JPH0247771U - - Google Patents
Info
- Publication number
- JPH0247771U JPH0247771U JP12591188U JP12591188U JPH0247771U JP H0247771 U JPH0247771 U JP H0247771U JP 12591188 U JP12591188 U JP 12591188U JP 12591188 U JP12591188 U JP 12591188U JP H0247771 U JPH0247771 U JP H0247771U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- abutting
- connecting portion
- metal ball
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12591188U JPH0247771U (xx) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12591188U JPH0247771U (xx) | 1988-09-27 | 1988-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0247771U true JPH0247771U (xx) | 1990-04-03 |
Family
ID=31376937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12591188U Pending JPH0247771U (xx) | 1988-09-27 | 1988-09-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247771U (xx) |
-
1988
- 1988-09-27 JP JP12591188U patent/JPH0247771U/ja active Pending