JPH0249055A - Electrically semiconducting resin composition - Google Patents

Electrically semiconducting resin composition

Info

Publication number
JPH0249055A
JPH0249055A JP20224188A JP20224188A JPH0249055A JP H0249055 A JPH0249055 A JP H0249055A JP 20224188 A JP20224188 A JP 20224188A JP 20224188 A JP20224188 A JP 20224188A JP H0249055 A JPH0249055 A JP H0249055A
Authority
JP
Japan
Prior art keywords
resin composition
catalyst
nylon
pyrrole
oxidative polymerization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20224188A
Other languages
Japanese (ja)
Inventor
Kazunobu Hashimoto
和信 橋本
Saburo Hayashi
三郎 林
Ko Ishihara
石原 興
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Riko Co Ltd
Original Assignee
Sumitomo Riko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Riko Co Ltd filed Critical Sumitomo Riko Co Ltd
Priority to JP20224188A priority Critical patent/JPH0249055A/en
Publication of JPH0249055A publication Critical patent/JPH0249055A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain an electrically semiconducting resin composition, containing polypyrrole distributed in a matrix resin having stabilized electrical characteristics by reducing the residual amount of an oxidative polymerization catalyst for pyrrole to a specific value or below by removing the catalyst. CONSTITUTION:An electrically semiconducting resin composition obtained by dissolving (A) a matrix resin (e.g., nylon 6/nylon 66/nylon 610 terpolymer nylon) in an organic solvent (e.g., methanol), then adding (B) a pyrrole monomer (e.g., N-alkylpyrrole), stirring the resultant solution at -40 to 0 deg.C temperature, subsequently adding (C) an oxidative polymerization catalyst for polymerizing the pyrrole in an amount of 0.5-4mol based on 1mol component (B), polymerizing the monomer and dipping the obtained polymer in clean water for 1 to 2 days and nights to remove the catalyst (preferably in two stages) at (71/29)-(99/1) ratio of the component (A) to pyrrole with <=10wt.%, preferably <=5wt.% residual amount of the component (C).

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は電子写真複写機の導電性ロール等に用いられ
る半導電性樹脂組成物に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductive resin composition used for conductive rolls of electrophotographic copying machines and the like.

〔従来の技術〕[Conventional technology]

近年、加工性に富み軽量でコスト的にも安価な導電性高
分子組成物が注目されており、このような導電性高分子
組成物は上記特性を生かして広範囲な分野に応用可能と
されている。しかしながら、従来知られている導電性高
分子組成物は、その大部分のものが上記のような分野に
使用されるには未だ充分な電気特性の安定性等を備えて
いない。ここで、導電性高分子組成物とは、ポリアセチ
レン、ポリピロール、ポリチオフェン等の高分子単体で
導電性を有している高分子を導電材としてマトリックス
樹脂中に含有する樹脂組成物のことをさす。例えば、特
開昭60−223854号公報には、熱可塑性樹脂溶液
(A )とポリピロールCB)との割合(重量%)が(
A)/ (B)=70/30〜20/80の範囲になっ
ている導電性樹脂組成物が開示されている。この組成物
は、例えば、上記混合溶液に、パーオキソ酸塩等の酸素
含有酸化剤を触媒として作用させピロールを重合させる
ことにより導電性樹脂組成物を得る方法が開示されてい
る。
In recent years, conductive polymer compositions that are highly processable, lightweight, and inexpensive have attracted attention, and it is believed that such conductive polymer compositions can be applied to a wide range of fields by taking advantage of the above characteristics. There is. However, most of the conventionally known conductive polymer compositions do not yet have sufficient stability of electrical properties to be used in the above fields. Here, the conductive polymer composition refers to a resin composition containing a conductive polymer such as polyacetylene, polypyrrole, or polythiophene in a matrix resin as a conductive material. For example, in JP-A No. 60-223854, the ratio (wt%) of the thermoplastic resin solution (A) and polypyrrole CB) is (
A conductive resin composition in which A)/(B)=70/30 to 20/80 is disclosed. This composition discloses a method of obtaining a conductive resin composition by, for example, causing the above mixed solution to act as a catalyst with an oxygen-containing oxidizing agent such as a peroxoacid salt to polymerize pyrrole.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、上記方法によって得られる導電性樹脂組
成物は、上記触媒が導電性を示す(ドープ剤の作用を有
する)ため、導電領域のものであり、半導電領域を示さ
ない。しがも、電気特性が大きく変動しく環境依存性が
大きい)不安定なものである。このように、従来は、適
性な半導電領域を有するものが得られていないというの
が実情である。
However, the conductive resin composition obtained by the above method is in a conductive region and does not exhibit a semiconductive region because the catalyst exhibits conductivity (has the action of a doping agent). However, it is unstable (its electrical characteristics fluctuate widely and is highly dependent on the environment). As described above, the reality is that conventionally it has not been possible to obtain a material having an appropriate semiconducting region.

