JPH0245306B2 - - Google Patents
Info
- Publication number
- JPH0245306B2 JPH0245306B2 JP57013707A JP1370782A JPH0245306B2 JP H0245306 B2 JPH0245306 B2 JP H0245306B2 JP 57013707 A JP57013707 A JP 57013707A JP 1370782 A JP1370782 A JP 1370782A JP H0245306 B2 JPH0245306 B2 JP H0245306B2
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- electrical contact
- circuit board
- printed circuit
- contact land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000006850 spacer group Chemical group 0.000 claims description 34
- 238000005476 soldering Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【発明の詳細な説明】
従来、比較的大電流の供給を必要とするプリン
ト基板への電源供給方法の一つとして、給電特性
の改善を目的とし電源母線を浮かせて固定するか
又は電源母性の形状の簡素化を計る為に、第1図
〜第3図に示すように、あらかじめ電接部スペー
サー1をプリント基板4面に半田ゴテ等を利用し
て半田付けした後、電源母線3のタツプ穴2又は
端子部6の取付け穴に基板裏面より締結ネジ7を
使用して締結し、通電の確保を図る手段がある。
これによれば、給電特性の改善及び積層母線形状
の簡素化については要求を満たすことができる
が、あらかじめ基板面へ半田付けする電接部スペ
ーサー1の取付け方法、特に基板面への電接部ス
ペーサーの位値決めの不確実さ並びに半田付作業
の熟練が必要である等の難点がある。DETAILED DESCRIPTION OF THE INVENTION Conventionally, one of the methods for supplying power to a printed circuit board that requires the supply of a relatively large current is to float and fix the power supply bus bar in order to improve the power supply characteristics. In order to simplify the shape, as shown in Figures 1 to 3, after soldering the electrical contact spacer 1 to the 4th surface of the printed circuit board using a soldering iron, etc., There is a means to secure current conduction by using fastening screws 7 from the back side of the board and fastening them into the holes 2 or the mounting holes of the terminal portions 6.
According to this, the requirements for improving the power supply characteristics and simplifying the laminated busbar shape can be met, but the method for attaching the electrical contact spacer 1, which is soldered to the board surface in advance, especially the electrical connection to the board surface, can be met. There are disadvantages such as uncertainty in determining the position of the spacer and the need for skilled soldering work.
本発明は、上記の如き電接部スペーサーに伴な
う難点を解決するようにした電源母性の接続構造
を提供するものである。本発明の一実施例を示す
第4図及び第5図において、板状導体から打抜
き、曲げ加工及び表面処理を施し中央に透孔15
を設けたスペーサー13を製作し、プリント基板
12側に該スペーサー13の脚14を挿入するス
ルーホール加工を施すか又は透孔のスペーサー固
定穴17とスルーホール加工を施すか単なる貫通
穴18を持つた電接部ランド16を設けておき、
スペーサー13の脚14を電接部ランド16の近
傍に設けた上記穴17に挿入後、基板12の裏面
より飛び出したスペーサー13の脚14をなるべ
くは折曲げて基板面からの脱落防止措置を行い、
次いで自動半田付装置又は熱盤を用いてのリフロ
ー半田付処理等を講じてスペーサー13と基板1
2のランド16間の通電を確保するようにしてお
く。そして、電源母線10のタツプ穴11にプリ
ント基板12の裏面よりネジ19等を使用して締
結し通電を図るものである。導電性スペーサー1
3はその実装状態でプリント基板12の面から電
源母線10をこのスペーサー13の厚さ相当分一
定量浮かせて電接部ランド16と電源母線10と
の電気的接続を図る為の介在材料となる。そし
て、導電性スペーサー13の脚14はプリント基
板12の電接部ランド16に対するこのスペーサ
ー13の装着時に該ランド16の近傍に配設した
スペーサー固定穴17と協働して導電性スペーサ
ー13の位置決めを果たすように機能するので、
導電性スペーサー13の電接部ランド16への装
着を自動的な高能率手段等を用いて容易に処理し
てスペーサー13とランド16との間の上記の如
き態様の半田付を迅速に行えるようになる。電源
母線10は、銅プスバー又はアルミニウムプスバ
ーにランド16との関連において所定間隔毎にタ
ツプ穴11を設け電接部以外を絶縁被覆したもの
か、若しくは所定間隔毎に接続端子を有する板状
導体を絶縁材の介在下に複数枚積層するようにし
た積層母線を用いることができる。 The present invention provides a connection structure for a power supply motherboard that solves the difficulties associated with the above-mentioned electrical contact spacer. In FIGS. 4 and 5 showing an embodiment of the present invention, a plate-shaped conductor is punched, bent, and surface-treated to form a through-hole 15 in the center.
