JPH0245670U - - Google Patents
Info
- Publication number
- JPH0245670U JPH0245670U JP12455988U JP12455988U JPH0245670U JP H0245670 U JPH0245670 U JP H0245670U JP 12455988 U JP12455988 U JP 12455988U JP 12455988 U JP12455988 U JP 12455988U JP H0245670 U JPH0245670 U JP H0245670U
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- thick film
- circuit board
- insulating coating
- film metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455988U JPH0245670U (ru) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455988U JPH0245670U (ru) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245670U true JPH0245670U (ru) | 1990-03-29 |
Family
ID=31374400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12455988U Pending JPH0245670U (ru) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245670U (ru) |
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1988
- 1988-09-22 JP JP12455988U patent/JPH0245670U/ja active Pending