この発明は、このような事情に鑑みなされたもので、安
定した電気特性(環境依存性が小さい)を有する半導電
性樹脂組成物の提供をその目的とする。
The present invention was made in view of the above circumstances, and an object thereof is to provide a semiconductive resin composition having stable electrical properties (low environmental dependence).

〔問題点を解決するための手段〕[Means for solving problems]

上記の目的を達成するため、この発明の半導電性樹脂組
成物は、マトリックス樹脂中にポリピロールが分布して
いる樹脂組成物であって、脱触媒によって、ビロール重
合用の酸化重合触媒の残存量が10重世%以下に設定さ
れているという構成をとる。
In order to achieve the above object, the semiconductive resin composition of the present invention is a resin composition in which polypyrrole is distributed in a matrix resin, and the remaining amount of oxidative polymerization catalyst for pyrrole polymerization is reduced by removing the catalyst. is set to less than 10%.

〔作用〕[Effect]

すなわち、本発明者らは、導電性樹脂組成物ではなく、
半導電性樹脂組成物を得るため、電気特性が変動する要
因について研究した。その研究の過程で、本発明者らは
、樹脂組成物中に含まれているビロール重合用の酸化重
合触媒(導電性付与作用を有する)が半導電性樹脂組成
物の電気特性の安定性に大きな影響を及ぼすことを突き
止めた。すなわち、通常、酸化重合触媒は潮解性を有し
ており、そのためこのような潮解性を有する触媒が残存
している半導電性樹脂組成物は触媒の吸水作用により電
気特性が大きく変動することになる(環境依存性が大き
くなる)ことを突き止めた。
That is, the present inventors did not use a conductive resin composition, but
In order to obtain semiconductive resin compositions, we investigated the factors that cause changes in electrical properties. In the course of the research, the present inventors discovered that the oxidative polymerization catalyst for virole polymerization (which has an effect of imparting conductivity) contained in the resin composition has an effect on the stability of the electrical properties of the semiconductive resin composition. It turns out that it has a big impact. In other words, oxidative polymerization catalysts usually have deliquescent properties, and therefore, the electrical properties of semiconductive resin compositions in which such deliquescent catalysts remain will vary greatly due to the water absorption effect of the catalyst. (environmental dependence increases).

そして、この酸化重合触媒の含有量を中心にさらに研究
を重ねた結果、触媒が残存している樹脂組成物に脱触媒
処理を施し触媒の残存量をある特定の値以下に低減させ
ると、上記樹脂組成物を半導電領域に誘導できると同時
に、その電気特性を安定化させうることを見出しこの発
明に到達した。
As a result of further research focusing on the content of this oxidative polymerization catalyst, we found that if the resin composition in which the catalyst remains is subjected to decatalyst treatment and the residual amount of the catalyst is reduced to below a certain value, the above-mentioned The inventors have discovered that it is possible to induce a resin composition into a semiconductive region and at the same time stabilize its electrical properties, and have arrived at this invention.

この発明の半導電性樹脂組成物は、マトリックス樹脂と
、ビロールモノマーと、ビロール重合用の酸化重合触媒
とを用いて得られる。
The semiconductive resin composition of the present invention is obtained using a matrix resin, a virol monomer, and an oxidative polymerization catalyst for virol polymerization.

