JPH0242445U - - Google Patents
Info
- Publication number
- JPH0242445U JPH0242445U JP1988121336U JP12133688U JPH0242445U JP H0242445 U JPH0242445 U JP H0242445U JP 1988121336 U JP1988121336 U JP 1988121336U JP 12133688 U JP12133688 U JP 12133688U JP H0242445 U JPH0242445 U JP H0242445U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- lead frame
- circuit chip
- conductive plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121336U JPH0242445U (US06623731-20030923-C00012.png) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121336U JPH0242445U (US06623731-20030923-C00012.png) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242445U true JPH0242445U (US06623731-20030923-C00012.png) | 1990-03-23 |
Family
ID=31368251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121336U Pending JPH0242445U (US06623731-20030923-C00012.png) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242445U (US06623731-20030923-C00012.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141137A (ja) * | 2007-12-06 | 2009-06-25 | Denso Corp | 電子装置及び車輪速度センサ |
| JP2019192847A (ja) * | 2018-04-27 | 2019-10-31 | ルネサスエレクトロニクス株式会社 | 電子装置 |
-
1988
- 1988-09-16 JP JP1988121336U patent/JPH0242445U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141137A (ja) * | 2007-12-06 | 2009-06-25 | Denso Corp | 電子装置及び車輪速度センサ |
| JP4553003B2 (ja) * | 2007-12-06 | 2010-09-29 | 株式会社デンソー | 電子装置及び車輪速度センサ |
| JP2019192847A (ja) * | 2018-04-27 | 2019-10-31 | ルネサスエレクトロニクス株式会社 | 電子装置 |
