JPH0249387B2 - HORIESUTERUJUSHINOMUDENKAIMETSUKIHOHO - Google Patents
HORIESUTERUJUSHINOMUDENKAIMETSUKIHOHOInfo
- Publication number
- JPH0249387B2 JPH0249387B2 JP23703884A JP23703884A JPH0249387B2 JP H0249387 B2 JPH0249387 B2 JP H0249387B2 JP 23703884 A JP23703884 A JP 23703884A JP 23703884 A JP23703884 A JP 23703884A JP H0249387 B2 JPH0249387 B2 JP H0249387B2
- Authority
- JP
- Japan
- Prior art keywords
- sulfuric acid
- treatment
- minutes
- water
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 52
- 238000011282 treatment Methods 0.000 claims description 25
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- 229920001225 polyester resin Polymers 0.000 claims description 20
- 239000004645 polyester resin Substances 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 18
- 125000000623 heterocyclic group Chemical group 0.000 claims description 15
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 14
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 11
- 206010070834 Sensitisation Diseases 0.000 claims description 10
- 230000008313 sensitization Effects 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 150000001845 chromium compounds Chemical class 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- 238000007747 plating Methods 0.000 description 25
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 24
- 239000007864 aqueous solution Substances 0.000 description 23
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 22
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 10
- 235000011121 sodium hydroxide Nutrition 0.000 description 9
- 238000005406 washing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- -1 polybutylene terephthalate Polymers 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000001994 activation Methods 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 235000013162 Cocos nucifera Nutrition 0.000 description 2
- 244000060011 Cocos nucifera Species 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- ANLVEXKNRYNLDH-UHFFFAOYSA-N 1,3-dioxonan-2-one Chemical compound O=C1OCCCCCCO1 ANLVEXKNRYNLDH-UHFFFAOYSA-N 0.000 description 1
