JPH024263U - - Google Patents
Info
- Publication number
- JPH024263U JPH024263U JP1988081807U JP8180788U JPH024263U JP H024263 U JPH024263 U JP H024263U JP 1988081807 U JP1988081807 U JP 1988081807U JP 8180788 U JP8180788 U JP 8180788U JP H024263 U JPH024263 U JP H024263U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit elements
- leads
- lead frame
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988081807U JPH024263U (US20020095090A1-20020718-M00002.png) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988081807U JPH024263U (US20020095090A1-20020718-M00002.png) | 1988-06-20 | 1988-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH024263U true JPH024263U (US20020095090A1-20020718-M00002.png) | 1990-01-11 |
Family
ID=31306577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988081807U Pending JPH024263U (US20020095090A1-20020718-M00002.png) | 1988-06-20 | 1988-06-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH024263U (US20020095090A1-20020718-M00002.png) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010598U (US20020095090A1-20020718-M00002.png) * | 1973-05-23 | 1975-02-03 | ||
JPS5010597U (US20020095090A1-20020718-M00002.png) * | 1973-05-23 | 1975-02-03 | ||
JPS52105910U (US20020095090A1-20020718-M00002.png) * | 1976-02-09 | 1977-08-12 | ||
JPS55112585U (US20020095090A1-20020718-M00002.png) * | 1979-02-02 | 1980-08-07 | ||
JPS5627407U (US20020095090A1-20020718-M00002.png) * | 1979-08-08 | 1981-03-14 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010967A (US20020095090A1-20020718-M00002.png) * | 1973-05-28 | 1975-02-04 | ||
JPS5029163A (US20020095090A1-20020718-M00002.png) * | 1973-07-17 | 1975-03-25 |
-
1988
- 1988-06-20 JP JP1988081807U patent/JPH024263U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010967A (US20020095090A1-20020718-M00002.png) * | 1973-05-28 | 1975-02-04 | ||
JPS5029163A (US20020095090A1-20020718-M00002.png) * | 1973-07-17 | 1975-03-25 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010598U (US20020095090A1-20020718-M00002.png) * | 1973-05-23 | 1975-02-03 | ||
JPS5010597U (US20020095090A1-20020718-M00002.png) * | 1973-05-23 | 1975-02-03 | ||
JPS52105910U (US20020095090A1-20020718-M00002.png) * | 1976-02-09 | 1977-08-12 | ||
JPS55112585U (US20020095090A1-20020718-M00002.png) * | 1979-02-02 | 1980-08-07 | ||
JPS625197Y2 (US20020095090A1-20020718-M00002.png) * | 1979-02-02 | 1987-02-05 | ||
JPS5627407U (US20020095090A1-20020718-M00002.png) * | 1979-08-08 | 1981-03-14 |