JPH0250832U - - Google Patents
Info
- Publication number
- JPH0250832U JPH0250832U JP12798788U JP12798788U JPH0250832U JP H0250832 U JPH0250832 U JP H0250832U JP 12798788 U JP12798788 U JP 12798788U JP 12798788 U JP12798788 U JP 12798788U JP H0250832 U JPH0250832 U JP H0250832U
- Authority
- JP
- Japan
- Prior art keywords
- end sensor
- tape end
- mounting boss
- circuit board
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12798788U JPH0250832U (enExample) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12798788U JPH0250832U (enExample) | 1988-09-29 | 1988-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0250832U true JPH0250832U (enExample) | 1990-04-10 |
Family
ID=31380907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12798788U Pending JPH0250832U (enExample) | 1988-09-29 | 1988-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0250832U (enExample) |
-
1988
- 1988-09-29 JP JP12798788U patent/JPH0250832U/ja active Pending