上記マトリックス樹脂としては、ナイロン6−ナイロン
66−ナイロン61〇三元共重合体ナイロン、N−メト
キシメチルナイロン、ポリメチルメタクリレート、ポリ
酢酸ビニル、エチレン−酢酸ビニル共重合体、ポリ塩化
ビニル、アクリルニトリル−ブタジェン−スチレン共重
合体樹脂(ABS樹脂)、ポリオレフィン、ポリ塩化ビ
ニリデン、ポリビニルアルコール、ポリエーテルである
ポリ−2,5−フェニルエーテル等の熱可塑性樹脂、不
飽和ポリエステル、エポキシ樹脂、ジアリルフタレート
樹脂、シリコン樹脂、ボリウレクン樹脂等の熱硬化性樹
脂等があげられる。
Examples of the matrix resin include nylon 6-nylon 66-nylon 610 ternary copolymer nylon, N-methoxymethyl nylon, polymethyl methacrylate, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyvinyl chloride, and acrylonitrile. - Butadiene-styrene copolymer resin (ABS resin), polyolefin, polyvinylidene chloride, polyvinyl alcohol, thermoplastic resin such as polyether poly-2,5-phenyl ether, unsaturated polyester, epoxy resin, diallyl phthalate resin , silicone resin, thermosetting resin such as Polyurekne resin, and the like.

上記ビロールモノマーとしては、ビロール自体(7)他
、!10ヒロール、N−アルキルピロール、N−アリー
ルビロール、3および4の炭素位でモノアルキル置換ま
たはジアルキル置換されたビロールおよび3および4の
炭素位でモノハロゲン置換またはジハロゲン置換された
ビロール等があげられる。この発明においては、ビロー
ルは、単独でもしくは上記ビロールモノマーと他の化合
物との混合物としても使用できる。場合により他の複素
環化合物、例えばフラン、チオフェンまたはチアゾール
を上記ビロールモノマーの一部に代えて用いてもよい。
Examples of the virol monomer include virol itself (7) and others! 10-hyrol, N-alkylpyrrole, N-arylvirol, virol substituted with monoalkyl or dialkyl at the 3rd and 4th carbon positions, virol substituted with monohalogen or dihalogen at the 3rd and 4th carbon positions, etc. It will be done. In this invention, virol can be used alone or as a mixture of the virol monomer and other compounds. Optionally, other heterocyclic compounds such as furan, thiophene or thiazole may be used in place of some of the virol monomers.

上記マトリックス樹脂(X)とポリピロール(Y)との
配合割合(重量%)は、(X)/ (Y)が71/29
〜99/1の範囲内でX+Y=100に設、定されるの
が好ましい。すなわち、上記範囲を外れると、加工性等
に優れた半導電性樹脂組成物が得られなくなるからであ
る。したがって、各原料配合に際し、ビロールモノマー
の配合量は上記(X)/ (Y)値を満たすように設定
するのが好適である。
The blending ratio (wt%) of the matrix resin (X) and polypyrrole (Y) is (X)/(Y) 71/29
It is preferable to set X+Y=100 within the range of 99/1. That is, if it is outside the above range, a semiconductive resin composition with excellent processability etc. cannot be obtained. Therefore, when blending each raw material, it is preferable to set the blending amount of the virol monomer so as to satisfy the above (X)/(Y) value.

上記ピロール重合用の酸化重合触媒としては、鉄、アル
ミニウム、銅、白金等の金属塩化物、過硫酸ナトリウム
、過硫酸カリウム、過硫酸アンモニウム等の過硫酸塩、
重クロム酸カリウム等の無機系過酸化物、過硫酸塩−酸
性亜硫酸ナトリウム、過酸化水素−第一鉄塩、クメンヒ
ドロペルオキシド−第一鉄塩、過酸化ベンゾイル−ジメ
チルアニリル等のレドックス触媒等があげられる。
The oxidative polymerization catalyst for the above-mentioned pyrrole polymerization includes metal chlorides such as iron, aluminum, copper, and platinum, persulfates such as sodium persulfate, potassium persulfate, and ammonium persulfate;
Redox catalysts such as inorganic peroxides such as potassium dichromate, persulfate-acidic sodium sulfite, hydrogen peroxide-ferrous salt, cumene hydroperoxide-ferrous salt, benzoyl peroxide-dimethylanilyl, etc. can be given.

上記酸化重合触媒の配合割合は、ビロールモノマー1モ
ルに対して上記酸化重合触媒が0.5〜4モルとなるよ
うに配合することが好適である。
The mixing ratio of the oxidative polymerization catalyst is preferably 0.5 to 4 moles per 1 mole of the pyrrole monomer.

