JPH0245369A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPH0245369A JPH0245369A JP63190634A JP19063488A JPH0245369A JP H0245369 A JPH0245369 A JP H0245369A JP 63190634 A JP63190634 A JP 63190634A JP 19063488 A JP19063488 A JP 19063488A JP H0245369 A JPH0245369 A JP H0245369A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- carrier tape
- recess
- tape
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001125 extrusion Methods 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 239000012050 conventional carrier Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、チップ化された電子部品を自動挿入機により
、電子機器に装着する時に都合、のよいキャリアテープ
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a carrier tape that is convenient for mounting chipped electronic components into electronic equipment using an automatic insertion machine.
電子機器に使用されている部品は、小型化が進み、チッ
プ化されているため、このような電子部品を人手によっ
て電子機器に装着することは、高度の技術と時間を必要
とした。しかし、自動挿入機の開発が進むに従い、チッ
プ化された電子部品は、キャリアテープに実装され、電
子機器に人手を使わずに短時間のうちに正確に取付けら
れるようになった。このように、チップ化された電子部
品が自動挿入機によって正確で、しかも短時間に取付け
られるようにするためには、自動挿入機だけではなく、
キャリアテープの精度も問題になる。Components used in electronic devices are becoming smaller and in the form of chips, so manually attaching such electronic components to electronic devices requires advanced technology and time. However, as the development of automatic insertion machines progresses, chipped electronic components can now be mounted on carrier tapes and accurately attached to electronic equipment in a short time without the need for human intervention. In this way, in order to ensure that chipped electronic components can be installed accurately and quickly using an automatic insertion machine, it is necessary to use not only an automatic insertion machine.
The accuracy of the carrier tape is also an issue.
そのため、チップ化された電子部品の実装位置およびキ
ャリアテープの送り孔の位置はＪＩＳ規格によって定め
られている。Therefore, the mounting position of chipped electronic components and the position of the feed hole of the carrier tape are determined by the JIS standard.
第２図は、従来のキャリアテープ説明図を示す。FIG. 2 shows an explanatory diagram of a conventional carrier tape.
第２図（イ）は、キャリアテープ概略図、第２図く口）
は、キャリアテープの断面図、第２図（ハ）は、キャリ
アテープの第１工程断面図を示す。Figure 2 (a) is a schematic diagram of the carrier tape.
2(c) shows a sectional view of the carrier tape, and FIG. 2(c) shows a sectional view of the carrier tape in the first step.
図において、
１はキャリアテープ、２はくぼみ穴、３はテープ送り孔
、４は貫通孔、４″はくぼみ穴の成形加工（ごよって成
形される貫通孔を示す。In the figure, 1 is a carrier tape, 2 is a recessed hole, 3 is a tape feed hole, 4 is a through hole, and 4'' is a recessed hole molding process (this indicates the through hole formed by this process).
まず、第２図（イ）ないしくハ）を参照しつつ、キャリ
アテープの製造工程にしたがって説明する。First, the manufacturing process of the carrier tape will be explained with reference to FIGS. 2(a) to 2(c).
第１工程では、キャリアテープ１にテープ送り孔３と、
チップ化された電子部品を収容するくぼみ穴２の割れを
防止するための貫通孔４とを設ける。In the first step, a tape feeding hole 3 is formed in the carrier tape 1,
A through hole 4 is provided to prevent cracking of the recessed hole 2 that accommodates the chipped electronic component.
第２工程では、前記貫通孔４よりやや大きめの図示され
ていないプレス金型により、貫通孔４の真上から押しつ
ぶしてくぼみ穴２を成形する。この時、プラスチックの
肉は、四方から寄せ集められて、くぼみ穴２の中心には
狭められた貫通孔４′°を有する底が形成される。In the second step, the hollow hole 2 is formed by pressing from directly above the through hole 4 using a press mold (not shown) that is slightly larger than the through hole 4 . At this time, the plastic flesh is gathered from all sides to form a bottom with a narrowed through hole 4'° in the center of the recessed hole 2.
また、プレス金型の形状として、キャリアテープ１に対
する直角方向の長さがくぼみ穴２の長さと同じで、幅が
くぼみ穴２より小さいものを使用した場合には、プラス
チックの肉はニガから寄せ集められて、くぼみ六２と長
さが同じで幅の狭い狭められた貫通孔４°′が残る。In addition, if the shape of the press mold is such that the length in the direction perpendicular to the carrier tape 1 is the same as the length of the hollow hole 2, and the width is smaller than the hollow hole 2, the plastic meat will be kept away from the nigga. When brought together, a narrow constricted through hole 4°' of the same length and narrow width as the recess 62 remains.
