terephthalate, bis(1,
2,2,6,6-pentamethyl-4-piperidinyl) sebacate, N,N'-bis(2,2,6,
6-tetramethyl-4-piperidinyl)adipamide, bis(1,2,2,6,6-pentamethyl-
4-piperidinyl)-n-butyl (3,5-di-tert-butyl-4-hydroxybenzyl) malonate, bis(1,2,2,6,6-pentamethyl-
4-piperidinyldibenzyl)malonate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)diethylmalonate, bis(2,2,
6,6-tetramethyl-4-piperidinyl)dibenzylmalonate, bis(2,2,6,6-tetramethyl-4-piperidinyl)benzylethylmalonate, bis(2,2,6,6-tetramethyl -4-piperidinyl)-n-butyl (3,5-di-tert-butyl-4-hydroxybenzyl)malonate, butanetetracarboxylic acid tetra(2,2,
6,6-tetramethyl-4-piperidinyl) ester, among others, bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and butanetetracarboxylic acid tetra(2,2 ,6,6-tetramethyl-4-
(piperidinyl) esters may be mentioned as preferred compounds. Each of these stabilizers is used in an amount of 0.05 to 5 parts by weight, preferably 0.1 to 2 parts by weight, based on 100 parts by weight of the polyether ester amide (A). If the amount of each stabilizer added is less than this, the effect will not be sufficiently expressed, and if the amount added is more than this, it will have a negative effect on the physical properties of the composition and may also cause undesirable phenomena such as blooming. Become. In addition, the polyether ester amide (A) of the present invention
In order to make the composition stable against both thermal oxidative deterioration and photo-oxidative deterioration, polyether ester amide (A) is combined with the general formula (B), (C), (D) or
It is necessary to add both the aromatic amine compound represented by (E) and the hindered amine light stabilizer represented by the general formula (F), and if either of these is missing, the present invention Only compositions that are significantly inferior in heat resistance and/or weather resistance compared to the compositions described above can be obtained. The method of adding each of these stabilizers to the polyether ester amide is not particularly limited, and they can be added during the polymerization of the polyether ester amide or at any time after the polymerization, but a particularly preferred embodiment is This method involves melting and mixing after (before molding). In addition, when preparing the composition of the present invention, other common additives such as hydrolysis resistance improvers, colorants (pigments, dyes), and antistatic additives may be used as long as they do not impede the desired heat resistance and weather resistance stability. Additives such as a conductive agent, a crystal nucleating agent, a lubricant, a filler, a reinforcing material, an adhesion aid, a plasticizer, a mold release agent, and a flame retardant can be optionally added. The present invention will be explained below with reference to Examples. In the examples, all "parts" or "%" are expressed as weight ratios.
In addition, the relative viscosity shown in the text and examples is the value measured in orthochlorophenol at 25℃ and 0.5% concentration, and the melting point is also measured unless otherwise specified.
It is the melting peak temperature measured by DSC (Perkin Elmer DSC-1B). Reference example Polymerization of polymer (A-1) 65.5 parts of aminododecanoic acid, number average molecular weight 680
33.6 parts of polytetramethylene oxide glycol and 8.2 parts of terephthalic acid are added to "Irganox".
1098 (antioxidant) and 0.05 part of tetrabutyl titanate catalyst into a reaction vessel equipped with a helical ribbon stirring blade, and purged with N2 to 240
After heating and stirring at ℃ for 40 minutes to obtain an almost transparent homogeneous solution, it was heated to 270℃ and
The polymerization conditions were brought to below 0.5 mmHg. The polymerization reaction was carried out under these conditions for 3 hours and 50 minutes. The obtained polyether ester amide (A-
The melting point of 1) was 166°C, and the relative viscosity was 1.65. Polymerization of polymer (A-2) Aminododecanoic acid 43.6 parts, number average molecular weight 1000
Using 53.1 parts of polytetramethylene oxide glycol and 8.8 parts of terephthalic acid as starting materials, a polymerization reaction was carried out for 4 hours and 30 minutes in the same manner as in Example 1 to obtain a polymer (A-2). The obtained polyether ester amide (A-
The melting point of 2) was 142°C and the relative viscosity was 1.79. Stabilizer The structure and abbreviation of the stabilizer used in the examples are as follows.