さらに、上記原料以外に、上記マトリックス樹脂、ビロ
ールモノマー、酸化重合触媒を混合溶解させるための有
機溶剤が用いられる。
Furthermore, in addition to the above raw materials, an organic solvent is used to mix and dissolve the above matrix resin, pyrrole monomer, and oxidative polymerization catalyst.

上記有機溶剤としては、メタノール、エタノール、2−
プロパツール等のアルコール類、ジメチルエーテル、ジ
エチルエーテル、テトラヒドロフラン、ジオキサン等の
エーテル類、ジメチルスルホキシド、N、N’−ジメチ
ルホルムアミド、N−メチル−2−ピロリドン、アセト
ニトリル、エチレンカルボナートおよびギ酸等があげら
れ、単独でもしくは併せて用いられる。
Examples of the organic solvent include methanol, ethanol, 2-
Examples include alcohols such as propatool, ethers such as dimethyl ether, diethyl ether, tetrahydrofuran, and dioxane, dimethyl sulfoxide, N,N'-dimethylformamide, N-methyl-2-pyrrolidone, acetonitrile, ethylene carbonate, and formic acid. , used alone or in combination.

この発明の半導電性樹脂組成物は、上記各原料を用いて
、例えばつぎのようにして製造される。
The semiconductive resin composition of the present invention is produced using the above-mentioned raw materials, for example, in the following manner.

すなわち、まず有機溶剤にマトリックス樹脂を溶解させ
、これにビロールを添加し温度−40〜0°C下で撹拌
する。つぎに、この溶液に重合触媒を加えビロールを重
合させた後、この重合溶液を水中に投入し重合物を凝集
させ反応を停止させる。
That is, first, a matrix resin is dissolved in an organic solvent, virol is added thereto, and the mixture is stirred at a temperature of -40 to 0°C. Next, a polymerization catalyst is added to this solution to polymerize virole, and then this polymerization solution is poured into water to coagulate the polymer and stop the reaction.

ぞして、脱触媒処理として、得られた重合物を清浄な水
(常温程度)で1〜2昼夜浸漬することにより製造され
る。必要な場合には、第2段階として常温〜i o o
 ’cの清浄な水で1〜7日間、好ましくは3日間浸漬
を続け、重合物表面OpH値が略中性を示す時点で浸漬
を終了させることが行われる。このようにして脱触媒処
理が施された半導電性樹脂組成物中の酸化重合触媒の残
存量は10重量%以下、好ましくは5重量%以下に設定
されなければならない。すなわち、酸化重合触媒の残存
量が10重重量を超えると、半導電性樹脂組成物が所定
の半導電領域(104〜101°Ω・c+++)になら
ないばかりか、電気特性の安定化効果が得られないから
である。通常、上記脱触媒処理、特に第2段階の脱触媒
処理を行うことにより、酸化重合触媒の残存量は上記の
範囲内におさまるようになる。
As a decatalyst treatment, the resulting polymer is immersed in clean water (about room temperature) for one to two days and nights. If necessary, the second step is room temperature to i o o
Immersion is continued for 1 to 7 days, preferably 3 days, in clean water of 'c', and the immersion is terminated when the OpH value on the surface of the polymer becomes approximately neutral. The amount of the oxidative polymerization catalyst remaining in the semiconductive resin composition that has been subjected to the decatalyst treatment in this manner must be set to 10% by weight or less, preferably 5% by weight or less. In other words, if the remaining amount of the oxidative polymerization catalyst exceeds 10 weight, the semiconductive resin composition will not only fail to reach the predetermined semiconductive range (104 to 101°Ω·c+++), but also will not have the effect of stabilizing the electrical properties. This is because it cannot be done. Usually, by performing the above-mentioned decatalyst treatment, particularly the second-stage decatalyst treatment, the remaining amount of the oxidative polymerization catalyst comes to fall within the above range.

このようにして得られる半導電性樹脂組成物は、脱触媒
処理を施しているため、所定の半導電性を呈するうえ、
半導電性樹脂組成物中の酸化重合触媒の残存量が少なく
なっていることから電気特性が安定している(環境依存
性が小さくなる)。
Since the semiconductive resin composition obtained in this way has been subjected to a decatalytic treatment, it not only exhibits a predetermined semiconductivity, but also
Since the residual amount of the oxidative polymerization catalyst in the semiconductive resin composition is small, the electrical properties are stable (environmental dependence is reduced).

