JPH0249055A - Electrically semiconducting resin composition - Google Patents
Electrically semiconducting resin compositionInfo
- Publication number
- JPH0249055A JPH0249055A JP20224188A JP20224188A JPH0249055A JP H0249055 A JPH0249055 A JP H0249055A JP 20224188 A JP20224188 A JP 20224188A JP 20224188 A JP20224188 A JP 20224188A JP H0249055 A JPH0249055 A JP H0249055A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- catalyst
- nylon
- pyrrole
- oxidative polymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 37
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000002685 polymerization catalyst Substances 0.000 claims abstract description 17
- 230000001590 oxidative effect Effects 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 229920000128 polypyrrole Polymers 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 abstract description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000178 monomer Substances 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 239000004677 Nylon Substances 0.000 abstract description 6
- 229920001778 nylon Polymers 0.000 abstract description 6
- 229920000642 polymer Polymers 0.000 abstract description 6
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 238000003756 stirring Methods 0.000 abstract description 4
- 229920000305 Nylon 6,10 Polymers 0.000 abstract description 2
- 230000000379 polymerizing effect Effects 0.000 abstract 2
- 229920002292 Nylon 6 Polymers 0.000 abstract 1
- 229920002302 Nylon 6,6 Polymers 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 229920001897 terpolymer Polymers 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920001940 conductive polymer Polymers 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 potassium dichromate Chemical class 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電子写真複写機の導電性ロール等に用いられ
る半導電性樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductive resin composition used for conductive rolls of electrophotographic copying machines and the like.
近年、加工性に富み軽量でコスト的にも安価な導電性高
分子組成物が注目されており、このような導電性高分子
組成物は上記特性を生かして広範囲な分野に応用可能と
されている。しかしながら、従来知られている導電性高
分子組成物は、その大部分のものが上記のような分野に
使用されるには未だ充分な電気特性の安定性等を備えて
いない。ここで、導電性高分子組成物とは、ポリアセチ
レン、ポリピロール、ポリチオフェン等の高分子単体で
導電性を有している高分子を導電材としてマトリックス
樹脂中に含有する樹脂組成物のことをさす。例えば、特
開昭60−223854号公報には、熱可塑性樹脂溶液
(A )とポリピロールCB)との割合(重量%)が(
A)/ (B)=70/30〜20/80の範囲になっ
ている導電性樹脂組成物が開示されている。この組成物
は、例えば、上記混合溶液に、パーオキソ酸塩等の酸素
含有酸化剤を触媒として作用させピロールを重合させる
ことにより導電性樹脂組成物を得る方法が開示されてい
る。In recent years, conductive polymer compositions that are highly processable, lightweight, and inexpensive have attracted attention, and it is believed that such conductive polymer compositions can be applied to a wide range of fields by taking advantage of the above characteristics. There is. However, most of the conventionally known conductive polymer compositions do not yet have sufficient stability of electrical properties to be used in the above fields. Here, the conductive polymer composition refers to a resin composition containing a conductive polymer such as polyacetylene, polypyrrole, or polythiophene in a matrix resin as a conductive material. For example, in JP-A No. 60-223854, the ratio (wt%) of the thermoplastic resin solution (A) and polypyrrole CB) is (
A conductive resin composition in which A)/(B)=70/30 to 20/80 is disclosed. This composition discloses a method of obtaining a conductive resin composition by, for example, causing the above mixed solution to act as a catalyst with an oxygen-containing oxidizing agent such as a peroxoacid salt to polymerize pyrrole.
しかしながら、上記方法によって得られる導電性樹脂組
成物は、上記触媒が導電性を示す(ドープ剤の作用を有
する)ため、導電領域のものであり、半導電領域を示さ
ない。しがも、電気特性が大きく変動しく環境依存性が
大きい)不安定なものである。このように、従来は、適
性な半導電領域を有するものが得られていないというの
が実情である。However, the conductive resin composition obtained by the above method is in a conductive region and does not exhibit a semiconductive region because the catalyst exhibits conductivity (has the action of a doping agent). However, it is unstable (its electrical characteristics fluctuate widely and is highly dependent on the environment). As described above, the reality is that conventionally it has not been possible to obtain a material having an appropriate semiconducting region.
この発明は、このような事情に鑑みなされたもので、安
定した電気特性(環境依存性が小さい)を有する半導電
性樹脂組成物の提供をその目的とする。The present invention was made in view of the above circumstances, and an object thereof is to provide a semiconductive resin composition having stable electrical properties (low environmental dependence).
