JPH0246073B2 - - Google Patents

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Publication number
JPH0246073B2
JPH0246073B2 JP57166065A JP16606582A JPH0246073B2 JP H0246073 B2 JPH0246073 B2 JP H0246073B2 JP 57166065 A JP57166065 A JP 57166065A JP 16606582 A JP16606582 A JP 16606582A JP H0246073 B2 JPH0246073 B2 JP H0246073B2
Authority
JP
Japan
Prior art keywords
parts
acid
epoxy
precondensate
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57166065A
Other languages
Japanese (ja)
Other versions
JPS5956459A (en
Inventor
Hidehiko Kojo
Koji Akimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP16606582A priority Critical patent/JPS5956459A/en
Publication of JPS5956459A publication Critical patent/JPS5956459A/en
Publication of JPH0246073B2 publication Critical patent/JPH0246073B2/ja
Granted legal-status Critical Current

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  • Paints Or Removers (AREA)

Description

【発明の詳现な説明】[Detailed description of the invention]

本発明は新芏な氎分散型金属防蝕甚塗料組成物
に関するものである。さらに詳しくは、特定のキ
レヌト反応性゚ポキシ暹脂の氎分散物ず掻性有機
硬化剀を含む氎分散型防蝕甚塗料組成物に関する
ものである。特に錆の認められない銅板や脱錆鋌
板は勿論のこず、発錆鋌板あるいは䞋地凊理の䞍
備な鋌板及び亜鉛鋌板、アルミ、ステンレス等に
察しおすぐれた密着性及び防蝕性を有する塗料甚
組成物に関するものである。 埓来の氎分散型゚ポキシ暹脂塗料は、溶剀型゚
ポキシ暹脂塗料に比べお密着性や特に防蝕性が著
しく劣り、防錆を目的ずした金属保護塗料ずしお
は䜿甚できず、も぀ぱら建材関係のマスチツク塗
料が䞻たる甚途である。 本発明の目的は、氎分散型゚ポキシ暹脂塗料ず
しお、金属に察しおすぐれた密着性ず耐蝕性を有
する塗料甚暹脂組成物を提䟛するこずにあり、本
発明者らはかかる目的のために鋭意研究の結果本
発明に到達した。 即ち、本発明の塗料組成物は必須の構成成分ず
しお (A) オルトリン酞、メタリン酞、ピロリン酞、亜
リン酞、ポリリン酞、ホスホン酞、ホスフむン
酞から遞ばれる皮以䞊の−OH結合を少な
くずも個有するリンの酞、その゚ステル又は
塩ず゚ポキシ暹脂ずを、゚ポキシ基が残存する
割合で加熱凊理しお埗られる゚ポキシ暹脂甚硬
化剀で硬化し埗る暹脂の氎分散物ず、 (B) ゚ポキシ暹脂甚掻性有機硬化剀 ずを含有するこずを特城ずするものである。 本発明の組成物の必須成分である予備瞮合物
は、゚ポキシ暹脂ず、リン酞類、氎酞基を含有す
るリン酞゚ステル類又はそれらの塩類等ずを、゚
ポキシ基が残存する割合で溶剀の存圚䞋又は䞍存
圚䞋に加熱凊理するこずにより埗られる。 加熱枩床ずしおは、特に限定はないが、゚ポキ
シ暹脂の分解が起こらず、䞔぀適圓な時間で反応
が終了するべく50〜130℃で行うのが良い。 ここで䜿甚する゚ポキシ暹脂ずしおは、 匏
The present invention relates to a novel water-dispersible coating composition for metal corrosion protection. More specifically, the present invention relates to a water-dispersed anticorrosion coating composition containing a water dispersion of a specific chelate-reactive epoxy resin and an active organic curing agent. A paint composition that has excellent adhesion and corrosion resistance to not only rust-free copper plates and derusted steel plates, but also rusted steel plates or poorly prepared steel plates, galvanized steel plates, aluminum, stainless steel, etc. It is related to. Conventional water-dispersed epoxy resin paints have significantly inferior adhesion and especially corrosion resistance compared to solvent-based epoxy resin paints, and cannot be used as metal protection paints for rust prevention purposes, and are mainly used as mastic paints for building materials. is the main use. The purpose of the present invention is to provide a resin composition for a water-dispersed epoxy resin paint that has excellent adhesion to metals and corrosion resistance, and the present inventors have made extensive efforts for this purpose. As a result of research, we have arrived at the present invention. That is, the coating composition of the present invention contains (A) one or more P-OH bonds selected from orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, polyphosphoric acid, phosphonic acid, and phosphinic acid as an essential component. (B) an aqueous dispersion of a resin that can be cured with an epoxy resin curing agent obtained by heat-treating at least one phosphorus acid, ester or salt thereof, and an epoxy resin in a proportion that leaves epoxy groups; It is characterized by containing an active organic curing agent for epoxy resin. The precondensate, which is an essential component of the composition of the present invention, is a mixture of an epoxy resin and a phosphoric acid, a hydroxyl group-containing phosphate ester, or a salt thereof in the presence of a solvent or in a proportion that leaves the epoxy group. Obtained by heat treatment in its absence. The heating temperature is not particularly limited, but it is preferably 50 to 130°C in order to prevent decomposition of the epoxy resin and to complete the reaction in an appropriate time. The epoxy resin used here has the formula