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明の半導電性樹脂組成物は、半導
電性樹脂組成物中の酸化重合触媒の残存量がある・特定
値以下であるため、電気特性が安定している(環境依存
性が小さくなる)。そのうえ、この半導電性樹脂組成物
は導電性を示す酸化重合触媒が脱触媒処理により低減さ
れていることから、適正な半導電領域になっている。し
たがって、この半導電性樹脂組成物は、電子写真複写機
の導電性ロールの表面層の形成材料等として好適である
As described above, the semiconductive resin composition of the present invention has stable electrical properties (environmentally dependent ). Moreover, since the oxidative polymerization catalyst exhibiting conductivity in this semiconductive resin composition has been reduced by the decatalyst treatment, it is in an appropriate semiconductive region. Therefore, this semiconductive resin composition is suitable as a material for forming the surface layer of a conductive roll of an electrophotographic copying machine.

つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.

[実施例1] メタノール325戚に6/66/610三元共重合ナイ
ロン(東し社製、に−80)ポリウレタン樹脂50gを
溶解した溶液にビロール重量比9%の割合にしてビロー
ルを添加し撹拌しながら温度−20°Cに保った。この
溶液にベルオキソジ硫酸ナトリウムの2モル水溶液10
0dを撹拌速度400rpmで撹拌しながら約30分間
を要して滴下した。6時間後に上記重合溶液を水に投入
し凝集させてゴム状塊を作製し反応を停止させ、回収後
上記重合物であるゴム状塊をそのままではなく、少しほ
ぐしたりまたは薄く延ばしたりして膨潤し易い状態にし
、72時間流水(温度60″C)に浸漬した。つぎに、
室温下で24時間風乾した後、さらに温度50°Cで2
4時間真空乾燥しゴム塊状の半導電性樹脂組成物を得た
。回収率は98%であった。残存触媒量は、フラスコ燃
焼法で作製した上記半導電性樹脂組成物の検液を原子吸
光分光度計で測定して求めた。その結果、残存触媒■は
マトリックスポリマーに対して3.8%であった。さら
に、得られたゴム塊状の半導電性樹脂組成物をメタノー
ル(溶媒)に溶かしてガラス板上に延ばし顕微鏡で観察
した結果、上記組成物中のポリピロールの平均粒径0.
4μmであった。つぎに、得られた半導電性樹脂組成物
の体積抵抗率を測定(測定条件:高温高温(30°CX
85RH%)、低温低湿(10’CX 23 RH%)
)シ、環境依存性に対する影響を調べた。
[Example 1] Virol was added to a solution of 50 g of 6/66/610 ternary copolymerized nylon (manufactured by Toshi Co., Ltd., NI-80) polyurethane resin dissolved in methanol 325 at a ratio of 9% by weight of virol. The temperature was maintained at -20°C while stirring. Add 10% of a 2 molar aqueous solution of sodium beroxodisulfate to this solution.
0d was added dropwise over about 30 minutes while stirring at a stirring speed of 400 rpm. After 6 hours, the above polymerization solution is poured into water and coagulated to create a rubbery mass to stop the reaction, and after recovery, the rubbery mass that is the polymer is not left as it is, but is slightly loosened or spread thin to swell. It was made into a state where it could be easily washed and immersed in running water (temperature 60''C) for 72 hours.Next,
After air drying at room temperature for 24 hours, further drying at 50°C for 2
Vacuum drying was performed for 4 hours to obtain a semiconductive resin composition in the form of a rubber block. The recovery rate was 98%. The amount of residual catalyst was determined by measuring a test solution of the semiconductive resin composition prepared by the flask combustion method using an atomic absorption spectrometer. As a result, the residual catalyst (■) was 3.8% based on the matrix polymer. Further, the obtained semiconductive resin composition in the form of a rubber lump was dissolved in methanol (solvent), spread on a glass plate, and observed under a microscope. As a result, the average particle size of the polypyrrole in the composition was 0.
It was 4 μm. Next, the volume resistivity of the obtained semiconductive resin composition was measured (measurement conditions: high temperature (30°C
85RH%), low temperature and low humidity (10'CX 23RH%)
), and the influence on environmental dependence was investigated.

