JPH0238775U - - Google Patents
Info
- Publication number
- JPH0238775U JPH0238775U JP11685588U JP11685588U JPH0238775U JP H0238775 U JPH0238775 U JP H0238775U JP 11685588 U JP11685588 U JP 11685588U JP 11685588 U JP11685588 U JP 11685588U JP H0238775 U JPH0238775 U JP H0238775U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- thermally conductive
- conductive electrical
- deposited
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116855U JPH0651009Y2 (ja) | 1988-09-07 | 1988-09-07 | 多層配線装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116855U JPH0651009Y2 (ja) | 1988-09-07 | 1988-09-07 | 多層配線装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0238775U true JPH0238775U (de) | 1990-03-15 |
| JPH0651009Y2 JPH0651009Y2 (ja) | 1994-12-21 |
Family
ID=31359776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116855U Expired - Lifetime JPH0651009Y2 (ja) | 1988-09-07 | 1988-09-07 | 多層配線装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651009Y2 (de) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298695A (ja) * | 1985-10-24 | 1987-05-08 | 富士通株式会社 | 高熱伝導性配線基板の製造方法 |
| JPS6341099A (ja) * | 1986-08-06 | 1988-02-22 | 住友電気工業株式会社 | 多層配線基板 |
-
1988
- 1988-09-07 JP JP1988116855U patent/JPH0651009Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298695A (ja) * | 1985-10-24 | 1987-05-08 | 富士通株式会社 | 高熱伝導性配線基板の製造方法 |
| JPS6341099A (ja) * | 1986-08-06 | 1988-02-22 | 住友電気工業株式会社 | 多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0651009Y2 (ja) | 1994-12-21 |