【匏】 は、CH3、C2H5基 で瀺される眮換又は非眮換のグリシゞル゚ヌテル
基を分子内に個より倚く有するもの等皮々のも
のを甚いるこずができ、゚ポキシ圓量には特に制
限はないが、奜たしくぱポキシ圓量200〜1000
皋床のものが良い。 本発明に甚いられる少なくずも個の−OH
結合を有するリンの酞ずしおは、䟋えばオルトリ
ン酞、メタリン酞、ピロリン酞、亜リン酞、ポリ
リン酞、ホスホン酞、ホスフむン酞等が挙げら
れ、特にオルトリン酞が奜たしい。 又、リンの酞の゚ステルずしおは䞊蚘のリンの
酞の゚ステル、奜たしくは炭玠原子数皋床迄の
アルキル゚ステル氎酞基を個以䞊有するも
の及びヒドロキシアルキル゚ステル、䟋えば、
゚チル、−ブチル、−゚チルヘキシル、ヒド
ロキシ゚チル、ヒドロキシブチル、ヒドロキシプ
ロピル、ヒドロキシペンチル等の基を持぀ものが
挙げられ、特に−ブチル又は−゚チルヘキシ
ルのモノ又はゞ−リン酞゚ステルが奜たしい。 又、リンの酞の塩ずしおは䞊蚘のリンの酞の
塩、䟋えばカリりム、ナトリりム、リチりム、カ
ルシりム、亜鉛、アルミニりム、スズ、バリりム
等の塩が挙げられ、特にカリりム、ナトリりム又
はカルシりムの第又は第リン酞塩が奜たし
い。 ゚ポキシ暹脂ずリン酞類ずの反応ぱポキシ暹
脂䞭の゚ポキシ基圓量圓りリン酞類の氎酞基が
0.05〜0.9圓量、奜たしくは0.05〜0.4圓量の割合
で行うのがよく、生成した倉性゚ポキシ暹脂予
備瞮合物の゚ポキシ圓量は3000以䞋ずするのが
よい。 このようにしお埗られた予備瞮合物を氎分散物
にするには公知の非むオン系、アニオン系あるい
はカチオン系界面掻性剀を䜿甚するこずにより容
易に行うこずができる。氎分散物゚マルゞペ
ンの濃床は40〜90重量奜たしくは50〜70重量
である。 本発明に甚いられる掻性有機硬化剀ずしおは、
通垞の゚ポキシ暹脂塗料甚の硬化剀がすべお䜿甚
可胜であり、䟋えば脂肪族系ポリアミン、芳銙族
系倉性ポリアミン、脂肪族系倉性ポリアミン、ポ
リアミド類、アミノ暹脂、カルボン酞類等が挙げ
られ、これらは通垞の硬化剀ずしおの量が甚いら
れる。 硬化剀を゚マルゞペンにする方法は、暹脂ず同
様に行なうこずができる。 曎に本発明組成物には、必芁ずあれば他の゚ポ
キシ暹脂、皀釈剀、溶剀、着色顔料、防錆顔料、
充填剀、その他の添加剀を䜵甚するこずができ
る。 本発明の塗料組成物は、自然也燥により塗膜を
埗るこずができるが、必芁ならば加熱等による匷
制也燥によ぀おも、目的ずする塗膜が埗られる。 以䞋、実斜䟋により本発明を詳现に説明する。
尚、䟋䞭の郚は重量基準である。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚ずアデカグリシロヌル
ED−503゚ポキシ圓量18015郚ずオルトリン
酞郚を混合し80℃で時間反応を行い予備瞮合
物を埗た。埗られた予備瞮合物を〔〕ずする。 予備瞮合物〔〕100郚ずアデカノヌルNK−
511旭電化工業補、アニオン系界面掻性剀、30
氎溶液30郚を加えホモミキサヌにお撹拌する。
次いで氎54郚を加え30分撹拌を継続する。埗られ
た゚ポキシ゚マルゞペン固型分60100郚
に察しお硬化剀ずしおポリアミドアミン䟡
34015郚を加え本配合暹脂を鋌板JIS G3141
に塗垃、膜厚150Όにし、週間宀枩硬化埌、衚
にみるような塗膜性胜比范詊隓を行぀た結果、
密着性、防蝕性ずもに著るしく比范䟋よりすぐれ
おいた。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量280100郚ずビスプノヌル・プ
ロピレンオキサむド付加物のゞグリシゞル゚ヌテ
ル゚ポキシ圓量34050郚ず第リン酞カリ
りム17郚ずを混合しお110℃で時間撹拌反応を
行ない埗られた予備瞮合物を〔〕ずする。 予備瞮合物〔〕100郚ずアデカノヌルNK−
511 30郚を加えホモミキサヌにお撹拌する。次い
で氎54郚を加え30分撹拌を継続する。埗られた゚
ポキシ゚マルゞペン固型分60100郚に察
しお゚ポキシ暹脂硬化剀ずしお倉性芳銙族アミン
のアデカハヌドナヌEH−551アミン䟡280、
旭電化補商品名15郚を加え、本配合暹脂を甚い
実斜䟋ず同様に塗り板を䜜成し比范した結果、
比范䟋より密着性、防蝕性ずもに著るしくすぐれ
おいた。 実斜䟋  ノボラツク・゚ポキシ暹脂゚ポキシ圓量
180100郚ずビスプノヌル・゚チレンオキサ
むド付加物のゞグリシゞル゚ヌテル゚ポキシ圓
量31050郚ずピロリン酞のゞヒドロキシブチ
ル゚ステル15郚ずを混合しお95℃で時間撹拌反
応を行い、埗られた予備瞮合物を〔〕ずする。 予備瞮合物〔〕100郚ずアデカノヌル961S
旭電化工業補、非むオン系界面掻性剀、70氎
溶液20郚を加え、ホモミキサヌにお撹拌する。
次いで氎53郚を埐々に加え、30分撹拌を継続す
る。埗られた゚ポキシ゚マルゞペン固型分60
100郚に察しお゚ポキシ暹脂硬化剀ずしお倉
性ポリアミドアデカハヌドナヌEH−203アミン
䟡280、旭電化(æ ª)補20郚を加え、本配合暹脂
を甚い実斜䟋ず同様に塗り板を䜜成し比范した
結果比范䟋より密着性、防蝕性ずもに著るしくす
ぐれおいた。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量340100郚ずビスプノヌル・プ
ロピレンオキサむド付加物のゞグリシゞル゚ヌテ
ル゚ポキシ圓量50020郚ずリン酞モノ゚チ
ル郚ずを混合しお85℃で時間撹拌反応を行い
予備瞮合物を埗た。埗られた予備瞮合物を〔〕
ずする。予備瞮合物〔〕100郚ずアデカノヌル
961S15郚を加えホモミキサヌにお撹拌する。次
いで氎65郚を加えさらに30分間撹拌を継続する。
埗られた゚ポキシ゚マルゞペン固型分64
100郚に察しお゚ポキシ暹脂硬化剀ずしお倉性脂
肪族アミンのアデカハヌドナヌEH−218アミン
䟡380、旭電化工業(æ ª)補商品名12郚を加え、
本配合暹脂を錆面鋌板幎間屋倖バクロし、浮
きサビを萜した鋌板に塗垃、膜厚150Όにし、
週間宀枩硬化埌衚にみるように塗膜性胜比范
詊隓を行぀た結果密着性、防蝕性ずもに著るしく
比范䟋よりすぐれおいた。 比范䟋  未倉性のビスプノヌル・ゞグリシゞル゚ヌ
テル゚ポキシ圓量380100郚ずアデカグリシ
ロヌルED−503 15郚ずアデカノヌルNK−511
35郚を加えホモミキサヌにお撹拌する。次いで氎
73郚を埐々に加え30分撹拌を継続する。埗られた
゚ポキシ゚マルゞペン固型分60100郚に
察しお硬化剀ずしおポリアミドアミン䟡340
20郚を加え本配合暹脂を鋌板JIS  3141に
塗垃し膜厚150Όにしお宀枩で週間硬化しお塗
り板を䜜成した。 比范䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量280100郚ずビスプノヌル・プ
ロピレンオキサむド付加物のゞグリシゞル゚ヌテ
ル゚ポキシ圓量34050郚ずアデカノヌル
NK−511 45郚を加えホモミキサヌにお撹拌す
る。次いで氎102郚を埐々に加え30分撹拌を継続
する。埗られた゚ポキシ゚マルゞペン固型分
55100郚に察しお゚ポキシ暹脂硬化剀ずしお
倉性芳銙族アミンのアデカハヌドナヌEH−551
アミン䟡28020郚を加え、本配合暹脂を甚い
比范䟋ず同様に塗り板を䜜成した。 比范䟋  ノボラツク・゚ポキシ暹脂゚ポキシ圓量
180100郚ずビスプノヌル・゚チレンオキサ