上記の目的を達成するため、この発明の半導電性樹脂組
成物は、マトリックス樹脂中にポリピロールが分布して
いる樹脂組成物であって、脱触媒によって、ビロール重
合用の酸化重合触媒の残存量が10重世%以下に設定さ
れているという構成をとる。In order to achieve the above object, the semiconductive resin composition of the present invention is a resin composition in which polypyrrole is distributed in a matrix resin, and the remaining amount of oxidative polymerization catalyst for pyrrole polymerization is reduced by removing the catalyst. is set to less than 10%.
すなわち、本発明者らは、導電性樹脂組成物ではなく、
半導電性樹脂組成物を得るため、電気特性が変動する要
因について研究した。その研究の過程で、本発明者らは
、樹脂組成物中に含まれているビロール重合用の酸化重
合触媒(導電性付与作用を有する)が半導電性樹脂組成
物の電気特性の安定性に大きな影響を及ぼすことを突き
止めた。すなわち、通常、酸化重合触媒は潮解性を有し
ており、そのためこのような潮解性を有する触媒が残存
している半導電性樹脂組成物は触媒の吸水作用により電
気特性が大きく変動することになる(環境依存性が大き
くなる)ことを突き止めた。That is, the present inventors did not use a conductive resin composition, but
In order to obtain semiconductive resin compositions, we investigated the factors that cause changes in electrical properties. In the course of the research, the present inventors discovered that the oxidative polymerization catalyst for virole polymerization (which has an effect of imparting conductivity) contained in the resin composition has an effect on the stability of the electrical properties of the semiconductive resin composition. It turns out that it has a big impact. In other words, oxidative polymerization catalysts usually have deliquescent properties, and therefore, the electrical properties of semiconductive resin compositions in which such deliquescent catalysts remain will vary greatly due to the water absorption effect of the catalyst. (environmental dependence increases).
そして、この酸化重合触媒の含有量を中心にさらに研究
を重ねた結果、触媒が残存している樹脂組成物に脱触媒
処理を施し触媒の残存量をある特定の値以下に低減させ
ると、上記樹脂組成物を半導電領域に誘導できると同時
に、その電気特性を安定化させうることを見出しこの発
明に到達した。As a result of further research focusing on the content of this oxidative polymerization catalyst, we found that if the resin composition in which the catalyst remains is subjected to decatalyst treatment and the residual amount of the catalyst is reduced to below a certain value, the above-mentioned The inventors have discovered that it is possible to induce a resin composition into a semiconductive region and at the same time stabilize its electrical properties, and have arrived at this invention.
この発明の半導電性樹脂組成物は、マトリックス樹脂と
、ビロールモノマーと、ビロール重合用の酸化重合触媒
とを用いて得られる。The semiconductive resin composition of the present invention is obtained using a matrix resin, a virol monomer, and an oxidative polymerization catalyst for virol polymerization.
上記マトリックス樹脂としては、ナイロン6−ナイロン
66−ナイロン61〇三元共重合体ナイロン、N−メト
キシメチルナイロン、ポリメチルメタクリレート、ポリ
酢酸ビニル、エチレン−酢酸ビニル共重合体、ポリ塩化
ビニル、アクリルニトリル−ブタジェン−スチレン共重
合体樹脂(ABS樹脂)、ポリオレフィン、ポリ塩化ビ
ニリデン、ポリビニルアルコール、ポリエーテルである
ポリ−2,5−フェニルエーテル等の熱可塑性樹脂、不
飽和ポリエステル、エポキシ樹脂、ジアリルフタレート
樹脂、シリコン樹脂、ボリウレクン樹脂等の熱硬化性樹
脂等があげられる。Examples of the matrix resin include nylon 6-nylon 66-nylon 610 ternary copolymer nylon, N-methoxymethyl nylon, polymethyl methacrylate, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl chloride, and acrylonitrile. - Butadiene-styrene copolymer resin (ABS resin), polyolefin, polyvinylidene chloride, polyvinyl alcohol, thermoplastic resin such as polyether poly-2,5-phenyl ether, unsaturated polyester, epoxy resin, diallyl phthalate resin , silicone resin, thermosetting resin such as Polyurekne resin, and the like.