The spacer 13 with the spacer 13 is manufactured and the legs 14 of the spacer 13 are inserted into the printed circuit board 12 side by a through-hole process, or the spacer fixing hole 17 is a transparent hole, and the through-hole process is performed, or the spacer 13 is simply provided with a through-hole 18. An electric contact land 16 is provided,
After inserting the legs 14 of the spacer 13 into the holes 17 provided near the electrical contact land 16, the legs 14 of the spacer 13 protruding from the back side of the board 12 are bent as much as possible to prevent them from falling off the board surface. ,
Next, a reflow soldering process using an automatic soldering device or a hot plate is performed to connect the spacer 13 and the board 1.
Electricity is ensured between the two lands 16. Then, it is connected to the tapped hole 11 of the power supply bus 10 from the back side of the printed circuit board 12 using screws 19 or the like to supply electricity. Conductive spacer 1
3 serves as an intervening material for electrically connecting the electrical connection land 16 and the power supply bus 10 by lifting the power supply bus 10 by a certain amount equivalent to the thickness of the spacer 13 from the surface of the printed circuit board 12 in the mounted state. . The legs 14 of the conductive spacer 13 cooperate with the spacer fixing hole 17 provided near the land 16 when the spacer 13 is attached to the electrical contact land 16 of the printed circuit board 12 to determine the position of the conductive spacer 13. Because it functions to fulfill the
The attachment of the conductive spacer 13 to the electrical contact land 16 can be easily carried out using automatic high-efficiency means, etc., so that the above-described soldering between the spacer 13 and the land 16 can be quickly performed. become. The power supply bus 10 is a copper bus bar or an aluminum bus bar with tap holes 11 provided at predetermined intervals in relation to the lands 16 and insulated except for the electrical contact portions, or a plate-shaped conductor having connection terminals at predetermined intervals. It is possible to use a laminated bus bar in which a plurality of layers are laminated with an insulating material interposed therebetween.
以上のとおり、本発明は、プリント基板上に形
成された電接部ランドに導電性スペーサーを介し
て電源母線の使用によりプリント基板に対して給
電を行うような電源母線とプリント基板との接続
構造を構成する場合、電源母線をプリント基板の
上記電接部ランドから浮かせる為に設けた上記導
電性スペーサーはその電接部ランドの近傍に設け
た固定穴に装着し得る脚を具備するように構成さ
れ、且つこれら導電性スペーサーと電接部ランド
相互間の導通を形成するように構成したので、上
記電接部ランドに導電性スペーサーを装着する際
の両者間の相互の位置決め処理を容易且つ確実に
行うことができると共に、それら電接部ランドと
導電性スペーサー間の半田付け等の導通化も上記
の如き確実な位置決め状態の下に適確に処理でき
ることとなる。従つて、導電性スペーサーを介在
させてこの種の電源母線とプリント基板との接続
を行う構造に於いて、上記の如き構成によるスペ
ーサー半田付作業が自動半田付装置又はリフロー
半田付装置等を使用することが可能となり電源母
線の安価な実装処理を行なうことができ、スペー
サーの位置決め手段の簡素化及び正確化を達成で
きる。 As described above, the present invention provides a connection structure between a power bus and a printed circuit board in which power is supplied to the printed circuit board by using a power bus through a conductive spacer to an electrical contact land formed on the printed circuit board. , the conductive spacer provided to lift the power bus from the electrical contact land of the printed circuit board is provided with legs that can be attached to fixing holes provided near the electrical contact land. In addition, since the conductive spacer and the electric contact land are configured to form electrical continuity, mutual positioning between the two when attaching the conductive spacer to the electric contact land is facilitated and ensured. At the same time, it is also possible to conduct the soldering between the electric contact land and the conductive spacer properly under the above-mentioned secure positioning conditions. Therefore, in a structure in which a conductive spacer is interposed between the power supply bus and the printed circuit board, the spacer soldering work with the above configuration can be performed using an automatic soldering device or a reflow soldering device. This makes it possible to perform an inexpensive mounting process for the power supply bus, and to simplify and increase the accuracy of the spacer positioning means.