むド付加物のゞグリシゞル゚ヌテル゚ポキシ圓
量31050郚ずアデカノヌル961S 20郚を加え、
ホモミキサヌにお撹拌する。次いで氎100郚を
埐々に加え、30分撹拌を継続する。埗られた゚ポ
キシ゚マルゞペン固型分60100郚に察し
お゚ポキシ暹脂硬化剀ずしお倉性ポリアミドアデ
カハヌドナヌEH−203アミン䟡28030郚を
加え、本配合暹脂を甚い比范䟋ず同様に塗り板
を䜜成した。 比范䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量340100郚ずビスプノヌル・プ
ロピレンオキサむド付加物のゞグリシゞル゚ヌテ
ル゚ポキシ圓量50020郚ず、アデカノヌル
961S20郚を加えホモミキサヌにお撹拌する。次
いで氎70郚を加え、さらに30分間撹拌を継続す
る。埗られた゚ポキシ゚マルゞペン固型分60
100郚に察しお゚ポキシ暹脂硬化剀ずしお倉
性脂肪族アミンのアデカハヌドナヌEH−218ア
ミン䟡38010郚を加えお、本配合暹脂を実斜
䟋ず同様に錆面鋌板に塗垃、膜厚150Όにし、
週間宀枩硬化した。 実斜䟋〜及び比范䟋〜で䜜成した塗り
板の塗膜性胜詊隓結果を衚に瀺す。
[Formula] (Z is H, CH 3 , C 2 H 5 group) A variety of compounds can be used, such as those having more than one substituted or unsubstituted glycidyl ether group in the molecule, and the epoxy equivalent is not particularly limited, but preferably has an epoxy equivalent of 200 to 1000
Something of a certain degree is good. At least one P-OH used in the present invention
Examples of the phosphorus acid having a bond include orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, polyphosphoric acid, phosphonic acid, and phosphinic acid, with orthophosphoric acid being particularly preferred. Examples of phosphorus acid esters include the above-mentioned phosphorus acid esters, preferably alkyl esters having up to about 8 carbon atoms (those having one or more hydroxyl groups) and hydroxyalkyl esters, such as:
Examples include those having groups such as ethyl, n-butyl, 2-ethylhexyl, hydroxyethyl, hydroxybutyl, hydroxypropyl, hydroxypentyl, etc. Mono- or di-phosphate esters of n-butyl or 2-ethylhexyl are particularly preferred. Examples of phosphorus acid salts include the above-mentioned phosphorus acid salts, such as potassium, sodium, lithium, calcium, zinc, aluminum, tin, barium, etc. salts, particularly potassium, sodium, or calcium salts. Secondary phosphates are preferred. The reaction between epoxy resin and phosphoric acids is that the hydroxyl group of phosphoric acid is
It is preferable to carry out at a ratio of 0.05 to 0.9 equivalent, preferably 0.05 to 0.4 equivalent, and the epoxy equivalent of the produced modified epoxy resin (precondensate) is preferably 3000 or less. The precondensate thus obtained can be easily made into an aqueous dispersion by using a known nonionic, anionic or cationic surfactant. The concentration of the aqueous dispersion (emulsion) is 40-90% by weight, preferably 50-70% by weight. The active organic curing agent used in the present invention includes:
All curing agents for ordinary epoxy resin paints can be used, such as aliphatic polyamines, aromatic modified polyamines, aliphatic modified polyamines, polyamides, amino resins, carboxylic acids, etc. An amount of curing agent is used. The curing agent can be made into an emulsion in the same manner as the resin. Furthermore, the composition of the present invention may contain other epoxy resins, diluents, solvents, color pigments, anti-corrosion pigments, if necessary.
Fillers and other additives can be used in combination. The coating composition of the present invention can be dried naturally to form a coating film, but if necessary, the desired coating film can also be obtained by forced drying by heating or the like. Hereinafter, the present invention will be explained in detail with reference to Examples.
