JPH0241474U - - Google Patents

Info

Publication number
JPH0241474U
JPH0241474U JP12031788U JP12031788U JPH0241474U JP H0241474 U JPH0241474 U JP H0241474U JP 12031788 U JP12031788 U JP 12031788U JP 12031788 U JP12031788 U JP 12031788U JP H0241474 U JPH0241474 U JP H0241474U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
hard resin
resin sheet
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12031788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12031788U priority Critical patent/JPH0241474U/ja
Publication of JPH0241474U publication Critical patent/JPH0241474U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP12031788U 1988-09-13 1988-09-13 Pending JPH0241474U (US06724976-20040420-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12031788U JPH0241474U (US06724976-20040420-M00002.png) 1988-09-13 1988-09-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12031788U JPH0241474U (US06724976-20040420-M00002.png) 1988-09-13 1988-09-13

Publications (1)

Publication Number Publication Date
JPH0241474U true JPH0241474U (US06724976-20040420-M00002.png) 1990-03-22

Family

ID=31366315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12031788U Pending JPH0241474U (US06724976-20040420-M00002.png) 1988-09-13 1988-09-13

Country Status (1)

Country Link
JP (1) JPH0241474U (US06724976-20040420-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006033297A1 (ja) * 2004-09-21 2006-03-30 Intellectual Property Bank Corp. Ledを実装したユニットの製造方法、ledソケット、led実装用電子回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006033297A1 (ja) * 2004-09-21 2006-03-30 Intellectual Property Bank Corp. Ledを実装したユニットの製造方法、ledソケット、led実装用電子回路基板

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