JPH0238765U - - Google Patents
Info
- Publication number
- JPH0238765U JPH0238765U JP11766188U JP11766188U JPH0238765U JP H0238765 U JPH0238765 U JP H0238765U JP 11766188 U JP11766188 U JP 11766188U JP 11766188 U JP11766188 U JP 11766188U JP H0238765 U JPH0238765 U JP H0238765U
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- heat sink
- spacer
- electronic component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11766188U JPH0238765U (enrdf_load_stackoverflow) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11766188U JPH0238765U (enrdf_load_stackoverflow) | 1988-09-07 | 1988-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238765U true JPH0238765U (enrdf_load_stackoverflow) | 1990-03-15 |
Family
ID=31361314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11766188U Pending JPH0238765U (enrdf_load_stackoverflow) | 1988-09-07 | 1988-09-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238765U (enrdf_load_stackoverflow) |
-
1988
- 1988-09-07 JP JP11766188U patent/JPH0238765U/ja active Pending
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