JPH0249703Y2 - - Google Patents
Info
- Publication number
- JPH0249703Y2 JPH0249703Y2 JP8655785U JP8655785U JPH0249703Y2 JP H0249703 Y2 JPH0249703 Y2 JP H0249703Y2 JP 8655785 U JP8655785 U JP 8655785U JP 8655785 U JP8655785 U JP 8655785U JP H0249703 Y2 JPH0249703 Y2 JP H0249703Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- resin
- chip
- exterior case
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000011888 foil Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8655785U JPH0249703Y2 (US07847105-20101207-C00016.png) | 1985-06-07 | 1985-06-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8655785U JPH0249703Y2 (US07847105-20101207-C00016.png) | 1985-06-07 | 1985-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61203540U JPS61203540U (US07847105-20101207-C00016.png) | 1986-12-22 |
JPH0249703Y2 true JPH0249703Y2 (US07847105-20101207-C00016.png) | 1990-12-27 |
Family
ID=30637980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8655785U Expired JPH0249703Y2 (US07847105-20101207-C00016.png) | 1985-06-07 | 1985-06-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249703Y2 (US07847105-20101207-C00016.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0650698B2 (ja) * | 1987-12-09 | 1994-06-29 | 日本ケミコン株式会社 | チップ形コンデンサ |
-
1985
- 1985-06-07 JP JP8655785U patent/JPH0249703Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61203540U (US07847105-20101207-C00016.png) | 1986-12-22 |