JPH0236070U - - Google Patents

Info

Publication number

JPH0236070U

JPH0236070U JP11541888U JP11541888U JPH0236070U JP H0236070 U JPH0236070 U JP H0236070U JP 11541888 U JP11541888 U JP 11541888U JP 11541888 U JP11541888 U JP 11541888U JP H0236070 U JPH0236070 U JP H0236070U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

composite

rigid

flexible printed

Prior art date

1988-08-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002131 composite material Substances 0.000 claims 2
• 238000010030 laminating Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 239000011889 copper foil Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000000605 extraction Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1