JPH0244375U - - Google Patents

Info

Publication number

JPH0244375U

JPH0244375U JP12280888U JP12280888U JPH0244375U JP H0244375 U JPH0244375 U JP H0244375U JP 12280888 U JP12280888 U JP 12280888U JP 12280888 U JP12280888 U JP 12280888U JP H0244375 U JPH0244375 U JP H0244375U

Authority

JP

Japan

Prior art keywords

chip component

circuit board

adhesive layer

solder

melting

Prior art date

1988-09-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000012790 adhesive layer Substances 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 238000002844 melting Methods 0.000 claims 2
• 239000000463 material Substances 0.000 claims 1
• 230000008018 melting Effects 0.000 claims 1
• 239000006071 cream Substances 0.000 description 1

Cited By (1)