Note that parts in the examples are based on weight. Example 1 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380) and adeca glycilol
15 parts of ED-503 (epoxy equivalent = 180) and 6 parts of orthophosphoric acid were mixed and reacted at 80°C for 5 hours to obtain a precondensate. The obtained precondensate is referred to as []. Precondensate [] 100 parts and Adekanol NK-
511 (manufactured by Asahi Denka Kogyo, anionic surfactant, 30%
Add 30 parts of aqueous solution) and stir with a homomixer.
Next, add 54 parts of water and continue stirring for 30 minutes. Polyamide (amine value =
340) Add 15 parts of this blended resin to steel plate (JIS G3141)
After applying the film to a film thickness of 150Ό and curing it at room temperature for one week, we conducted a film performance comparison test as shown in Table 1.
Both adhesion and corrosion resistance were significantly superior to the comparative example. Example 2 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 280), 50 parts of diglycidyl ether of bisphenol A propylene oxide adduct (epoxy equivalent = 340), and 17 parts of dibasic potassium phosphate were mixed. The precondensate obtained by carrying out the stirring reaction at 110°C for 5 hours is referred to as []. Precondensate [] 100 parts and Adekanol NK-
Add 30 parts of 511 and stir with a homomixer. Next, add 54 parts of water and continue stirring for 30 minutes. Adeka Hardener EH-551 (amine value = 280,
As a result of adding 15 parts of Asahi Denka product name) and using this blended resin to create a painted board in the same manner as in Example 1, the results were as follows:
Both adhesion and corrosion resistance were significantly superior to the comparative example. Example 3 Novolak epoxy resin (epoxy equivalent =
180), 50 parts of diglycidyl ether (epoxy equivalent = 310) of bisphenol F/ethylene oxide adduct, and 15 parts of dihydroxybutyl pyrophosphoric acid were mixed and reacted with stirring at 95°C for 6 hours. Let the precondensate obtained be [ ]. Precondensate [] 100 parts and Adekanol 961S
Add 20 parts of (manufactured by Asahi Denka Kogyo, nonionic surfactant, 70% aqueous solution) and stir with a homomixer.
Then, gradually add 53 parts of water and continue stirring for 30 minutes. Obtained epoxy emulsion (solid content = 60
%), 20 parts of modified polyamide deca hardener EH-203 (amine value = 280, manufactured by Asahi Denka Co., Ltd.) as an epoxy resin curing agent was added to 100 parts, and a plate was coated in the same manner as in Example 1 using this blended resin. As a result, both adhesion and corrosion resistance were significantly superior to the comparative example. Example 4 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 340), 20 parts of diglycidyl ether of bisphenol A propylene oxide adduct (epoxy equivalent = 500), and 8 parts of monoethyl phosphate were mixed. The reaction was stirred at 85°C for 7 hours to obtain a precondensate. The obtained precondensate []
shall be. Precondensate [] 100 parts and Adekanol
Add 15 parts of 961S and stir with a homomixer. Next, 65 parts of water is added and stirring is continued for an additional 30 minutes.