- QLOKJRIVRGCVIM-UHFFFAOYSA-N 1-[(4-methylsulfanylphenyl)methyl]piperazine Chemical compound C1=CC(SC)=CC=C1CN1CCNCC1 QLOKJRIVRGCVIM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- QINDDHWOSJITQV-UHFFFAOYSA-L OP(O)(O)=O.O[Cr](=O)(=O)O[Cr](O)(=O)=O Chemical compound OP(O)(O)=O.O[Cr](=O)(=O)O[Cr](O)(=O)=O QINDDHWOSJITQV-UHFFFAOYSA-L 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical class [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- MCUDGYVHPADJBD-UHFFFAOYSA-L hydroxy-(hydroxy(dioxo)chromio)oxy-dioxochromium sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](=O)(=O)O[Cr](O)(=O)=O MCUDGYVHPADJBD-UHFFFAOYSA-L 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- MVDYEFQVZNBPPH-UHFFFAOYSA-N pentane-2,3,4-trione Chemical compound CC(=O)C(=O)C(C)=O MVDYEFQVZNBPPH-UHFFFAOYSA-N 0.000 description 1
- YXJYBPXSEKMEEJ-UHFFFAOYSA-N phosphoric acid;sulfuric acid Chemical compound OP(O)(O)=O.OS(O)(=O)=O YXJYBPXSEKMEEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Description
産業上の利用分野
本発明は、ポリエステル樹脂のメツキ方法に関
し、更に詳しくは、無電解メツキを行なう際のエ
ツチング処理方法に関する。
従来の技術及びその問題点
合成樹脂成形品にメツキ処理するための方法の
1つとして、電解メツキ方法が知られている。こ
の方法は、被メツキ物に(イ)洗浄工程、(ロ)エツチン
グ工程、(ハ)感受性化工程、(ニ)活性化工程及び(ホ)無
電解メツキ工程を実施し、無電解メツキ皮膜を形
成させて導電性を与えた後、電解メツキを行なう
方法である。一般に、この方法により形成された
メツキ皮膜と樹脂との密着に最も大きな影響を与
えるものは、エツチング工程であることが、知ら
れている。
メツキ処理するためのプラスチツク材料として
主として使用されているABS樹脂では、エツチ
ング工程において、ブタジエンが酸化溶解され、
生成した穴を利用して樹脂と金属との優れた密着
力を得ている。しかしながら、ANG樹脂は、耐
熱性が悪いという難点を有するため、用途が限定
されている。
一方、ポリエステル樹脂は、耐熱性が優れてい
るばかりでなく、機械的、電気的性質及び耐薬品
性に優れたものであり、特にこれに種々の充填材
を添加したものは、更に優れた特性を発揮するこ
とができ、いわゆるエンジニアリングプラスチツ
クとして幅広い利用が期待されるものである。従
つて、ポリエステル樹脂に密着性よくメツキ処理
することにより、この用途はさらに拡大するもの
である。
従来からポリエステル樹脂などの熱可塑性樹脂
に対して使用するエツチング液としては、例え
ば、重クロム酸塩―硫酸混液、無水クロム酸―硫
酸混液、重クロム酸―リン酸混液、重クロム酸―
硫酸―リン酸混液などの強酸化溶液が知られてい
る。通常このようなエツチング液は、樹脂表面を
腐食、膨潤化することにより、凹部を作り、いわ
ゆるアンカー効果にてメツキ皮膜と樹脂との密着
を得るものである。しかしながら、ポリエステル
樹脂に対しては、上記したような強酸化溶液によ
りエツチングを行なつただけでは、樹脂表面を十
分にエツチングすることができずアンカー効果が
不充分となり、密着力が不足するという問題があ
る。
問題点を解決するための手段
本発明者は、ポリエステル樹脂に密着性良くメ
ツキするための方法を見出すべく鋭意研究を重ね
た結果、ポリエステル樹脂をエツチング工程に於
いてまず強酸化溶液と接触せしめ、次いで複素環
系カーボネートと接触せしめることにより、樹脂
表面を適度にエツチングすることができ、優れた
密着力のあるメツキ皮膜を得ることができること
を見出した。
即ち、本発明は、ポリエステル樹脂を洗浄処理
し、エツチング処理し、感受性化処理し、活性化
処理し、無電解メツキ処理するに際し、エツチン
グ処理として、ポリエステル樹脂を6価クロム化
合物と硫酸及び/またはリン酸との混合液を接触
せしめ、次いで炭素数1〜8の複素環系アルキレ
ンカーボネートまたはその溶剤溶液と接触させる
ことを特微とするポリエステル樹脂の無電解メツ
キ方法に係る。
本発明で用いるポリエステル樹脂とは、ポリブ
チレンテレフタレート、ポリエチレンテレフタレ
ート、ポリメチレンテレフタレートなどの熱可塑
性ポリエステル及びこれらの樹脂に充填材を添加
したものである。ポリエステル樹脂に用いられる
充填材は、一般に無機充填材と有機充填材とに大
別でき、無機充填材としては、炭酸カルシウム、
硫酸バリウム、活性フツ化カルシウム、ケイ酸カ
ルシウム、硫酸アルミニウム、硫酸カルシウム、
硫酸マグネシウム、雲母粉、タルク、ケイ藻土、
クレー、ドロマイト、リトポン、アルミナ・ホワ
イト、アスベスト(石綿)、軽石粉、グラフアイ
ト(黒鉛)、ガラス繊維などが例示でき、有機充
填材としては、再生ゴム、エボナイト粉末、木
粉、ココナツト・ヤシ殻粉、コルク粉末、セルロ
ース・パウダー、コツトンリンター、木材パル
プ、紙、布などが例示できる。
