JPH0245681U - - Google Patents
Info
- Publication number
- JPH0245681U JPH0245681U JP12483588U JP12483588U JPH0245681U JP H0245681 U JPH0245681 U JP H0245681U JP 12483588 U JP12483588 U JP 12483588U JP 12483588 U JP12483588 U JP 12483588U JP H0245681 U JPH0245681 U JP H0245681U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- circuit pattern
- pad
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12483588U JPH0245681U (en, 2012) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12483588U JPH0245681U (en, 2012) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245681U true JPH0245681U (en, 2012) | 1990-03-29 |
Family
ID=31374911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12483588U Pending JPH0245681U (en, 2012) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245681U (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011013A (ja) * | 2015-06-18 | 2017-01-12 | 日本特殊陶業株式会社 | 検査用配線基板及び検査用配線基板の製造方法 |
-
1988
- 1988-09-22 JP JP12483588U patent/JPH0245681U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011013A (ja) * | 2015-06-18 | 2017-01-12 | 日本特殊陶業株式会社 | 検査用配線基板及び検査用配線基板の製造方法 |