JPH0238766U - - Google Patents
Info
- Publication number
- JPH0238766U JPH0238766U JP11591988U JP11591988U JPH0238766U JP H0238766 U JPH0238766 U JP H0238766U JP 11591988 U JP11591988 U JP 11591988U JP 11591988 U JP11591988 U JP 11591988U JP H0238766 U JPH0238766 U JP H0238766U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- package
- ground pattern
- ground
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11591988U JPH0238766U (ko) | 1988-09-05 | 1988-09-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11591988U JPH0238766U (ko) | 1988-09-05 | 1988-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238766U true JPH0238766U (ko) | 1990-03-15 |
Family
ID=31358002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11591988U Pending JPH0238766U (ko) | 1988-09-05 | 1988-09-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238766U (ko) |
-
1988
- 1988-09-05 JP JP11591988U patent/JPH0238766U/ja active Pending