このようにして、くぼみ穴２に割れのないキャリアテー
プを製造していた。In this way, a carrier tape without cracks in the recessed holes 2 was manufactured.
そして、チップ化された電子部品（図示されていない）
をくぼみ穴２に挿入した後、上面からプラスチックフィ
ルム（図示されていない）を貼り、自動挿入機にかけて
いた。and chipped electronic components (not shown)
After inserting the sample into the recessed hole 2, a plastic film (not shown) was applied from the top and the sample was placed in an automatic insertion machine.
しかし、従来技術におけるキャリアテープは、押し出し
加工が常にキャリアテープの上面から加工され、上面の
くぼみ穴と下面の貫通孔とでは加工率が相違し、上方の
方か開口が多く偏在するため、−・方向に湾曲し易いと
いう問題があった。However, in conventional carrier tapes, the extrusion process is always performed from the top surface of the carrier tape, and the processing rate is different between the recessed holes on the top surface and the through holes on the bottom surface, and the openings are more unevenly distributed on the upper side. - There was a problem that it was easy to curve in the direction.
また、キャリアテープは、一方向の面からのみの押し出
し加工であるため、可撓性にアンバランスが生じ、径の
小さいキャリアテープ送給用ローラあるいは支持ローラ
を高速で通過する際に、これらに沿はずにはずれるおそ
れがあるという問題があった。In addition, since the carrier tape is extruded from only one side, its flexibility is unbalanced, and when it passes through a carrier tape feeding roller or support roller with a small diameter at high speed, There was a problem in that there was a risk of it falling off the track.
本発明は、上記問題を除去するために、キャリアテープ
の上面と下面との加工率をほぼ同じにしたキャリアテー
プを提供することを目的とする。SUMMARY OF THE INVENTION In order to eliminate the above-mentioned problems, it is an object of the present invention to provide a carrier tape in which the processing rate on the upper and lower surfaces of the carrier tape is approximately the same.
また、本発明は、キャリアテープにおける湾曲の程度あ
るいは可視性を制御することができるキャリアテープを
提供することを目的とする。Another object of the present invention is to provide a carrier tape in which the degree of curvature or visibility of the carrier tape can be controlled.
本発明のキャリアテープは、キャリアテープ送り孔と、
該キャリアテープの一方のみが開口され、チップ化され
た電子部品を収容し得るくぼみ穴とを有し、前記くぼみ
穴とくぼみ穴との問で前記キャリアテープの他方の面に
開口を有するくぼみと、当該くぼみの底部に設けられた
重なり部からなる調整部とから構成する。The carrier tape of the present invention has a carrier tape feed hole,
a recessed hole that is open only on one side of the carrier tape and can accommodate a chipped electronic component, and a recessed hole that is opened on the other side of the carrier tape between the recessed holes; , and an adjustment section consisting of an overlapping section provided at the bottom of the recess.
また、本発明のキャリアテープは、キャリアテープの両
面に設けられたくぼみと、前記キャリアテープの両面に
作られたくぼみの深さを調整する調整部とから構成する
。Further, the carrier tape of the present invention includes recesses provided on both sides of the carrier tape, and adjustment portions for adjusting the depth of the recesses formed on both sides of the carrier tape.
さらに、本発明のキャリアテープに設けられたくぼみは
、くぼみ穴の間毎に設けずに、任意の個数のくぼみ六を
飛ばしてから設けた構成とする。Further, the recesses provided in the carrier tape of the present invention are not provided between each recess hole, but are provided after an arbitrary number of recesses 6 are skipped.
本発明によれば、キャリアテープを駆動する径の小さい
スプロケット歯車あるいは径の小さい支持ローラーをキ
ャリアテープが通過する際にも、キャリアテープの上面
と下面とで湾曲あるいは可視性に相違が生じないので、
キャリアテープは、前記スプロケットあるいはローラー
から離脱することなく、正確でしかも自動挿入機を高速
に運転することができる。According to the present invention, even when the carrier tape passes through a small-diameter sprocket gear or a small-diameter support roller that drives the carrier tape, there is no difference in curvature or visibility between the top and bottom surfaces of the carrier tape. ,
The carrier tape does not separate from the sprocket or roller, allowing accurate and high speed operation of the automatic insertion machine.