上記ビロールモノマーとしては、ビロール自体(7)他
、!10ヒロール、N−アルキルピロール、N−アリー
ルビロール、3および4の炭素位でモノアルキル置換ま
たはジアルキル置換されたビロールおよび3および4の
炭素位でモノハロゲン置換またはジハロゲン置換された
ビロール等があげられる。この発明においては、ビロー
ルは、単独でもしくは上記ビロールモノマーと他の化合
物との混合物としても使用できる。場合により他の複素
環化合物、例えばフラン、チオフェンまたはチアゾール
を上記ビロールモノマーの一部に代えて用いてもよい。Examples of the virol monomer include virol itself (7) and others! 10-hyrol, N-alkylpyrrole, N-arylvirol, virol substituted with monoalkyl or dialkyl at the 3rd and 4th carbon positions, virol substituted with monohalogen or dihalogen at the 3rd and 4th carbon positions, etc. It will be done. In this invention, virol can be used alone or as a mixture of the virol monomer and other compounds. Optionally, other heterocyclic compounds such as furan, thiophene or thiazole may be used in place of some of the virol monomers.
上記マトリックス樹脂(X)とポリピロール(Y)との
配合割合(重量%)は、(X)/ (Y)が71/29
〜99/1の範囲内でX+Y=100に設、定されるの
が好ましい。すなわち、上記範囲を外れると、加工性等
に優れた半導電性樹脂組成物が得られなくなるからであ
る。したがって、各原料配合に際し、ビロールモノマー
の配合量は上記(X)/ (Y)値を満たすように設定
するのが好適である。The blending ratio (wt%) of the matrix resin (X) and polypyrrole (Y) is (X)/(Y) 71/29
It is preferable to set X+Y=100 within the range of 99/1. That is, if it is outside the above range, a semiconductive resin composition with excellent processability etc. cannot be obtained. Therefore, when blending each raw material, it is preferable to set the blending amount of the virol monomer so as to satisfy the above (X)/(Y) value.
上記ピロール重合用の酸化重合触媒としては、鉄、アル
ミニウム、銅、白金等の金属塩化物、過硫酸ナトリウム
、過硫酸カリウム、過硫酸アンモニウム等の過硫酸塩、
重クロム酸カリウム等の無機系過酸化物、過硫酸塩−酸
性亜硫酸ナトリウム、過酸化水素−第一鉄塩、クメンヒ
ドロペルオキシド−第一鉄塩、過酸化ベンゾイル−ジメ
チルアニリル等のレドックス触媒等があげられる。The oxidative polymerization catalyst for the above-mentioned pyrrole polymerization includes metal chlorides such as iron, aluminum, copper, and platinum, persulfates such as sodium persulfate, potassium persulfate, and ammonium persulfate;
Redox catalysts such as inorganic peroxides such as potassium dichromate, persulfate-acidic sodium sulfite, hydrogen peroxide-ferrous salt, cumene hydroperoxide-ferrous salt, benzoyl peroxide-dimethylanilyl, etc. can be given.
上記酸化重合触媒の配合割合は、ビロールモノマー1モ
ルに対して上記酸化重合触媒が0.5〜4モルとなるよ
うに配合することが好適である。The mixing ratio of the oxidative polymerization catalyst is preferably 0.5 to 4 moles per 1 mole of the pyrrole monomer.
さらに、上記原料以外に、上記マトリックス樹脂、ビロ
ールモノマー、酸化重合触媒を混合溶解させるための有
機溶剤が用いられる。Furthermore, in addition to the above raw materials, an organic solvent is used to mix and dissolve the above matrix resin, pyrrole monomer, and oxidative polymerization catalyst.
上記有機溶剤としては、メタノール、エタノール、2−
プロパツール等のアルコール類、ジメチルエーテル、ジ
エチルエーテル、テトラヒドロフラン、ジオキサン等の
エーテル類、ジメチルスルホキシド、N、N’−ジメチ
ルホルムアミド、N−メチル−2−ピロリドン、アセト
ニトリル、エチレンカルボナートおよびギ酸等があげら
れ、単独でもしくは併せて用いられる。Examples of the organic solvent include methanol, ethanol, 2-
Examples include alcohols such as propatool, ethers such as dimethyl ether, diethyl ether, tetrahydrofuran, and dioxane, dimethyl sulfoxide, N,N'-dimethylformamide, N-methyl-2-pyrrolidone, acetonitrile, ethylene carbonate, and formic acid. , used alone or in combination.