本発明では、まず、ポリエステル樹脂被メツキ
物を洗浄後、6価クロム化合物と硫酸及び/又は
リン酸との混合溶液に接触せしめる。接触方法と
しては各種の方法が可能であるが、通常では、浸
漬方法で行なうことが多い。この混合溶液は、強
酸化性を有する溶液であり、樹脂表面を腐食し、
膨潤化する作用がある。このような目的に使用で
きる6価クロム化合物としては、無水クロム酸;
重クロム酸カリ、重クロム酸ソーダなどの重クロ
ム酸塩;クロム酸カリ、クロム酸ソーダなどのク
ロム酸塩などが例示できる。6価クロム化合物と
硫酸及び/又はリン酸との混合溶液としては、例
えば(a)重クロム酸塩5g/〜35g/、98%硫
酸50ml/〜700ml/、(b)無水クロム酸50g/
〜500g/、98%硫酸100ml/〜400ml/、
(c)重クロム酸塩5g/〜35g/、89%リン酸
50ml/〜700ml/、(d)重クロム酸塩5g/
〜35g/、98%硫酸50ml/〜700ml/、89
%リン酸50ml/〜300ml/、などの溶液を挙
げることができる。
6価クロム化合物と硫酸及び/又はリン酸との
混合溶液による処理条件は、使用する樹脂及び充
填材の種類、溶液の濃度等により異なるが、通常
温度50〜75℃程度で3〜20分間程度処理をすれば
よい。
本発明では、6価クロム化合物と硫酸及び/又
はリン酸との混合溶液で処理した樹脂を水洗後、
複素環系カーボネートまたはその溶剤溶液に接触
せしめる。6価クロム化合物と硫酸及び/又はリ
ン酸との混合溶液で処理しただけの樹脂では、そ
の表面に凹凸が生じているがその程度が小さいた
めに無電解メツキ皮膜に対する密着力が小さい。
しかし、複素環系カーボネートによる処理によ
り、樹脂表面は、更に、腐食、膨潤化し、充分な
アンカー効果を発揮して無電解メツキ皮膜との優
れた密着力が得られる。またポリエステル樹脂に
充填材を含むものでは、この処理によりポリエス
テル樹脂表面部分の充填材が溶解除去され、より
大きな密着力が得られる。
ここで使用する複素環系カーボネートとは、複
素環を有し、かつカルボニル基を有する化合物で
あり、その代表例としては複素環系アルキレンカ
ーボネート(アルキル基は通常C1〜C8程度)を
挙げることができる。その具体例としては、エチ
レンカーボネート、プロピレンカーボネート等を
例示できる。これらカーボネート系化合物は、液
体のものは、そのままで使用できるが、通常、適
当な溶媒に溶解して使用する。この際の溶媒とし
ては、水、メチルアルコール、エチルアルコール
の如き低級アルコール、エチレングリコール、プ
ロピレングリコールの如きグリコール類、アセト
ン、、アセチルケトン、メチルエチルケトンの如
きケトン類を例示でき、これらは混合して用いる
こともできる。通常複素環系化合物の濃度は、10
〜300g/、好ましくは30〜100g/程度とす
る。また、本発明に於いては、複素環系カーボネ
ート処理に際し、アルカリ金属水酸化物やアンモ
ニアの如き塩基性物質を共存させることにより、
断脂表面を腐食、膨潤する効果を更に高めること
ができる。この際のアルカリ金属水酸化物として
は水酸化ナトリウム、水酸化カリウム等を例示で
き、これらは通常50〜300g/、好ましくは100
〜200g/程度の量で使用される。
複素環系カーボネートによる処理の条件も、6
価クロム化合物溶液による処理と同様に、樹脂の
種類や溶液の濃度により異なるが、通常は、温度
50〜75℃程度で5〜30分間程度処理をすればよ
い。
本発明メツキ法実施に際しては、被メツキ物を
通常の手段で脱脂し、水洗した後、6価クロム化
合物と硫酸及び/又はリン酸との混合溶液による
処理を行なう。次いで被処理物を水洗し、複素環
系カーボネート処理を行ない、水洗後、常法に従
つて感受性化、活性化、無電解メツキを行ない、
必要に応じて電解メツキを行なう。これ等感受性
化、活性化、無電解メツキ、電解メツキは、従来
使用されてきたものがそのまま使用でき、その条
件も常法に従えば良い。
また、本発明では、6価クロム化合物溶液によ
る処理及び複素環系カーボネートによる処理に先
立つて、複素環系カーボネートまたはその溶剤溶
液に接触せしめてもよい。このような処理を行な
うことにより、前もつて樹脂が膨潤するので、6
価クロム化合物溶液による処理及び複素環系カー
ボネートによる処理の効果をより高めることがで
きる。浴組成は、6価クロム化合物溶液処理後に
行なう複素環系カーボネート処理に用いる浴のも
のと同様でよく、50〜75℃程度の温度で5〜15分
間程度処理を行なえばよい。
発明の効果
本発明方法によれば、従来困難であつたポリエ
ステル樹脂に密着性よくメツキすることが可能と
なり、耐熱性に優れたエンジニアリングプラスチ
ツクとしての用途を拡大することができる。
実施例
次に実施例を示して、本発明を更に詳細に説明
する。
実施例 1
無機フイラーとして、ガラス繊維と炭酸カルシ
ウムを30重量%含有するポリブチレンテレフタレ
ート樹脂を成形温度255〜285℃、金型温度85〜
120℃で成形して3×100×100mmの試料を作製し
た。この試料を無水クロム酸200g/、98%硫
酸200ml/の水溶液に70℃で10分間浸漬し、水
洗後、プロピレンカーボネート50g/水溶液に
65℃で10分間浸漬し、水洗後、下記の条件で常法
に従つて感受性化、活性化、無電解メツキ、電解
メツキを行なつた。
Γ感受性化:触媒溶液(商標“キヤタリストC”、
奥野製薬工業(株)製)60ml/、36%塩酸
150ml/を含む浴に25℃で3分間浸漬
