JPH0236066U - - Google Patents
Info
- Publication number
- JPH0236066U JPH0236066U JP11565888U JP11565888U JPH0236066U JP H0236066 U JPH0236066 U JP H0236066U JP 11565888 U JP11565888 U JP 11565888U JP 11565888 U JP11565888 U JP 11565888U JP H0236066 U JPH0236066 U JP H0236066U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- undercoat layer
- thickness
- same
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11565888U JPH0236066U (ro) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11565888U JPH0236066U (ro) | 1988-09-02 | 1988-09-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0236066U true JPH0236066U (ro) | 1990-03-08 |
Family
ID=31357516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11565888U Pending JPH0236066U (ro) | 1988-09-02 | 1988-09-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0236066U (ro) |
-
1988
- 1988-09-02 JP JP11565888U patent/JPH0236066U/ja active Pending