この発明の半導電性樹脂組成物は、上記各原料を用いて
、例えばつぎのようにして製造される。The semiconductive resin composition of the present invention is produced using the above-mentioned raw materials, for example, in the following manner.
すなわち、まず有機溶剤にマトリックス樹脂を溶解させ
、これにビロールを添加し温度−40〜0°C下で撹拌
する。つぎに、この溶液に重合触媒を加えビロールを重
合させた後、この重合溶液を水中に投入し重合物を凝集
させ反応を停止させる。That is, first, a matrix resin is dissolved in an organic solvent, virol is added thereto, and the mixture is stirred at a temperature of -40 to 0°C. Next, a polymerization catalyst is added to this solution to polymerize virole, and then this polymerization solution is poured into water to coagulate the polymer and stop the reaction.
ぞして、脱触媒処理として、得られた重合物を清浄な水
(常温程度)で1〜2昼夜浸漬することにより製造され
る。必要な場合には、第2段階として常温〜i o o
’cの清浄な水で1〜7日間、好ましくは3日間浸漬
を続け、重合物表面OpH値が略中性を示す時点で浸漬
を終了させることが行われる。このようにして脱触媒処
理が施された半導電性樹脂組成物中の酸化重合触媒の残
存量は10重量%以下、好ましくは5重量%以下に設定
されなければならない。すなわち、酸化重合触媒の残存
量が10重重量を超えると、半導電性樹脂組成物が所定
の半導電領域(104〜101°Ω・c+++)になら
ないばかりか、電気特性の安定化効果が得られないから
である。通常、上記脱触媒処理、特に第2段階の脱触媒
処理を行うことにより、酸化重合触媒の残存量は上記の
範囲内におさまるようになる。As a decatalyst treatment, the resulting polymer is immersed in clean water (about room temperature) for one to two days and nights. If necessary, the second step is room temperature to i o o
Immersion is continued for 1 to 7 days, preferably 3 days, in clean water of 'c', and the immersion is terminated when the OpH value on the surface of the polymer becomes approximately neutral. The amount of the oxidative polymerization catalyst remaining in the semiconductive resin composition that has been subjected to the decatalyst treatment in this manner must be set to 10% by weight or less, preferably 5% by weight or less. In other words, if the remaining amount of the oxidative polymerization catalyst exceeds 10 weight, the semiconductive resin composition will not only fail to reach the predetermined semiconductive range (104 to 101°Ω·c+++), but also will not have the effect of stabilizing the electrical properties. This is because it cannot be done. Usually, by performing the above-mentioned decatalyst treatment, particularly the second-stage decatalyst treatment, the remaining amount of the oxidative polymerization catalyst comes to fall within the above range.
このようにして得られる半導電性樹脂組成物は、脱触媒
処理を施しているため、所定の半導電性を呈するうえ、
半導電性樹脂組成物中の酸化重合触媒の残存量が少なく
なっていることから電気特性が安定している(環境依存
性が小さくなる)。Since the semiconductive resin composition obtained in this way has been subjected to a decatalytic treatment, it not only exhibits a predetermined semiconductivity, but also
Since the residual amount of the oxidative polymerization catalyst in the semiconductive resin composition is small, the electrical properties are stable (environmental dependence is reduced).
以上のように、この発明の半導電性樹脂組成物は、半導
電性樹脂組成物中の酸化重合触媒の残存量がある・特定
値以下であるため、電気特性が安定している(環境依存
性が小さくなる)。そのうえ、この半導電性樹脂組成物
は導電性を示す酸化重合触媒が脱触媒処理により低減さ
れていることから、適正な半導電領域になっている。し
たがって、この半導電性樹脂組成物は、電子写真複写機
の導電性ロールの表面層の形成材料等として好適である
。As described above, the semiconductive resin composition of the present invention has stable electrical properties (environmentally dependent ). Moreover, since the oxidative polymerization catalyst exhibiting conductivity in this semiconductive resin composition has been reduced by the decatalyst treatment, it is in an appropriate semiconductive region. Therefore, this semiconductive resin composition is suitable as a material for forming the surface layer of a conductive roll of an electrophotographic copying machine.