Γ活性化:98%硫酸100ml/に40℃で3分間浸
漬
Γ無電解ニツケルメツキ:無電解ニツケルメツキ
(商標“TMP化学ニツケルメツキ“奥野製
薬工業(株)製)に40℃で8分間浸漬
Γ硫酸銅メツキ:硫酸銅200g/、98%硫酸28
ml/及び光沢剤小量を含むメツキ浴を使
用し、25℃、3A/dm2で2時間メツキ
Γ乾燥:80℃で2時間
得られたメツキ物について密着性試験を行なつ
た。この結果を第1表に示す。但し密着性は、次
の方法により測定した。
Γ密着性試験:メツキ面に1cm幅の切り目を入
れ、島津製作所製オートグラフSD―100―
Cを用いてメツキ膜を引張りながらハクリ
してその密着力を測定した。
実施例 2
実施例1と同じ成形品を無水クロム酸200g/
、98%硫酸200ml/の水溶液に70℃で10分間
浸漬し、水洗後、プロピレンカーボネート50g/
、苛性ソーダ100g/の水溶液に65℃で10分
間浸漬し、水洗後、実施例1と同様に処理した。
実施例 8
実施例1と同じ成形品を無水クロム酸200g/
、98%硫酸200ml/の水溶液に70℃で10分間
浸漬し、水洗後、プロピレンカーボネート50g/
、苛性ソーダ200g/、エチレングリコール
150g/の水溶液に65℃で10分間浸漬し、水洗
後、実施例1と同様に処理した。
実施例 4
実施例1と同じ成形品を重クロム酸ソーダ15
g/、98%硫酸500ml/、89%リン酸100ml/
の水溶液に70℃に10分間浸漬し、水洗後、エチ
レンカーボネート50g/、苛性ソーダ100g/
、エチルアルコール100g/の水溶液に65℃
で10分間浸漬し、水洗後、実施例1と同様に処理
した。
実施例 5
無機フイラーとして、ケイ酸アルミニウムを35
%(重量)含有するポリブチレンテレフタレート
樹脂を、成形温度280℃、金型温度90℃で成形し
て試料を作成した。この試料をエチレンカーボネ
ート100g/、苛性ソーダ80g/の水溶液に
70℃で5分間浸漬し、水洗後、無水クロム酸35
g/、98%硫酸450ml/の水溶液に70℃で10
分間浸漬した。水洗後、更に、苛性ソーダ150
g/、プロピレンカーボネート50g/、エチ
レングリコール50g/の水溶液に70℃で5分間
浸漬し、水洗後、実施例1と同様に処理した。
実施例 6
無機フイラーとして、ケイ酸マグネシウムを40
%(重量)含有するポリブチレンテレフタレート
樹脂を、成形温度285℃、金型温度90℃で成形し
て試料を作製した。この試料を実施例4と同様に
処理した。メツキ皮膜の外観は良好であり、密着
強度は2.7Kg/cm2であつた。
比較例 1
実施例1と同じ成形品を脱脂し、この試料を無
水クロム酸200g/、98%硫酸200ml/の水溶
液に70℃で10分間浸漬し、水洗後、感受性化以後
を実施例1と同様に処理した。
比較例 2
実施例1と同じ成形品を脱脂し、この試料を無
水クロム酸200g/、98%硫酸200ml/の水溶
液に70℃で10分間浸漬し、水洗後、苛性ソーダ
100g/の水溶液に65℃で10分間浸漬し、水洗
後、感受性化以後を実施例1と同様に処理した。
比較例 3
実施例5と同じ成形品を脱脂し、この試料をプ
ロピレンカーボネート50g/、苛性ソーダ100
g/の水溶液に65℃で10分間浸漬し、水洗後、
感受性化以後の各処理を実施例1と同様に処理し
た。
INDUSTRIAL APPLICATION FIELD The present invention relates to a method for plating polyester resin, and more particularly to an etching method when performing electroless plating. BACKGROUND OF THE INVENTION 2. Description of the Related Art Electrolytic plating is known as one of the methods for plating synthetic resin molded articles. This method involves performing (a) a cleaning process, (b) an etching process, (c) a sensitization process, (d) an activation process, and (e) an electroless plating process on the object to be plated to form an electroless plating film. This is a method in which electrolytic plating is performed after forming and imparting conductivity. Generally, it is known that the etching process has the greatest effect on the adhesion between the plating film formed by this method and the resin. In ABS resin, which is mainly used as a plastic material for plating, butadiene is oxidized and dissolved during the etching process.
