JPH0236036U - - Google Patents
Info
- Publication number
- JPH0236036U JPH0236036U JP1988115464U JP11546488U JPH0236036U JP H0236036 U JPH0236036 U JP H0236036U JP 1988115464 U JP1988115464 U JP 1988115464U JP 11546488 U JP11546488 U JP 11546488U JP H0236036 U JPH0236036 U JP H0236036U
- Authority
- JP
- Japan
- Prior art keywords
- convex
- electrode
- semiconductor device
- semiconductor element
- convex electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115464U JPH0236036U (enrdf_load_stackoverflow) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115464U JPH0236036U (enrdf_load_stackoverflow) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236036U true JPH0236036U (enrdf_load_stackoverflow) | 1990-03-08 |
Family
ID=31357146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988115464U Pending JPH0236036U (enrdf_load_stackoverflow) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236036U (enrdf_load_stackoverflow) |
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1988
- 1988-08-31 JP JP1988115464U patent/JPH0236036U/ja active Pending