〔実施例2,3] ビロール重量比を13%、17%に代えた。それ以外は
実施例1と同様にして半導電性樹脂組成物を得、残存触
媒量と環境依存性を調べた。残存触媒量は、各々2.1
%、6.3%であった。
[Examples 2 and 3] The weight ratio of virol was changed to 13% and 17%. Other than that, a semiconductive resin composition was obtained in the same manner as in Example 1, and the amount of residual catalyst and environmental dependence were examined. The amount of remaining catalyst is 2.1 each.
%, 6.3%.

〔比較例1] 脱触媒処理(72時間流水に浸漬)を行わなかった。そ
れ以外は実施例1と同様にして半導電性樹脂組成物を得
、残存触媒量と環境依存性を調べた。残存触媒量は18
.7%であった。
[Comparative Example 1] Decatalyst treatment (immersion in running water for 72 hours) was not performed. Other than that, a semiconductive resin composition was obtained in the same manner as in Example 1, and the amount of residual catalyst and environmental dependence were examined. The amount of remaining catalyst is 18
.. It was 7%.

(比較例2.3〕 脱触媒処理(72時間流水に浸漬)を行わなかった。そ
れ以外は実施例2と同様にして半導電性樹脂組成物を得
、残存触媒量と環境依存性を調べた。残存触媒量は、各
々20.3%、21.2%であった。
(Comparative Example 2.3) Decatalyst treatment (immersion in running water for 72 hours) was not performed.Other than that, a semiconductive resin composition was obtained in the same manner as in Example 2, and the amount of residual catalyst and environmental dependence were examined. The remaining catalyst amounts were 20.3% and 21.2%, respectively.

このようにして得られた環境依存性の測定結果を図に示
す。変動幅Aは実施例1.変動幅Bは実施例2.変動幅
Cは実施例3.変動幅りは比較例1、変動幅Eは比較例
2.変動幅Fは比較例3である。
The measurement results of environmental dependence obtained in this way are shown in the figure. The variation range A is as in Example 1. The variation range B is as in Example 2. The variation width C is as in Example 3. The fluctuation range is in Comparative Example 1, and the fluctuation range E is in Comparative Example 2. The fluctuation range F is the third comparative example.

上記の結果より、実施別品はいずれも比較別品に比べて
体積抵抗率の変動幅が小さい。したがって、電気特性が
安定しており環境依存性が小さいのがわかる。
From the above results, the range of variation in volume resistivity is smaller for all the implemented products than for the comparative products. Therefore, it can be seen that the electrical characteristics are stable and the environmental dependence is small.

【図面の簡単な説明】[Brief explanation of the drawing]

図は脱触媒処理の有無による電気的特性の関係を示す図
である。 特許出願人  東海ゴム工業株式会社 代理人  弁理士  西 藤 征 彦
The figure is a diagram showing the relationship between electrical characteristics depending on the presence or absence of decatalyst treatment. Patent applicant: Tokai Rubber Industries Co., Ltd. Agent: Yukihiko Nishifuji, patent attorney

Claims (1)

【特許請求の範囲】[Claims] (1)マトリックス樹脂中にポリピロールが分布してい
る樹脂組成物であつて、脱触媒によつてピロール重合用
の酸化重合触媒の残存量が10重量%以下に設定されて
いることを特徴とする半導電性樹脂組成物。
(1) A resin composition in which polypyrrole is distributed in a matrix resin, characterized in that the residual amount of the oxidative polymerization catalyst for pyrrole polymerization is set to 10% by weight or less by decatalyzing. Semiconductive resin composition.
JP20224188A 1988-08-11 1988-08-11 Electrically semiconducting resin composition Pending JPH0249055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20224188A JPH0249055A (en) 1988-08-11 1988-08-11 Electrically semiconducting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20224188A JPH0249055A (en) 1988-08-11 1988-08-11 Electrically semiconducting resin composition

Publications (1)

Publication Number Publication Date
JPH0249055A true JPH0249055A (en) 1990-02-19

Family

ID=16454292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20224188A Pending JPH0249055A (en) 1988-08-11 1988-08-11 Electrically semiconducting resin composition

Country Status (1)

Country Link
JP (1) JPH0249055A (en)

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