Obtained epoxy emulsion (solids content 64%)
To 100 parts, 12 parts of modified aliphatic amine Adeka Hardener EH-218 (amine value = 380, trade name manufactured by Asahi Denka Kogyo Co., Ltd.) was added as an epoxy resin curing agent.
This compounded resin is applied to a rusted steel plate (a steel plate that has been exposed outdoors for one year to remove loose rust) to a film thickness of 150Ό,
After curing at room temperature for one week, a coating film performance comparison test was conducted as shown in Table 1. As a result, both adhesion and corrosion resistance were significantly superior to the comparative example. Comparative Example 1 100 parts of unmodified bisphenol A diglycidyl ether (epoxy equivalent = 380), 15 parts of Adeka Glycilol ED-503, and Adekanol NK-511
Add 35 parts and stir with a homomixer. Then water
Gradually add 73 parts and continue stirring for 30 minutes. Polyamide (amine value = 340) was added as a curing agent to 100 parts of the obtained epoxy emulsion (solid content = 60%).
20 parts of the resin was added, and this blended resin was applied to a steel plate (JIS G 3141) to a film thickness of 150Ό, and cured at room temperature for one week to prepare a coated plate. Comparative Example 2 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 280), 50 parts of diglycidyl ether of bisphenol A propylene oxide adduct (epoxy equivalent = 340), and Adekanol
Add 45 parts of NK-511 and stir with a homomixer. Next, 102 parts of water was gradually added and stirring was continued for 30 minutes. Obtained epoxy emulsion (solid content =
55%) Adeka Hardener EH-551 of modified aromatic amine as epoxy resin hardener for 100 parts
(Amine value = 280) was added, and a coated board was prepared in the same manner as in Comparative Example 1 using this blended resin. Comparative example 3 Novolak epoxy resin (epoxy equivalent =
180), 50 parts of diglycidyl ether (epoxy equivalent = 310) of bisphenol F/ethylene oxide adduct, and 20 parts of Adekanol 961S,
Stir with a homo mixer. Then gradually add 100 parts of water and continue stirring for 30 minutes. Comparative Example 1 was prepared by adding 30 parts of modified polyamide deca hardener EH-203 (amine value = 280) as an epoxy resin curing agent to 100 parts of the obtained epoxy emulsion (solid content = 60%), and using this blended resin. I created a painted board in the same way. Comparative Example 4 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 340), 20 parts of diglycidyl ether of bisphenol A propylene oxide adduct (epoxy equivalent = 500), and Adekanol
Add 20 parts of 961S and stir with a homomixer. Then add 70 parts of water and continue stirring for an additional 30 minutes. The obtained epoxy emulsion (solid content = 60
%), 10 parts of ADEKA Hardener EH-218 (amine value = 380), a modified aliphatic amine, was added as an epoxy resin hardener, and this blended resin was applied to a rusted steel plate in the same manner as in Example 4. Make the film thickness 150Ό,
It was cured at room temperature for one week. Table 1 shows the coating film performance test results of the coated plates prepared in Examples 1 to 4 and Comparative Examples 1 to 4.

