JPH0243344U - - Google Patents
Info
- Publication number
- JPH0243344U JPH0243344U JP12236288U JP12236288U JPH0243344U JP H0243344 U JPH0243344 U JP H0243344U JP 12236288 U JP12236288 U JP 12236288U JP 12236288 U JP12236288 U JP 12236288U JP H0243344 U JPH0243344 U JP H0243344U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- wooden
- flooring material
- parts
- wooden flooring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009408 flooring Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002023 wood Substances 0.000 description 2
Landscapes
- Floor Finish (AREA)
Description
第１図および第２図はこの考案の実施例１を示
すもので、第１図は横断面拡大図、第２図は木質
板と緩衝部材との接合部分における接着部と非接
着部の状態を示す木質板の底面図、第３図は木質
床材と床下地との接着部分を示す木質床材の底面
図、第４図ないし第６図は実施例２ないし実施例
４を示す第２図相当の底面図、第７図は実施例５
を示す横断面拡大図、第８図は実施例６を示す第
２図相当の底面図である。
１，２０…木質板、２，１４…緩衝部材、３，
４，８，１０，１２，１６…接着部、５，９，１
１，１３，１７…非接着部、Ｆ…木質床材。
Figures 1 and 2 show Embodiment 1 of this invention, with Figure 1 being an enlarged cross-sectional view, and Figure 2 being the state of the bonded and non-bonded areas at the joint between the wooden board and the buffer member. FIG. 3 is a bottom view of the wooden flooring showing the bonded area between the wooden flooring and the subfloor, and FIGS. Fig. 7 is a bottom view corresponding to the figure, and Fig. 7 is Example 5.
FIG. 8 is a bottom view corresponding to FIG. 2 showing the sixth embodiment. 1,20...Wood board, 2,14...Buffer member, 3,
4, 8, 10, 12, 16...Adhesive part, 5, 9, 1
1, 13, 17...non-bonded part, F...wood flooring material.
Claims (1)
合せられている木質床材において、接着部８，１
０，１２，１６と非接着部５，９，１１，１３，
１７との両方が存在する状態に接合されているこ
とを特徴とする木質床材。 In the wooden flooring material in which the cushioning members 2, 14 are bonded to the lower surfaces of the wooden boards 1, 20, the adhesive parts 8, 1
0, 12, 16 and non-bonded parts 5, 9, 11, 13,
17. A wooden flooring material characterized by being joined in such a way that both 17 and 17 are present.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122362U JPH074266Y2 (en) | 1988-09-19 | 1988-09-19 | Wood flooring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122362U JPH074266Y2 (en) | 1988-09-19 | 1988-09-19 | Wood flooring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0243344U true JPH0243344U (en) | 1990-03-26 |
| JPH074266Y2 JPH074266Y2 (en) | 1995-02-01 |
Family
ID=31370221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122362U Expired - Lifetime JPH074266Y2 (en) | 1988-09-19 | 1988-09-19 | Wood flooring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH074266Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007092295A (en) * | 2005-09-27 | 2007-04-12 | Eidai Co Ltd | Flooring with damping material and its manufacturing method |
| JP2016113766A (en) * | 2014-12-12 | 2016-06-23 | パナソニックＩｐマネジメント株式会社 | Floor material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3428382B2 (en) * | 1997-07-24 | 2003-07-22 | 松下電工株式会社 | Floor panel construction method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62173439U (en) * | 1986-04-23 | 1987-11-04 | ||
| JPS6355258A (en) * | 1986-08-26 | 1988-03-09 | 松下電工株式会社 | Floor material |
| JPH0194529U (en) * | 1987-12-15 | 1989-06-22 |
-
1988
- 1988-09-19 JP JP1988122362U patent/JPH074266Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62173439U (en) * | 1986-04-23 | 1987-11-04 | ||
| JPS6355258A (en) * | 1986-08-26 | 1988-03-09 | 松下電工株式会社 | Floor material |
| JPH0194529U (en) * | 1987-12-15 | 1989-06-22 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007092295A (en) * | 2005-09-27 | 2007-04-12 | Eidai Co Ltd | Flooring with damping material and its manufacturing method |
| JP4668024B2 (en) * | 2005-09-27 | 2011-04-13 | 永大産業株式会社 | Method of manufacturing flooring with cushioning material |
| JP2016113766A (en) * | 2014-12-12 | 2016-06-23 | パナソニックＩｐマネジメント株式会社 | Floor material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH074266Y2 (en) | 1995-02-01 |