JPH0235454U - - Google Patents
Info
- Publication number
- JPH0235454U JPH0235454U JP1988112881U JP11288188U JPH0235454U JP H0235454 U JPH0235454 U JP H0235454U JP 1988112881 U JP1988112881 U JP 1988112881U JP 11288188 U JP11288188 U JP 11288188U JP H0235454 U JPH0235454 U JP H0235454U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical
- semiconductor optical
- optical active
- package
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988112881U JPH0713240Y2 (ja) | 1988-08-29 | 1988-08-29 | 半導体光学能動素子用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988112881U JPH0713240Y2 (ja) | 1988-08-29 | 1988-08-29 | 半導体光学能動素子用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0235454U true JPH0235454U (US06277897-20010821-C00009.png) | 1990-03-07 |
JPH0713240Y2 JPH0713240Y2 (ja) | 1995-03-29 |
Family
ID=31352223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988112881U Expired - Lifetime JPH0713240Y2 (ja) | 1988-08-29 | 1988-08-29 | 半導体光学能動素子用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0713240Y2 (US06277897-20010821-C00009.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08222745A (ja) * | 1995-02-13 | 1996-08-30 | Nec Corp | 半導体装置 |
-
1988
- 1988-08-29 JP JP1988112881U patent/JPH0713240Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08222745A (ja) * | 1995-02-13 | 1996-08-30 | Nec Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0713240Y2 (ja) | 1995-03-29 |