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
[実施例1]
メタノール325戚に6/66/610三元共重合ナイ
ロン(東し社製、に−80)ポリウレタン樹脂50gを
溶解した溶液にビロール重量比9%の割合にしてビロー
ルを添加し撹拌しながら温度−20°Cに保った。この
溶液にベルオキソジ硫酸ナトリウムの2モル水溶液10
0dを撹拌速度400rpmで撹拌しながら約30分間
を要して滴下した。6時間後に上記重合溶液を水に投入
し凝集させてゴム状塊を作製し反応を停止させ、回収後
上記重合物であるゴム状塊をそのままではなく、少しほ
ぐしたりまたは薄く延ばしたりして膨潤し易い状態にし
、72時間流水(温度60″C)に浸漬した。つぎに、
室温下で24時間風乾した後、さらに温度50°Cで2
4時間真空乾燥しゴム塊状の半導電性樹脂組成物を得た
。回収率は98%であった。残存触媒量は、フラスコ燃
焼法で作製した上記半導電性樹脂組成物の検液を原子吸
光分光度計で測定して求めた。その結果、残存触媒■は
マトリックスポリマーに対して3.8%であった。さら
に、得られたゴム塊状の半導電性樹脂組成物をメタノー
ル(溶媒)に溶かしてガラス板上に延ばし顕微鏡で観察
した結果、上記組成物中のポリピロールの平均粒径0.
4μmであった。つぎに、得られた半導電性樹脂組成物
の体積抵抗率を測定(測定条件:高温高温(30°CX
85RH%)、低温低湿(10’CX 23 RH%)
)シ、環境依存性に対する影響を調べた。[Example 1] Virol was added to a solution of 50 g of 6/66/610 ternary copolymerized nylon (manufactured by Toshi Co., Ltd., NI-80) polyurethane resin dissolved in methanol 325 at a ratio of 9% by weight of virol. The temperature was maintained at -20°C while stirring. Add 10% of a 2 molar aqueous solution of sodium beroxodisulfate to this solution.
0d was added dropwise over about 30 minutes while stirring at a stirring speed of 400 rpm. After 6 hours, the above polymerization solution is poured into water and coagulated to create a rubbery mass to stop the reaction, and after recovery, the rubbery mass that is the polymer is not left as it is, but is slightly loosened or spread thin to swell. It was made into a state where it could be easily washed and immersed in running water (temperature 60''C) for 72 hours.Next,
After air drying at room temperature for 24 hours, further drying at 50°C for 2
Vacuum drying was performed for 4 hours to obtain a semiconductive resin composition in the form of a rubber block. The recovery rate was 98%. The amount of residual catalyst was determined by measuring a test solution of the semiconductive resin composition prepared by the flask combustion method using an atomic absorption spectrometer. As a result, the residual catalyst (■) was 3.8% based on the matrix polymer. Further, the obtained semiconductive resin composition in the form of a rubber lump was dissolved in methanol (solvent), spread on a glass plate, and observed under a microscope. As a result, the average particle size of the polypyrrole in the composition was 0.
It was 4 μm. Next, the volume resistivity of the obtained semiconductive resin composition was measured (measurement conditions: high temperature (30°C
85RH%), low temperature and low humidity (10'CX 23RH%)
), and the influence on environmental dependence was investigated.
〔実施例2,3]
ビロール重量比を13%、17%に代えた。それ以外は
実施例1と同様にして半導電性樹脂組成物を得、残存触
媒量と環境依存性を調べた。残存触媒量は、各々2.1
%、6.3%であった。[Examples 2 and 3] The weight ratio of virol was changed to 13% and 17%. Other than that, a semiconductive resin composition was obtained in the same manner as in Example 1, and the amount of residual catalyst and environmental dependence were examined. The amount of remaining catalyst is 2.1 each.
%, 6.3%.
〔比較例1]
脱触媒処理(72時間流水に浸漬)を行わなかった。そ
れ以外は実施例1と同様にして半導電性樹脂組成物を得
、残存触媒量と環境依存性を調べた。残存触媒量は18
.7%であった。[Comparative Example 1] Decatalyst treatment (immersion in running water for 72 hours) was not performed. Other than that, a semiconductive resin composition was obtained in the same manner as in Example 1, and the amount of residual catalyst and environmental dependence were examined. The amount of remaining catalyst is 18
.. It was 7%.
(比較例2.3〕
脱触媒処理(72時間流水に浸漬)を行わなかった。そ
れ以外は実施例2と同様にして半導電性樹脂組成物を得
、残存触媒量と環境依存性を調べた。残存触媒量は、各
々20.3%、21.2%であった。(Comparative Example 2.3) Decatalyst treatment (immersion in running water for 72 hours) was not performed.Other than that, a semiconductive resin composition was obtained in the same manner as in Example 2, and the amount of residual catalyst and environmental dependence were examined. The remaining catalyst amounts were 20.3% and 21.2%, respectively.