第１図（イ）ないしく口）を参照しつつ本発明の一実施
例を説明する。An embodiment of the present invention will be described with reference to FIGS.
第１図（イ）は本発明の一実施例であるキャリアテープ
を説明するための概略図、第１図（ロ）は第１図（イ）
Ａ−Ａ断面図、第１図（ハ）は本発明の他の実施例で、
第１図（イ’）Ａ−Ａ断面図、第１図（ニ）は、本発明
の一実施例における第一工程図を示す。Figure 1 (a) is a schematic diagram for explaining a carrier tape which is an embodiment of the present invention, and Figure 1 (b) is a schematic diagram for explaining a carrier tape that is an embodiment of the present invention.
A-A sectional view, FIG. 1 (c) is another embodiment of the present invention,
FIG. 1(A') is a sectional view taken along line A-A, and FIG. 1(D) shows a first process diagram in one embodiment of the present invention.
第１図において、第２図と同一の符号は同一部分を示し
、その説明は省略する。In FIG. 1, the same reference numerals as in FIG. 2 indicate the same parts, and the explanation thereof will be omitted.
図中、５はくぼみ、６は調整部、７はくぼみ成形用貫通
孔、７′はくぼみの成形加工によって成形される重なり
部、８は中間部、ｔおよびｔ“はくほみの深さを示す。In the figure, 5 is a hollow, 6 is an adjustment part, 7 is a through hole for forming the hollow, 7' is an overlapping part formed by forming the hollow, 8 is an intermediate part, t and t" are the depth of the hollow. shows.
第１図（ニ）に示すように、第一工程において、キャリ
アテープ送り孔３、くぼみ穴２より小さいくぼみ穴２を
成形するための貫通孔４、およびくぼみ５より小さいく
ぼみ５を成形するための貫通孔７を図示されていないプ
レスで打抜く。As shown in FIG. 1(d), in the first step, the carrier tape feed hole 3, the through hole 4 for forming the hollow hole 2 smaller than the hollow hole 2, and the hollow 5 smaller than the hollow hole 5 are formed. A through hole 7 is punched out using a press (not shown).
次に、第１図（ロ）に示す第二工程において、キャリア
テープ１の上面あるいは下面からチップ化された電子部
品を収容し得るくぼみ穴２に相当する大きさの図示され
ていない金型により貫通孔４の真上から押し出し加工を
行なう。これと同時に前記くぼみ穴２と反対方向からく
ぼみ５に相当する大きさの図示されていないくぼみ成形
用の金型によりくぼみ成形用貫通孔７の真上から押し出
し加工と行なう。Next, in the second step shown in FIG. 1(b), a mold (not shown) having a size corresponding to the recessed hole 2 capable of accommodating the chipped electronic component is formed from the upper or lower surface of the carrier tape 1. Extrusion processing is performed from directly above the through hole 4. At the same time, an extrusion process is carried out from directly above the through hole 7 for forming a hollow from the opposite direction to the hollow hole 2 using a hollow forming mold (not shown) having a size corresponding to the hollow 5.
この金型の押し出し加工によって、キャリアテープ１の
肉は、四面から貫通孔４あるいは７に向かって押し出さ
れ、最後に図示の重なり部４′あるいは７′からなる底
部を形成する。 この押し出し加工は、−組の金型によ
り同時に行い、くぼみ５の深さｔは調整部６の厚さによ
り決まるもので、くぼみ穴２の大きさ、形状あるいはキ
ャリアテープ１の厚さによって決めることができ、その
程度は実験により一番よい深さとする。By this mold extrusion process, the material of the carrier tape 1 is extruded from all four sides toward the through hole 4 or 7, and finally forms the bottom consisting of the illustrated overlapping portion 4' or 7'. This extrusion process is performed simultaneously using two sets of molds, and the depth t of the recess 5 is determined by the thickness of the adjustment part 6, and can be determined by the size and shape of the recess hole 2 or the thickness of the carrier tape 1. The best depth is determined by experiment.
また、第１図〈ハ）は本発明の他の実施例を示す。以下
第１図を参照しつつ説明する。Further, FIG. 1(c) shows another embodiment of the present invention. This will be explained below with reference to FIG.