The holes created are used to obtain excellent adhesion between resin and metal. However, ANG resin has a drawback of poor heat resistance, so its uses are limited. On the other hand, polyester resin not only has excellent heat resistance, but also excellent mechanical, electrical properties, and chemical resistance, and in particular, polyester resins with various fillers added have even better properties. It is expected that it will be widely used as a so-called engineering plastic. Therefore, by plating the polyester resin with good adhesion, its uses will be further expanded. Conventionally, etching solutions used for thermoplastic resins such as polyester resin include dichromate-sulfuric acid mixture, chromic anhydride-sulfuric acid mixture, dichromic acid-phosphoric acid mixture, and dichromic acid-sulfuric acid mixture.
Strong oxidizing solutions such as a sulfuric acid-phosphoric acid mixture are known. Usually, such an etching solution corrodes and swells the resin surface, thereby creating recesses and achieving close contact between the plating film and the resin through a so-called anchor effect. However, when polyester resin is etched using a strong oxidizing solution such as the one described above, the resin surface cannot be sufficiently etched, resulting in insufficient anchoring effect and insufficient adhesion. There is. Means for Solving the Problems As a result of extensive research to find a method for plating polyester resin with good adhesion, the present inventor first brought the polyester resin into contact with a strong oxidizing solution during the etching process. It has been found that by subsequently bringing the resin into contact with a heterocyclic carbonate, the resin surface can be appropriately etched and a plating film with excellent adhesion can be obtained. That is, in the present invention, when a polyester resin is washed, etched, sensitized, activated, and electroless plated, the polyester resin is treated with a hexavalent chromium compound, sulfuric acid, and/or as an etching treatment. The present invention relates to a method for electroless plating of polyester resin, which is characterized by contacting a mixed solution with phosphoric acid and then contacting a heterocyclic alkylene carbonate having 1 to 8 carbon atoms or a solvent solution thereof. The polyester resin used in the present invention is a thermoplastic polyester such as polybutylene terephthalate, polyethylene terephthalate, polymethylene terephthalate, etc., and a filler added to these resins. Fillers used in polyester resin can generally be divided into inorganic fillers and organic fillers, and inorganic fillers include calcium carbonate,
Barium sulfate, activated calcium fluoride, calcium silicate, aluminum sulfate, calcium sulfate,
Magnesium sulfate, mica powder, talc, diatomaceous earth,
Examples include clay, dolomite, lithopone, alumina white, asbestos, pumice powder, graphite, and glass fiber. Examples of organic fillers include recycled rubber, ebonite powder, wood flour, and coconut/coconut shells. Examples include powder, cork powder, cellulose powder, cotton linters, wood pulp, paper, and cloth. In the present invention, first, the polyester resin object to be plated is washed and then brought into contact with a mixed solution of a hexavalent chromium compound and sulfuric acid and/or phosphoric acid. Although various methods are possible for contacting, a dipping method is usually used. This mixed solution is a strongly oxidizing solution that corrodes the resin surface.
It has a swelling effect. Hexavalent chromium compounds that can be used for this purpose include chromic anhydride;
Examples include dichromates such as potassium dichromate and sodium dichromate; chromates such as potassium chromate and sodium chromate. Examples of mixed solutions of hexavalent chromium compounds and sulfuric acid and/or phosphoric acid include (a) dichromate 5g/~35g/, 98% sulfuric acid 50ml/~700ml/, (b) chromic anhydride 50g/
~500g/, 98% sulfuric acid 100ml/~400ml/,
(c) Dichromate 5g/~35g/, 89% phosphoric acid
50ml/~700ml/, (d) dichromate 5g/
~35g/, 98% sulfuric acid 50ml/~700ml/, 89
Examples include solutions such as 50 ml/~300 ml/% phosphoric acid. Treatment conditions with a mixed solution of a hexavalent chromium compound and sulfuric acid and/or phosphoric acid vary depending on the type of resin and filler used, the concentration of the solution, etc., but it is usually about 3 to 20 minutes at a temperature of about 50 to 75 degrees Celsius. All you have to do is process it. In the present invention, after washing the resin treated with a mixed solution of a hexavalent chromium compound and sulfuric acid and/or phosphoric acid,
Contact with heterocyclic carbonate or its solvent solution. A resin that has only been treated with a mixed solution of a hexavalent chromium compound and sulfuric acid and/or phosphoric acid has unevenness on its surface, but the extent of the unevenness is small, so the adhesion to the electroless plating film is low.