【衚】 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚にピロリン酞゜ヌダ28郚
を混合し、80℃×時間反応させ、予備瞮合物
〔〕を埗た゚ポキシ圓量755。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡34015郚
を加え、実斜䟋ず同様に塗膜性胜を調べた。結
果を衚に瀺す。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量480100郚に亜リン酞郚を混合
し、80℃×時間反応させ、予備瞮合物〔〕を
埗た゚ポキシ圓量755。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、倉性芳銙族ア
ミンのアデカハヌドナヌEH−541Sアミン䟡
280、旭電化工業(æ ª)補商品名郚を加え、実斜
䟋ず同様に塗膜性胜を調べた。結果を衚に瀺
す。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚にアデカグリシロヌル
ED−501゚ポキシ圓量300、旭電化工業(æ ª)補商
品名20郚にポリリン酞郚を混合し、80℃×
時間反応させ、予備瞮合物〔〕を埗た゚ポキ
シ圓量850。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡34015郚
を加え、実斜䟋ず同様に塗膜性胜を調べた。結
果を衚に瀺す。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量480100郚ずアデカグリシロヌル
ED−501゚ポキシ圓量300、旭電化工業(æ ª)補商
品名20郚にホスホン酞郚を混合し、80℃×
時間反応させ、予備瞮合物〔〕を埗た゚ポキ
シ圓量770。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡34017郚
を加え、実斜䟋ず同様に塗膜性胜を調べた。結
果を衚に瀺す。 実斜䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚にホスフむン酞郚を混
合し、80℃×時間反応させ、予備瞮合物〔〕
を埗た゚ポキシ圓量710。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡34018郚
を加え、実斜䟋ず同様に塗膜性胜を調べた。結
果を衚に瀺す。 比范䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量475475郚にオルトリン酞28郚、メ
チル゚チルケトン250郚を混合し、オキシラン基
含量がになるたで70℃×20時間反応させ、予備
瞮合物〔〕を埗た酞䟡40mg、KOH。 予備瞮合物〔〕100郚を䜿甚しお実斜䟋ず
同様に゚マルゞペンを埗、この゚マルゞペン100
郚に察しトリ゚チレントリアミン郚を加え、実
斜䟋ず同様に塗膜性胜を調べた。結果を衚に
瀺す。 比范䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚に−ヒドロキシ゚タン
−−ゞリン酞郚を混合し、80℃×時間
反応させ、予備瞮合物〔XI〕を埗た゚ポキシ圓
量502。 予備瞮合物〔XI〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡34023郚
を加え、実斜䟋ず同様に塗膜性胜を調べた。結
果を衚に瀺す。 比范䟋  ビスプノヌル・ゞグリシゞル゚ヌテル゚
ポキシ圓量380100郚に第二リン酞カリりム20
郚を混合し、100℃×時間撹拌反応させ、予備
瞮合物〔XII〕を埗た。 予備瞮合物〔XII〕100郚を䜿甚しお実斜䟋ず
同様に゚ポキシ゚マルゞペンを埗、゚ポキシ暹脂
硬化剀ずしおポリアミドアミン䟡340郚
を加え、実斜䟋ず同様に塗膜を䜜成したが、
週間宀枩攟眮しおも硬化しなか぀た。
[Table] Example 5 28 parts of sodium pyrophosphate was mixed with 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380) and reacted at 80°C for 5 hours to obtain a precondensate [ ] (epoxy equivalent =755). An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate, and 15 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and coating film performance was evaluated in the same manner as in Example 1. Examined. The results are shown in Table 2. Example 6 5 parts of phosphorous acid was mixed with 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 480) and reacted at 80°C for 5 hours to obtain a precondensate [ ] (epoxy equivalent = 755) . An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate [], and a modified aromatic amine Adeka hardener EH-541S (amine value =
280 (trade name, manufactured by Asahi Denka Kogyo Co., Ltd.) was added, and the coating film performance was examined in the same manner as in Example 1. The results are shown in Table 2. Example 7 Add adeca glycilol to 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380)
Mix 2 parts of polyphosphoric acid with 20 parts of ED-501 (epoxy equivalent = 300, product name manufactured by Asahi Denka Kogyo Co., Ltd.) and heat at 80°C x 5
