JPH0247055U - - Google Patents

Info

Publication number
JPH0247055U
JPH0247055U JP12641988U JP12641988U JPH0247055U JP H0247055 U JPH0247055 U JP H0247055U JP 12641988 U JP12641988 U JP 12641988U JP 12641988 U JP12641988 U JP 12641988U JP H0247055 U JPH0247055 U JP H0247055U
Authority
JP
Japan
Prior art keywords
resin
sealed
semiconductor device
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12641988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12641988U priority Critical patent/JPH0247055U/ja
Publication of JPH0247055U publication Critical patent/JPH0247055U/ja
Pending legal-status Critical Current

Links

JP12641988U 1988-09-27 1988-09-27 Pending JPH0247055U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12641988U JPH0247055U (US20090163788A1-20090625-C00002.png) 1988-09-27 1988-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12641988U JPH0247055U (US20090163788A1-20090625-C00002.png) 1988-09-27 1988-09-27

Publications (1)

Publication Number Publication Date
JPH0247055U true JPH0247055U (US20090163788A1-20090625-C00002.png) 1990-03-30

Family

ID=31377926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12641988U Pending JPH0247055U (US20090163788A1-20090625-C00002.png) 1988-09-27 1988-09-27

Country Status (1)

Country Link
JP (1) JPH0247055U (US20090163788A1-20090625-C00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (ja) * 2006-03-31 2007-10-18 Icom Inc 半導体素子固定用クリップ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (ja) * 2006-03-31 2007-10-18 Icom Inc 半導体素子固定用クリップ

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