However, by treatment with a heterocyclic carbonate, the resin surface further corrodes and swells, exhibiting a sufficient anchoring effect and providing excellent adhesion to the electroless plating film. In addition, when the polyester resin contains a filler, this treatment dissolves and removes the filler on the surface of the polyester resin, resulting in greater adhesion. The heterocyclic carbonate used here is a compound having a heterocycle and a carbonyl group, and a representative example thereof is a heterocyclic alkylene carbonate (the alkyl group is usually about C 1 to C 8 ). be able to. Specific examples include ethylene carbonate and propylene carbonate. Although these carbonate compounds can be used as they are in liquid form, they are usually used after being dissolved in a suitable solvent. Examples of the solvent in this case include water, lower alcohols such as methyl alcohol and ethyl alcohol, glycols such as ethylene glycol and propylene glycol, and ketones such as acetone, acetyl ketone, and methyl ethyl ketone, and these may be used in combination. You can also do that. Usually the concentration of heterocyclic compounds is 10
~300g/, preferably about 30-100g/. In addition, in the present invention, when treating a heterocyclic carbonate, by allowing a basic substance such as an alkali metal hydroxide or ammonia to coexist,
The effect of corroding and swelling the grease-proof surface can be further enhanced. Examples of the alkali metal hydroxide in this case include sodium hydroxide, potassium hydroxide, etc., and these are usually 50 to 300 g/, preferably 100 g/
It is used in an amount of ~200g/approximately. The conditions for treatment with heterocyclic carbonate are also 6
As with the treatment with chromium compound solution, it depends on the type of resin and the concentration of the solution, but usually the temperature
The treatment may be carried out at about 50 to 75°C for about 5 to 30 minutes. When carrying out the plating method of the present invention, the object to be plated is degreased by conventional means, washed with water, and then treated with a mixed solution of a hexavalent chromium compound and sulfuric acid and/or phosphoric acid. Next, the object to be treated is washed with water, subjected to heterocyclic carbonate treatment, and after washing with water, sensitized, activated, and electroless plating are performed according to conventional methods,
Perform electrolytic plating as necessary. As for sensitization, activation, electroless plating, and electrolytic plating, those conventionally used can be used as they are, and the conditions may be according to conventional methods. Furthermore, in the present invention, prior to the treatment with the hexavalent chromium compound solution and the treatment with the heterocyclic carbonate, it may be brought into contact with the heterocyclic carbonate or its solvent solution. By performing such treatment, the resin swells beforehand, so
The effects of the treatment with a valent chromium compound solution and the treatment with a heterocyclic carbonate can be further enhanced. The bath composition may be the same as that of the bath used for the heterocyclic carbonate treatment performed after the hexavalent chromium compound solution treatment, and the treatment may be performed at a temperature of about 50 to 75°C for about 5 to 15 minutes. Effects of the Invention According to the method of the present invention, it is possible to plate polyester resins with good adhesion, which has been difficult in the past, and its uses as engineering plastics with excellent heat resistance can be expanded. EXAMPLES Next, the present invention will be explained in more detail with reference to Examples. Example 1 As an inorganic filler, polybutylene terephthalate resin containing 30% by weight of glass fiber and calcium carbonate was molded at a molding temperature of 255 to 285°C and a mold temperature of 85 to 85°C.
A sample of 3 x 100 x 100 mm was prepared by molding at 120°C. This sample was immersed in an aqueous solution of 200 g of chromic anhydride and 200 ml of 98% sulfuric acid at 70°C for 10 minutes, washed with water, and then immersed in an aqueous solution of 50 g of propylene carbonate.
After immersion at 65°C for 10 minutes and washing with water, sensitization, activation, electroless plating, and electrolytic plating were performed according to conventional methods under the following conditions. Γ Sensitization: Catalyst solution (trademark “Catalyst C”,
(manufactured by Okuno Pharmaceutical Co., Ltd.) 60ml/36% hydrochloric acid
Γ Activation: Immerse in 100 ml of 98% sulfuric acid for 3 minutes at 40°C. Γ Electroless nickel plating: Electroless nickel plating (trademark: "TMP chemical nickel plating" manufactured by Okuno Pharmaceutical Co., Ltd.) ) for 8 minutes at 40℃ Copper sulfate plating: Copper sulfate 200g/, 98% sulfuric acid 28
Using a plating bath containing a small amount of brightener and a plating bath at 25° C. and 3 A/dm 2 for 2 hours, plating Γ drying: 2 hours at 80° C. An adhesion test was conducted on the obtained plated product. The results are shown in Table 1. However, the adhesion was measured by the following method. Γ adhesion test: Make a 1 cm wide cut on the plating surface and use Autograph SD-100 manufactured by Shimadzu Corporation.