The reaction was carried out for a period of time to obtain a precondensate (epoxy equivalent = 850). An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate, and 15 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and coating film performance was evaluated in the same manner as in Example 1. Examined. The results are shown in Table 2. Example 8 100 parts of bisphenol F diglycidyl ether (epoxy equivalent = 480) and adeca glycilol
Mix 3 parts of phosphonic acid with 20 parts of ED-501 (epoxy equivalent = 300, trade name manufactured by Asahi Denka Kogyo Co., Ltd.) and heat at 80°C x 5
The reaction was carried out for a period of time to obtain a precondensate (epoxy equivalent = 770). An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate, 17 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and coating film performance was evaluated in the same manner as in Example 1. Examined. The results are shown in Table 2. Example 9 3 parts of phosphinic acid was mixed with 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380) and reacted at 80°C for 5 hours to form a precondensate []
was obtained (epoxy equivalent = 710). An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate, 18 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and coating film performance was evaluated in the same manner as in Example 1. Examined. The results are shown in Table 2. Comparative Example 5 475 parts of bisphenol A diglycidyl ether (epoxy equivalent = 475) was mixed with 28 parts of orthophosphoric acid and 250 parts of methyl ethyl ketone, and the mixture was reacted at 70°C for 20 hours until the oxirane group content became 0 to form a precondensate. [] was obtained (acid value 40 mg, KOH/g). An emulsion was obtained in the same manner as in Example 1 using 100 parts of the precondensate.
5 parts of triethylenetriamine was added to each part, and the coating film performance was examined in the same manner as in Example 1. The results are shown in Table 2. Comparative Example 6 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380) was mixed with 3 parts of 1-hydroxyethane-1,1-diphosphoric acid and reacted at 80°C for 5 hours to form a precondensate [XI] was obtained (epoxy equivalent = 502). An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of precondensate [XI], 23 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and coating film performance was evaluated in the same manner as in Example 1. I looked into it. The results are shown in Table 2. Comparative Example 7 100 parts of bisphenol A diglycidyl ether (epoxy equivalent = 380) and 20 parts of dibasic potassium phosphate
The two parts were mixed and reacted with stirring at 100°C for 5 hours to obtain a precondensate [XII]. An epoxy emulsion was obtained in the same manner as in Example 1 using 100 parts of precondensate [XII], 3 parts of polyamide (amine value = 340) was added as an epoxy resin curing agent, and a coating film was formed in the same manner as in Example 1. I created it, but 1
It did not harden even after being left at room temperature for a week.