このようにして得られた環境依存性の測定結果を図に示
す。変動幅Aは実施例1.変動幅Bは実施例2.変動幅
Cは実施例3.変動幅りは比較例1、変動幅Eは比較例
2.変動幅Fは比較例3である。The measurement results of environmental dependence obtained in this way are shown in the figure. The variation range A is as in Example 1. The variation range B is as in Example 2. The variation width C is as in Example 3. The fluctuation range is in Comparative Example 1, and the fluctuation range E is in Comparative Example 2. The fluctuation range F is the third comparative example.
上記の結果より、実施別品はいずれも比較別品に比べて
体積抵抗率の変動幅が小さい。したがって、電気特性が
安定しており環境依存性が小さいのがわかる。From the above results, the range of variation in volume resistivity is smaller for all the implemented products than for the comparative products. Therefore, it can be seen that the electrical characteristics are stable and the environmental dependence is small.
図は脱触媒処理の有無による電気的特性の関係を示す図
である。
特許出願人 東海ゴム工業株式会社
代理人 弁理士 西 藤 征 彦The figure is a diagram showing the relationship between electrical characteristics depending on the presence or absence of decatalyst treatment. Patent applicant: Tokai Rubber Industries Co., Ltd. Agent: Yukihiko Nishifuji, patent attorney
Claims (1)
る樹脂組成物であつて、脱触媒によつてピロール重合用
の酸化重合触媒の残存量が10重量%以下に設定されて
いることを特徴とする半導電性樹脂組成物。(1) A resin composition in which polypyrrole is distributed in a matrix resin, characterized in that the residual amount of the oxidative polymerization catalyst for pyrrole polymerization is set to 10% by weight or less by decatalyzing. Semiconductive resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20224188A JPH0249055A (en) | 1988-08-11 | 1988-08-11 | Electrically semiconducting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20224188A JPH0249055A (en) | 1988-08-11 | 1988-08-11 | Electrically semiconducting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0249055A true JPH0249055A (en) | 1990-02-19 |
Family
ID=16454292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20224188A Pending JPH0249055A (en) | 1988-08-11 | 1988-08-11 | Electrically semiconducting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249055A (en) |
-
1988
- 1988-08-11 JP JP20224188A patent/JPH0249055A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100856954B1 (en) | Novel polythiophene dispersions | |
EP0160207B1 (en) | Processable conductive polymers | |
US4578433A (en) | Long-term stability of the electrical conductivity of pyrrole polymers | |
JPS61278526A (en) | Conductive solution and formation of conductive product fromsaid solution | |
EP2947126A1 (en) | Conductive polymer composite and substrate | |
EP3693979B1 (en) | Conductive polymer composite and conductive polymer composition | |
JP3977289B2 (en) | Conductive composition | |
JP3066431B2 (en) | Method for producing conductive polymer composite | |
KR20170024549A (en) | Conductive polymer composite and substrate | |
JPH0249055A (en) | Electrically semiconducting resin composition | |
JPS63500461A (en) | Conductive polythiophene and its manufacturing method | |
SE450062B (en) | PREPARATION OF AN ELECTRICALLY LEADING LAYER FROM A WATER SOLUTION CONTAINING A WATER SOLUBLE POLYMER AND A PYROLE | |
JPH0250187A (en) | Conductive roll | |
JPH0249056A (en) | Electrically semiconducting resin composition | |
JPH01304117A (en) | Preparation of polypyrrole latex and use of said latex for forming conductive film | |
JPH0250172A (en) | Conductive roll | |
JP2006182958A (en) | Conductive particulate and method for producing the same | |
WO2002010251A1 (en) | Method for making polypyrrole | |
JPH0249066A (en) | Electrically conductive resin composition | |
JP2005139262A (en) | Conductive composition, conductive coating and conductive resin | |
KR0149830B1 (en) | Process for preparing an aqueous and conductive high molecular compound and its composite | |
JP2003238773A (en) | Conductive composition | |
JPH0250188A (en) | Conductive roll | |
JP3296369B2 (en) | Conductive polymer composite latex and method for producing the same | |
US9156923B2 (en) | Oxidizing agent useful for oxidative polymerization of high conductive polymers |