JPH0245638U - - Google Patents
Info
- Publication number
- JPH0245638U JPH0245638U JP1988125090U JP12509088U JPH0245638U JP H0245638 U JPH0245638 U JP H0245638U JP 1988125090 U JP1988125090 U JP 1988125090U JP 12509088 U JP12509088 U JP 12509088U JP H0245638 U JPH0245638 U JP H0245638U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- bonding wire
- semiconductor
- semiconductor device
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/015—
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- H10W72/075—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/522—
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- H10W72/5363—
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- H10W72/551—
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- H10W72/5524—
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- H10W72/555—
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- H10W72/59—
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- H10W72/884—
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- H10W72/983—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125090U JPH0245638U (index.php) | 1988-09-24 | 1988-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125090U JPH0245638U (index.php) | 1988-09-24 | 1988-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245638U true JPH0245638U (index.php) | 1990-03-29 |
Family
ID=31375385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125090U Pending JPH0245638U (index.php) | 1988-09-24 | 1988-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245638U (index.php) |
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1988
- 1988-09-24 JP JP1988125090U patent/JPH0245638U/ja active Pending