【衚】【table】

Claims (1)

【特蚱請求の範囲】  必須の構成成分ずしお (A) オルトリン酞、メタリン酞、ピロリン酞、亜
リン酞、ポリリン酞、ホスホン酞、ホスフむン
酞から遞ばれる皮以䞊の−OH結合を少な
くずも個有するリンの酞、その゚ステル又は
塩ず゚ポキシ暹脂ずを、゚ポキシ基が残存する
割合で加熱凊理しお埗られる゚ポキシ暹脂甚硬
化剀で硬化し埗る暹脂の氎分散物ず、 (B) ゚ポキシ暹脂甚掻性有機硬化剀 ずを含有するこずを特城ずする塗料組成物。
[Scope of Claims] 1. As an essential component (A) at least one P-OH bond selected from orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, phosphorous acid, polyphosphoric acid, phosphonic acid, and phosphinic acid; (B) an aqueous dispersion of a resin that can be cured with an epoxy resin curing agent obtained by heat-treating a phosphorus acid, its ester or salt, and an epoxy resin in a proportion that leaves epoxy groups; (B) an epoxy resin; A coating composition comprising: an active organic curing agent;
JP16606582A 1982-09-24 1982-09-24 Paint composition Granted JPS5956459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16606582A JPS5956459A (en) 1982-09-24 1982-09-24 Paint composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16606582A JPS5956459A (en) 1982-09-24 1982-09-24 Paint composition

Publications (2)

Publication Number Publication Date
JPS5956459A JPS5956459A (en) 1984-03-31
JPH0246073B2 true JPH0246073B2 (en) 1990-10-12

Family

ID=15824321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16606582A Granted JPS5956459A (en) 1982-09-24 1982-09-24 Paint composition

Country Status (1)

Country Link
JP (1) JPS5956459A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621273B2 (en) * 1986-05-07 1994-03-23 神東塗料株匏䌚瀟 Rust-stabilized surface treatment method for weathering steel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51143620A (en) * 1975-06-06 1976-12-10 Matsumoto Seiyaku Kogyo Kk Process for preparation of epoxydiphosphonate
JPS5560567A (en) * 1978-10-31 1980-05-07 Vianova Kunstharz Ag Production of waterrsoluble paint bonding agent
JPS58191764A (en) * 1982-05-04 1983-11-09 Dainippon Toryo Co Ltd Aqueous composition for coating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51143620A (en) * 1975-06-06 1976-12-10 Matsumoto Seiyaku Kogyo Kk Process for preparation of epoxydiphosphonate
JPS5560567A (en) * 1978-10-31 1980-05-07 Vianova Kunstharz Ag Production of waterrsoluble paint bonding agent
JPS58191764A (en) * 1982-05-04 1983-11-09 Dainippon Toryo Co Ltd Aqueous composition for coating

Also Published As

Publication number Publication date
JPS5956459A (en) 1984-03-31

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