JPH0237867U - - Google Patents
Info
- Publication number
- JPH0237867U JPH0237867U JP11535788U JP11535788U JPH0237867U JP H0237867 U JPH0237867 U JP H0237867U JP 11535788 U JP11535788 U JP 11535788U JP 11535788 U JP11535788 U JP 11535788U JP H0237867 U JPH0237867 U JP H0237867U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- mount
- adhesive
- semiconductor device
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11535788U JPH0237867U (enExample) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11535788U JPH0237867U (enExample) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0237867U true JPH0237867U (enExample) | 1990-03-13 |
Family
ID=31356944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11535788U Pending JPH0237867U (enExample) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0237867U (enExample) |
-
1988
- 1988-08-31 JP JP11535788U patent/JPH0237867U/ja active Pending