第１図（ハ）に示すように、くぼみ５の成形において、
キャリアテープ１の両面から押出し加工をすることもで
きる。この場合にはキャリアテープ１の湾曲を考慮して
くぼみ穴２に対して、キャリアテープ１の反対方向のく
ぼみ５の深さｔを反対側のくぼみ５の深さｔｏと比較し
て深くする。As shown in FIG. 1 (c), in forming the depression 5,
It is also possible to extrude the carrier tape 1 from both sides. In this case, in consideration of the curvature of the carrier tape 1, the depth t of the recess 5 in the opposite direction of the carrier tape 1 is made deeper than the depth to of the recess 5 on the opposite side with respect to the recess hole 2.
すなわち、キャリアテープ１の湾曲の程度にしたがって
、１．１“および中間部８の厚さを調整する。このよう
にしてできたキャリアテープ１のくぼみ穴２にチップ化
された電子部品を挿入し、その上面にプラスチックフィ
ルムを貼り、巻取って自動挿入機にかけられる状態にし
て出荷される。That is, the thickness of 1.1" and the intermediate portion 8 is adjusted according to the degree of curvature of the carrier tape 1. Chip-formed electronic components are inserted into the hollow hole 2 of the carrier tape 1 thus created. , a plastic film is pasted on the top surface, and the product is rolled up and shipped in a state where it can be loaded into an automatic insertion machine.
また、くぼみ５とくぼみ穴２とζ−−交互に配置するこ
と以外に、キャリアテープ１の湾曲の程度によっては、
くぼみ５を数個のくぼみ穴２に対して１個の割合に設け
ることもできる。In addition to alternately arranging the recesses 5 and recess holes 2 and ζ--, depending on the degree of curvature of the carrier tape 1,
It is also possible to provide one recess 5 for every several recess holes 2.
本発明は以上のように、くぼみ穴２とくぼみ５とをキャ
リアテープ１の反対側に設け、従来の押し出し加工後に
残された貫通孔４”を重なり部７′としたので、キャリ
アテープ１の湾曲を確実に防止できる。As described above, in the present invention, the hollow hole 2 and the hollow 5 are provided on the opposite side of the carrier tape 1, and the through hole 4'' left after the conventional extrusion process is used as the overlapping part 7'. Curving can be reliably prevented.
また、くぼみ穴２の大きさその他の条件によって、重な
り部７′の厚さを制御することができるので、いかなる
形状のくぼみ穴２においてもキャリアテープ１の湾曲が
発生しないだけでなく、キャリアテープ１に柔軟性を持
たせることができる。In addition, since the thickness of the overlapping portion 7' can be controlled by the size of the recessed hole 2 and other conditions, not only will the carrier tape 1 not curve in any shape of the recessed hole 2, but the carrier tape 1 can be made more flexible.
本発明によれば、キャリアテープのくぼみ穴が設けられ
ている面と反対の面にくぼみを設け、さらに、押し出し
加工の前に設ける従来の貫通孔を重なり部となるように
押し出し加工を行なったので、キャリアテープが湾曲し
てその上下にアンバランスが生じることがなく、またキ
ャリアテープに柔軟性を持たせることができたので、キ
ャリアテープの送給を高速でしかも正確に行なうことが
できる。According to the present invention, a recess is provided on the surface opposite to the surface on which the recessed hole is provided in the carrier tape, and further, the conventional through hole provided before extrusion processing is extruded so that it becomes an overlapping part. Therefore, the carrier tape is not curved and unbalanced vertically, and since the carrier tape is made flexible, the carrier tape can be fed at high speed and accurately.
本発明によれば、くぼみの深さと中間部の位置を変える
ことによりキャリアテープの湾曲を防止すること、およ
びキャリアテープに柔軟性を持たせることができたので
、キャリアテープの送給がより正確になった。According to the present invention, by changing the depth of the recess and the position of the intermediate part, it is possible to prevent the carrier tape from curving and to make the carrier tape flexible, so that the carrier tape can be fed more accurately. Became.
本発明によれば、くぼみ穴とくぼみとの内部を逃がすた
め、あるいはキャリアテープの割れを防ぐために、予め
設けられた貫通孔を重なり部となるように押し出し加工
を行なうので、はみ出し部あるいは割れがない精度の高
いキャリアテープを提供することができる。According to the present invention, in order to release the inside of the hollow hole and the hollow, or to prevent the carrier tape from cracking, extrusion processing is performed so that the through holes provided in advance become an overlapping part, so that no protruding parts or cracks occur. We can provide carrier tape with high precision.
