JPH0236075U - - Google Patents

Info

Publication number

JPH0236075U

JPH0236075U JP11536388U JP11536388U JPH0236075U JP H0236075 U JPH0236075 U JP H0236075U JP 11536388 U JP11536388 U JP 11536388U JP 11536388 U JP11536388 U JP 11536388U JP H0236075 U JPH0236075 U JP H0236075U

Authority

JP

Japan

Prior art keywords

pad

wiring board

printed wiring

copper

longitudinal direction

Prior art date

1988-08-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 2
• 238000000576 coating method Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 229910052802 copper Inorganic materials 0.000 description 3
• 239000010949 copper Substances 0.000 description 3
• 238000007747 plating Methods 0.000 description 3
• 239000011889 copper foil Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1