【表】
実施例
ポリエーテルエステルアミド(A−1)および
(A−2)に表1に示す各安定剤を配合したのち、
(A−1)の場合は200℃、(A−2)の場合は180
℃に加熱された30mmφの押出機で溶融混練した後
ペレツト化した。このペレツトを真空乾燥した
後、ポリエーテルエステルアミドが(A−1)の
場合は200℃、ポリエーテルエステルアミドが
(A−2)の場合は180℃で加圧して厚さ0.9〜1.1
mmのプレスシートとし、JIS K−6301の3号ダン
ベル形試験片に打抜いた。耐熱性は130℃の熱風
オーブン中で試験片をエージングして調べ、破断
伸度保持率が50%となる時間を耐熱寿命とした。
耐候性は試験片をサンシヤインウエザオーメータ
ー中で光照射して調べた。サンシヤインウエザオ
ーメーターのブラツクパネル温度は63℃で、2時
間について18分間、水をスプレーした。伸度保持
率が50%となる時間と、照射表面の亀裂発生時間
の測定により耐候性を評価した。なお破断伸びの
測定はJIS K−6301に準じて行なつた。これらの
結果を表1に示す。[Table] Example After blending each stabilizer shown in Table 1 with polyether ester amide (A-1) and (A-2),
200℃ for (A-1), 180℃ for (A-2)
The mixture was melt-kneaded in a 30 mmφ extruder heated to ℃ and then pelletized. After drying this pellet in vacuum, it is pressurized at 200°C if the polyether ester amide is (A-1) or 180°C if the polyether ester amide is (A-2) to a thickness of 0.9 to 1.1 mm.
It was made into a press sheet of mm and punched into a No. 3 dumbbell-shaped test piece according to JIS K-6301. Heat resistance was investigated by aging the test piece in a hot air oven at 130°C, and the time when the elongation at break retention rate was 50% was defined as the heat resistance life.
Weather resistance was examined by irradiating the test piece with light in a sunshine weather meter. The black panel temperature of the Sunshine Weather-Ometer was 63°C and water was sprayed for 18 minutes over a 2 hour period. Weather resistance was evaluated by measuring the time at which the elongation retention rate reached 50% and the time at which cracks appeared on the irradiated surface. The elongation at break was measured in accordance with JIS K-6301. These results are shown in Table 1.
【表】
比較例
ポリエーテルエステルアミド(A−1)あるい
は(A−2)に、芳香族アミン系化合物あるいは
ヒンダードアミン系光安定剤のどちらかを配合し
たのち、前記実施例と同様にペレタイズした。こ
れらの組成物、ポリマー(A−1)およびポリマ
ー(A−2)を前記実施例と同様にして打抜き試
験片とし、各試験片について耐熱性と耐候性を評
価した結果を表2に示す。[Table] Comparative Example Polyether ester amide (A-1) or (A-2) was blended with either an aromatic amine compound or a hindered amine light stabilizer, and then pelletized in the same manner as in the previous example. These compositions, polymer (A-1) and polymer (A-2) were punched into test pieces in the same manner as in the above examples, and the heat resistance and weather resistance of each test piece were evaluated. Table 2 shows the results.
Claims (1)
対し、下記一般式(B)、(C)、(D)あるいは(E)で示され
る芳香族アミン系化合物を0.05〜5重量部および
下記一般式(F)で示されるヒンダードアミン系光安
定剤を0.05〜5重量部の各割合で添加してなるポ
リエーテルエステルアミド組成物。 (ただしR1、R1′は水素原子、炭素数1〜18の炭
化水素基あるいは−O−結合を有する炭素数1〜
18の炭化水素基のいずれかであり、それぞれ同一
であつても異なつていてもよい。R2は炭素数1
〜12のアルキル基を示す。) (ただし、R3は水素原子あるいは炭素数1〜12
のアルキル基、R4は炭素数1〜6の直鎖あるい
は枝分れ鎖アルキル基であり、R4′はR4と同様の
アルキル基であつてそれぞれ同一であつても異な
つていてもよい。Xは−O−あるいは H −N− でありR5は水酸基で置換されていても よい、炭素数1〜23の炭化水素基あるいは −S−、【式】のいずれかを有す る、炭素数1〜18の炭化水素基を示す。lは1〜
4の整数である。)[Claims] 1. 0.05 to 5 parts by weight of an aromatic amine compound represented by the following general formula (B), (C), (D) or (E) per 100 parts by weight of polyether ester amide (A). A polyether ester amide composition containing 0.05 to 5 parts by weight of a hindered amine light stabilizer represented by the following general formula (F). (However, R 1 and R 1 ' are hydrogen atoms, hydrocarbon groups having 1 to 18 carbon atoms, or carbon atoms having 1 to 18 carbon atoms and an -O- bond.