The adhesion was measured by peeling off the plating film while pulling it using C. Example 2 The same molded product as in Example 1 was treated with 200 g of chromic anhydride/
, immersed in an aqueous solution of 98% sulfuric acid 200 ml/at 70°C for 10 minutes, and after washing with water, propylene carbonate 50 g/
, immersed in an aqueous solution of 100 g of caustic soda at 65° C. for 10 minutes, washed with water, and treated in the same manner as in Example 1. Example 8 The same molded product as in Example 1 was treated with 200 g of chromic anhydride/
, immersed in an aqueous solution of 98% sulfuric acid 200 ml/at 70°C for 10 minutes, and after washing with water, propylene carbonate 50 g/
, caustic soda 200g/, ethylene glycol
It was immersed in a 150 g/aqueous solution at 65° C. for 10 minutes, washed with water, and then treated in the same manner as in Example 1. Example 4 The same molded product as in Example 1 was treated with sodium dichromate 15
g/, 98% sulfuric acid 500ml/, 89% phosphoric acid 100ml/
After immersing in an aqueous solution at 70℃ for 10 minutes and washing with water, ethylene carbonate 50g/, caustic soda 100g/
, 65℃ in an aqueous solution of ethyl alcohol 100g/
The sample was soaked in water for 10 minutes, washed with water, and treated in the same manner as in Example 1. Example 5 Aluminum silicate was used as an inorganic filler.
% (weight) of polybutylene terephthalate resin was molded at a molding temperature of 280°C and a mold temperature of 90°C to create a sample. This sample was added to an aqueous solution of 100 g of ethylene carbonate and 80 g of caustic soda.
After soaking at 70℃ for 5 minutes and washing with water, chromic anhydride 35
g/, in an aqueous solution of 450 ml of 98% sulfuric acid at 70°C.
Soaked for minutes. After washing with water, add 150 ml of caustic soda.
The sample was immersed in an aqueous solution containing 50 g/g/g of propylene carbonate and 50 g/g of ethylene glycol at 70°C for 5 minutes, washed with water, and then treated in the same manner as in Example 1. Example 6 Magnesium silicate was used as an inorganic filler.
% (weight) of polybutylene terephthalate resin was molded at a molding temperature of 285°C and a mold temperature of 90°C to prepare a sample. This sample was processed in the same manner as in Example 4. The appearance of the plating film was good, and the adhesion strength was 2.7 Kg/cm 2 . Comparative Example 1 The same molded product as in Example 1 was degreased, and this sample was immersed in an aqueous solution of 200 g of chromic anhydride and 200 ml of 98% sulfuric acid at 70°C for 10 minutes, washed with water, and sensitized. Treated in the same way. Comparative Example 2 The same molded product as in Example 1 was degreased, and this sample was immersed in an aqueous solution of 200 g of chromic anhydride and 200 ml of 98% sulfuric acid at 70°C for 10 minutes, washed with water, and then soaked in caustic soda.
It was immersed in a 100 g/aqueous solution at 65° C. for 10 minutes, washed with water, and treated in the same manner as in Example 1 after sensitization. Comparative Example 3 The same molded product as in Example 5 was degreased, and the sample was treated with 50 g of propylene carbonate and 100 g of caustic soda.
Immerse it in an aqueous solution of
Each treatment after sensitization was performed in the same manner as in Example 1.
【表】【table】
【表】
第1表から本発明方法でメツキした試料は、外
観が良好であり、メツキ皮膜は大きな密着強度を
有することが明らかである。
実施例 7
実施例6と同様にして成形して得た試料を無水
クロム酸200g/、98%硫酸200mg/gの水溶液
に70℃で10分間浸漬し、水洗し、次いでブチレン
カーボネート50g/、水酸化ナトリウム200
g/、エチレングリコール150g/の水溶液
に65℃で10分間浸漬し、水洗後、実施例1と同様
にして感受性化以後の各処理を行つた。
得られた無電解ニツケルメツキ皮膜の外観は良
好であり、銅メツキ層形成後の密着強度は、2.2
Kg/cm2であつた。
実施例 8
実施例6と同様にして成形して得た試料を無水
クロム酸200g/、98%硫酸200ml/の水溶液
に70℃で10分間浸漬し、水洗し、次いでヘキシレ
ンカーボネート30g/、水酸化ナトリウム200
g/、エチレングリコール150g/の水溶液
に65℃で、10分間浸漬し、水洗後、実施例1と同
様にして感受性化以後の各処理を行つた。
得られた無電解ニツケルメツキ皮膜の外観は良
好であり、銅メツキ層形成後の密着強度は、2.1
Kg/cm2であつた。
実施例 9
実施例6と同様にして成形して得た試料を重ク
ロム酸ナトリウム15g/、98%硫酸500ml/、
89%リン酸100ml/の水溶液に70℃で10分間浸
漬し、水洗し、次いでオクチレンカーボネート10
g/、水酸化ナトリウム200g/、エチレン
グリコール150g/の水溶液に65℃で10分間浸
漬し、水洗後、実施例1と同様にして感受性化以
後の各処理を行つた。
得られた無電解ニツケルメツキ皮膜の外観は良
好であり、銅メツキ層形成後の密着強度は、2.2
Kg/cm2であつた。[Table] From Table 1, it is clear that the samples plated by the method of the present invention have a good appearance and the plated film has high adhesion strength. Example 7 A sample obtained by molding in the same manner as in Example 6 was immersed in an aqueous solution of 200 g of chromic anhydride/200 mg/g of 98% sulfuric acid at 70°C for 10 minutes, washed with water, and then immersed in an aqueous solution of 200 g/g of chromic anhydride and 200 mg/g of 98% sulfuric acid, washed with water, and then immersed in an aqueous solution of 200 g/g of chromic anhydride and 200 mg/g of 98% sulfuric acid. sodium oxide 200
The sample was immersed in an aqueous solution of 150 g/g/ethylene glycol at 65° C. for 10 minutes, washed with water, and subjected to various treatments after sensitization in the same manner as in Example 1. The appearance of the obtained electroless nickel plating film was good, and the adhesion strength after forming the copper plating layer was 2.2.
