JPH0246604U - - Google Patents
Info
- Publication number
- JPH0246604U JPH0246604U JP12672888U JP12672888U JPH0246604U JP H0246604 U JPH0246604 U JP H0246604U JP 12672888 U JP12672888 U JP 12672888U JP 12672888 U JP12672888 U JP 12672888U JP H0246604 U JPH0246604 U JP H0246604U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- upper mold
- ring member
- circumferential surface
- split
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案にかかる成形型装置の一実施例
を示す縦断面図、第２図は第１図実施例の組立要
領を説明するための分解斜視図、第３図は従来例
を示す縦断面図である。
１０…成形型装置、１１…下型、１１ａ…保持
孔、１２…芯型、１２ａ…保持部、１２ｂ…外周
面、１３Ａ，１３Ｂ…割型、１３Ａａ，１３Ｂａ
…内周面、１３Ａｂ，１３Ｂｂ…外周面、１４…
リング部材、１４ａ…内周面、１４ｂ…端面、１
５…弾性部材、１６…上型本体、１６ａ…一面、
１６ｂ…導入孔、１７…上型、１８…キヤビテイ
。
Fig. 1 is a longitudinal sectional view showing an embodiment of the molding device according to the present invention, Fig. 2 is an exploded perspective view for explaining the assembly procedure of the embodiment in Fig. 1, and Fig. 3 shows a conventional example. FIG. DESCRIPTION OF SYMBOLS 10 ... Molding mold device, 11... Lower mold, 11a... Holding hole, 12... Core mold, 12a... Holding part, 12b... Outer peripheral surface, 13A, 13B... Split mold, 13Aa, 13Ba
...Inner peripheral surface, 13Ab, 13Bb...Outer peripheral surface, 14...
Ring member, 14a...inner peripheral surface, 14b...end surface, 1
5... Elastic member, 16... Upper mold body, 16a... One side,
16b...Introduction hole, 17...Upper mold, 18...Cavity.
Claims (1)
配置される割型を上型によつて押圧することによ
り型締してなる成形型装置において、 (a) 割型の外周面に対し内周面が接触して配設
されるリング部材と、 (b) リング部材の端面に対し弾性部材を介して
配設される上型本体と を上型が包有してなることを特徴とする成形型装
置。[Claims for Utility Model Registration] In a mold device that clamps a split mold placed against the outer peripheral surface of a core mold supported by a lower mold by pressing it with an upper mold, The upper mold connects a) a ring member disposed with its inner circumferential surface in contact with the outer circumferential surface of the split mold, and (b) an upper mold body disposed against the end surface of the ring member via an elastic member. A molding device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12672888U JPH0246604U (en) | 1988-09-28 | 1988-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12672888U JPH0246604U (en) | 1988-09-28 | 1988-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246604U true JPH0246604U (en) | 1990-03-30 |
Family
ID=31378504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12672888U Pending JPH0246604U (en) | 1988-09-28 | 1988-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246604U (en) |
-
1988
- 1988-09-28 JP JP12672888U patent/JPH0246604U/ja active Pending