They are any of the 18 hydrocarbon groups, and may be the same or different. R 2 is carbon number 1
~12 alkyl groups. ) (However, R 3 is a hydrogen atom or has 1 to 12 carbon atoms.
an alkyl group, R 4 is a straight chain or branched alkyl group having 1 to 6 carbon atoms, and R 4 ' is the same alkyl group as R 4 , whether they are the same or different. good. X is -O- or H -N-, and R 5 is a hydrocarbon group having 1 to 23 carbon atoms, which may be substituted with a hydroxyl group, or -S-, having 1 carbon number, which has either [Formula] ~18 hydrocarbon groups are shown. l is 1~
It is an integer of 4. )
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12316783A JPS6015456A (en) | 1983-07-08 | 1983-07-08 | Polyether ester amide composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12316783A JPS6015456A (en) | 1983-07-08 | 1983-07-08 | Polyether ester amide composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6015456A JPS6015456A (en) | 1985-01-26 |
JPH0251462B2 true JPH0251462B2 (en) | 1990-11-07 |
Family
ID=14853839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12316783A Granted JPS6015456A (en) | 1983-07-08 | 1983-07-08 | Polyether ester amide composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6015456A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8517073D0 (en) * | 1985-07-05 | 1985-08-14 | Hepworth Iron Co Ltd | Pipe pipe couplings &c |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49117552A (en) * | 1973-02-22 | 1974-11-09 | ||
JPS5045032A (en) * | 1973-08-10 | 1975-04-22 | ||
JPS5059443A (en) * | 1973-09-27 | 1975-05-22 | ||
JPS5852348A (en) * | 1981-09-22 | 1983-03-28 | Hitachi Chem Co Ltd | Resin composition |
-
1983
- 1983-07-08 JP JP12316783A patent/JPS6015456A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49117552A (en) * | 1973-02-22 | 1974-11-09 | ||
JPS5045032A (en) * | 1973-08-10 | 1975-04-22 | ||
JPS5059443A (en) * | 1973-09-27 | 1975-05-22 | ||
JPS5852348A (en) * | 1981-09-22 | 1983-03-28 | Hitachi Chem Co Ltd | Resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6015456A (en) | 1985-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4731435A (en) | Elastomers | |
JPS62501365A (en) | Thermoplastic polyetherimide ester elastomer | |
US4221703A (en) | Stabilization of polymers containing poly(alkylene oxide) units | |
US20100029837A1 (en) | Copolyetherester compositions and articles made from these | |
EP3068820B1 (en) | Polyamide composition | |
JPH0146528B2 (en) | ||
EP0003809A1 (en) | Copolyetherester compositions stabilized against oxidative degradation and process for their manufacture | |
JPH0251462B2 (en) | ||
AU603393B2 (en) | Elastomers | |
GB1588526A (en) | Elastomeric copolyesteramides | |
JPH0150339B2 (en) | ||
JPH0251461B2 (en) | ||
JPH0150338B2 (en) | ||
US3850881A (en) | Stabilization of polymers containing ester linkages | |
JPH0150340B2 (en) | ||
US4711947A (en) | Translucent polyetherimide ester compositions | |
JPS6049061A (en) | Polyether ester amide composition | |
JPH03255124A (en) | Aromatic polyester-amide copolymer and its production | |
JPS5922735B2 (en) | Method for manufacturing polyester elastomer | |
JPS59207930A (en) | Polyamide elastomer | |
JPH0721109B2 (en) | Polyester elastomer composition | |
JPS63117035A (en) | Thermosplastic polyether-imide-amide | |
JP3251746B2 (en) | Polyester elastic body and method for producing the same | |
JPS62190252A (en) | Flame-retardant resin composition | |
JPH0621162B2 (en) | Hydrophilic polyamide elastomer |