It was Kg/ cm2 . Example 8 A sample molded in the same manner as in Example 6 was immersed in an aqueous solution of 200 g of chromic anhydride and 200 ml of 98% sulfuric acid at 70°C for 10 minutes, washed with water, and then immersed in 30 g of hexylene carbonate and 200 ml of water. sodium oxide 200
The sample was immersed in an aqueous solution containing 150 g/g/g/ethylene glycol at 65° C. for 10 minutes, washed with water, and then subjected to various treatments after sensitization in the same manner as in Example 1. The appearance of the obtained electroless nickel plating film was good, and the adhesion strength after forming the copper plating layer was 2.1.
It was Kg/ cm2 . Example 9 A sample obtained by molding in the same manner as in Example 6 was mixed with 15 g of sodium dichromate, 500 ml of 98% sulfuric acid,
Immerse in an aqueous solution of 100 ml of 89% phosphoric acid at 70°C for 10 minutes, rinse with water, and then soak in octylene carbonate 10.
The sample was immersed in an aqueous solution containing 200 g of sodium hydroxide and 150 g of ethylene glycol at 65° C. for 10 minutes, washed with water, and subjected to sensitization and subsequent treatments in the same manner as in Example 1. The appearance of the obtained electroless nickel plating film was good, and the adhesion strength after forming the copper plating layer was 2.2.
It was Kg/ cm2 .
Claims (1)
処理し、感受性化処理し、活性化処理し、無電解
メツキ処理するに際し、 エツチング処理として、ポリエステル樹脂を6
価クロム化合物と硫酸及び/またはリン酸との混
合液と接触せしめ、次いで炭素数1〜8の複素環
系アルキレンカーボネートまたはその溶剤溶液と
接触させる ことを特徴とするポリエステル樹脂の無電解メツ
キ方法。[Claims] 1. When polyester resin is subjected to cleaning treatment, etching treatment, sensitization treatment, activation treatment, and electroless plating treatment, the polyester resin is
1. A method for electroless plating of polyester resin, which comprises contacting with a mixed solution of a valent chromium compound and sulfuric acid and/or phosphoric acid, and then contacting with a heterocyclic alkylene carbonate having 1 to 8 carbon atoms or a solvent solution thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23703884A JPH0249387B2 (en) | 1984-11-09 | 1984-11-09 | HORIESUTERUJUSHINOMUDENKAIMETSUKIHOHO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23703884A JPH0249387B2 (en) | 1984-11-09 | 1984-11-09 | HORIESUTERUJUSHINOMUDENKAIMETSUKIHOHO |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61113773A JPS61113773A (en) | 1986-05-31 |
JPH0249387B2 true JPH0249387B2 (en) | 1990-10-30 |
Family
ID=17009473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23703884A Expired - Lifetime JPH0249387B2 (en) | 1984-11-09 | 1984-11-09 | HORIESUTERUJUSHINOMUDENKAIMETSUKIHOHO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249387B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2513728B2 (en) * | 1987-10-09 | 1996-07-03 | ポリプラスチックス株式会社 | Surface treatment method for liquid crystalline polyester resin moldings |
-
1984
- 1984-11-09 JP JP23703884A patent/JPH0249387B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS61113773A (en) | 1986-05-31 |
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