JPH0245944U - - Google Patents

Info

Publication number

JPH0245944U

JPH0245944U JP12561588U JP12561588U JPH0245944U JP H0245944 U JPH0245944 U JP H0245944U JP 12561588 U JP12561588 U JP 12561588U JP 12561588 U JP12561588 U JP 12561588U JP H0245944 U JPH0245944 U JP H0245944U

Authority

JP

Japan

Prior art keywords

seal portion

sealed

unsealed

wide

wide seal

Prior art date

1988-09-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
• 238000007789 sealing Methods 0.000 claims 1
• 229920003002 synthetic resin Polymers 0.000 claims 1
• 239000000057 synthetic resin Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 4
• 230000008030 elimination Effects 0.000 description 1
• 238000003379 elimination reaction Methods 0.000 description 1

Cited By (2)