JPH0236049U - - Google Patents
Info
- Publication number
- JPH0236049U JPH0236049U JP11536088U JP11536088U JPH0236049U JP H0236049 U JPH0236049 U JP H0236049U JP 11536088 U JP11536088 U JP 11536088U JP 11536088 U JP11536088 U JP 11536088U JP H0236049 U JPH0236049 U JP H0236049U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- semiconductor device
- lead
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11536088U JPH0236049U (fi) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11536088U JPH0236049U (fi) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236049U true JPH0236049U (fi) | 1990-03-08 |
Family
ID=31356950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11536088U Pending JPH0236049U (fi) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236049U (fi) |
-
1988
- 1988-08-31 JP JP11536088U patent/JPH0236049U/ja active Pending