第1図は従来方式による電源母線の回路基板に
対する接続手段を概念的に示す部分斜視図、第2
図及び第3図は第1図の接続状態を示す要部断面
図、第4図は本発明の一実施例による電源母線の
接続構造を示す第1図と同様な部分斜視図、そし
て第5図はその接続完了後の要部断面構成図であ
る。
13……スペーサー、14……脚、16……電
接ランド、17……スペーサー固定穴。
Fig. 1 is a partial perspective view conceptually showing a conventional method for connecting a power bus to a circuit board;
3 and 3 are sectional views of essential parts showing the connection state of FIG. 1, FIG. 4 is a partial perspective view similar to FIG. The figure is a cross-sectional configuration diagram of the main parts after the connection is completed. 13... Spacer, 14... Leg, 16... Electrical land, 17... Spacer fixing hole.
Claims (1)
導電性スペーサーを取付け、該スペーサーを介し
て上記電接部ランドと電源母線の電接部とを締結
具で圧接して導通を図る為の電源母線とプリント
基板との接続構造に於いて、該電源母線をプリン
ト基板の上記電接部ランドから浮かせる為の上記
導電性スペーサーは該電接部ランドの近傍に設け
た固定穴に装着可能な脚を備え、これら導電性ス
ペーサーと電接部ランド相互間の導通を形成する
ように構成したことを特徴とする電源母線の接続
構造。1. A power source that attaches a conductive spacer to the electrical contact land formed on the printed circuit board, and presses the electrical contact land and the electrical contact part of the power supply bus through the spacer with a fastener to establish continuity. In the connection structure between the bus bar and the printed circuit board, the conductive spacer for lifting the power bus bar from the electrical contact land of the printed circuit board is a leg that can be attached to a fixing hole provided near the electrical contact land. What is claimed is: 1. A connection structure for a power supply bus bar, comprising: a conductive spacer and an electric contact land;
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57013707A JPS58131674A (en) | 1982-01-30 | 1982-01-30 | Connecting structure for bus of power source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57013707A JPS58131674A (en) | 1982-01-30 | 1982-01-30 | Connecting structure for bus of power source |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58131674A JPS58131674A (en) | 1983-08-05 |
JPH0245306B2 true JPH0245306B2 (en) | 1990-10-09 |
Family
ID=11840687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57013707A Granted JPS58131674A (en) | 1982-01-30 | 1982-01-30 | Connecting structure for bus of power source |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58131674A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05149505A (en) * | 1991-11-29 | 1993-06-15 | Nikkiso Co Ltd | Feeding method for chemical liquid |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0615425Y2 (en) * | 1988-04-07 | 1994-04-20 | 株式会社豊田自動織機製作所 | Copper bar bonded substrate |
-
1982
- 1982-01-30 JP JP57013707A patent/JPS58131674A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05149505A (en) * | 1991-11-29 | 1993-06-15 | Nikkiso Co Ltd | Feeding method for chemical liquid |
Also Published As
Publication number | Publication date |
---|---|
JPS58131674A (en) | 1983-08-05 |
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