第１図（イ）は本発明の一実施例であるキャリアテープ
を説明するための概略図、第１図（ロ）は第１図（イ）
Ａ−Ａ断面図、第１図（ハ）は本発明の他の実施例で、
第１図（イ）Ａ−Ａ断面図、第１図（ニ）は、本発明の
一実施例における第一工程図、第２図（イ）は、キャリ
アテープ概略図、第２図（ロ）は、キャリアテープの断
面図、第２図（ハ）は、キャリアテープの第一工程断面
図を示す。
図において、
１ ・・−・・−キャリアテープ
２−−−−・くぼみ穴
３−・・・−テープ送り孔
４・−・−・貫通孔
５ ・・−＜ぼみ
６ ・・・−調整部
７・・・・・−・・・−貫通孔
７′° ・・・・−・・くぼみ成形用型なり部８ ・−
・・中間部
テープ送り孔３
本発明のキャリアテープ説明図
第１図
従来例のキャリアテープ説明図
第２図Figure 1 (a) is a schematic diagram for explaining a carrier tape which is an embodiment of the present invention, and Figure 1 (b) is a schematic diagram for explaining a carrier tape that is an embodiment of the present invention.
A-A sectional view, FIG. 1 (c) is another embodiment of the present invention,
FIG. 1(A) is a sectional view taken along line A-A, FIG. 1(D) is a first process diagram in an embodiment of the present invention, FIG. ) shows a sectional view of the carrier tape, and FIG. 2(c) shows a sectional view of the carrier tape in the first step. In the figure, 1...-Carrier tape 2--Recessed hole 3--Tape feeding hole 4--Through hole 5...-<Recess 6...-Adjustment Part 7...--Through hole 7'°...--Mold part 8 for hollow molding...-
・Intermediate tape feed hole 3 Explanatory diagram of the carrier tape of the present invention Fig. 1 An explanatory diagram of the conventional carrier tape Fig. 2
Claims (3)
一方のみが開口されチップ化された電子部品を収容し得
るくぼみ穴２とを有するキャリアテープにおいて、 前記くぼみ穴２とくぼみ穴２との問で前記キャリアテー
プ１の他方の面に開口を有するくぼみ５と、 当該くぼみ５の底部に設けられた重なり部７からなる調
整部６と、 を有することを特徴とするキャリアテープ。(1) In a carrier tape having a carrier tape feed hole 3 and a recessed hole 2 that is opened only on one side of the carrier tape 1 and can accommodate a chipped electronic component, between the recessed hole 2 and the recessed hole 2, A carrier tape characterized in that it has: a recess 5 having an opening on the other surface of the carrier tape 1; and an adjustment section 6 consisting of an overlapping section 7 provided at the bottom of the recess 5.
けられ、前記くぼみ５の深さを調整できる調整部６とか
らなることを特徴とする請求項１記載のキャリアテープ
。(2) The carrier tape according to claim 1, wherein the recess 5 is provided on both sides of the carrier tape 1 and includes an adjustment section 6 that can adjust the depth of the recess 5.
設けられたことを特徴とする請求項１記載のキャリアテ
ープ。(3) The carrier tape according to claim 1, wherein the recess 5 is provided after an arbitrary number of recess holes 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190634A JPH0662173B2 (en) | 1988-08-01 | 1988-08-01 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190634A JPH0662173B2 (en) | 1988-08-01 | 1988-08-01 | Carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0245369A true JPH0245369A (en) | 1990-02-15 |
| JPH0662173B2 JPH0662173B2 (en) | 1994-08-17 |
Family
ID=16261335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63190634A Expired - Fee Related JPH0662173B2 (en) | 1988-08-01 | 1988-08-01 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0662173B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007321996A (en) * | 2006-05-30 | 2007-12-13 | Matsushita Electric Ind Co Ltd | Heat storage system |
-
1988
- 1988-08-01 JP JP63190634A patent/JPH0662173B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007321996A (en) * | 2006-05-30 | 2007-12-13 | Matsushita Electric Ind Co Ltd | Heat storage system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0662173B2 (en) | 1994-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |