JPH024248U - - Google Patents
Info
- Publication number
- JPH024248U JPH024248U JP8181088U JP8181088U JPH024248U JP H024248 U JPH024248 U JP H024248U JP 8181088 U JP8181088 U JP 8181088U JP 8181088 U JP8181088 U JP 8181088U JP H024248 U JPH024248 U JP H024248U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- penetrating
- cavity
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181088U JPH024248U (fr) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181088U JPH024248U (fr) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024248U true JPH024248U (fr) | 1990-01-11 |
Family
ID=31306580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8181088U Pending JPH024248U (fr) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024248U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096696A (ja) * | 2009-10-27 | 2011-05-12 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016136604A (ja) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | 半導体装置 |
-
1988
- 1988-06-20 JP JP8181088U patent/JPH024248U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096696A (ja) * | 2009-10-27 | 2011-05-12 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016136604A (ja) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | 半導体装置 |