JPH0235032B2 - NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO - Google Patents
NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHOInfo
- Publication number
- JPH0235032B2 JPH0235032B2 JP27199185A JP27199185A JPH0235032B2 JP H0235032 B2 JPH0235032 B2 JP H0235032B2 JP 27199185 A JP27199185 A JP 27199185A JP 27199185 A JP27199185 A JP 27199185A JP H0235032 B2 JPH0235032 B2 JP H0235032B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- degreasing
- treatment
- soft magnetic
- precision parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 19
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000009489 vacuum treatment Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000010775 animal oil Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
- C23C18/1817—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、プリンターの印字駆動部に使用さ
れるアーマチアやヨークのように、磁気回路を構
成するとともに耐摩耗性が要求される精密部品の
表面硬化処理方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention is applicable to precision parts that constitute a magnetic circuit and require wear resistance, such as armatures and yokes used in the printing drive section of printers. The present invention relates to a surface hardening treatment method.
［従来の技術］
従来において、軟磁特性が要求される精密部
品、たとえばプリンターの印字駆動部のアーマチ
ア、ヨーク等には、、電磁軟鉄、ケイ素鋼等の表
面に防錆および耐摩性を付与する目的でNiメツ
キ、Znメツキ、Crメツキ、Ni−Ｐ無電界メツキ
などがほどこされている。[Prior Art] Conventionally, precision parts that require soft magnetic properties, such as the armature and yoke of the printing drive part of printers, have been manufactured with the purpose of imparting rust prevention and wear resistance to the surfaces of electromagnetic soft iron, silicon steel, etc. Ni plating, Zn plating, Cr plating, Ni-P electroless plating, etc. are applied.
［発明が解決しようとする問題点］
上記従来例において、Niメツキ、Znメツキは
表面硬度がHV400程度であり耐摩耗性で問題が
ある。CrメツキはHV800程度であり耐久性は有
利であるが、電気メツキのための部品へのメツキ
の付き回りにムラがあり、量産上不適当である。
Ni−Ｐメツキでも耐摩耗性がHV400以下と低い
ので問題である。なお、Ni−Ｐメツキ後400℃前
後で熱処理を行なうとHV800程度に向上するが、
その場合材料本来の磁気特性に劣化が生じるため
使用することができない。[Problems to be Solved by the Invention] In the conventional example described above, the surface hardness of Ni plating and Zn plating is about HV400, and there is a problem in wear resistance. Cr plating has a durability of about HV800, but it is not suitable for mass production because the plating is unevenly applied to parts for electroplating.
Even Ni-P plating has a low wear resistance of HV400 or less, which is a problem. In addition, if heat treatment is performed at around 400℃ after Ni-P plating, the HV will improve to about 800, but
In that case, the original magnetic properties of the material deteriorate, so it cannot be used.
［問題点を解決するための手段］
この発明はこうした従来例における問題点を解
決するためのものであり、ケイ素鋼部材に対し、
まず、磁気特性を得る目的、および表面の酸化膜
の形成防止をかねて真空中において焼鈍し、つい
でメツキのための前処理として、有機溶剤による
脱脂処理、アルカリによる脱脂処理、酸洗い処
理、さらに酸とインヒビターの混合液によるシリ
コン酸化物除去処理を施した後、ニツケル・ボロ
ン系無電解化学メツキを施すことにより、被処理
材の磁性特性を損なうことなく、高硬度の表面硬
化処理をするものである。[Means for Solving the Problems] The present invention is intended to solve the problems in the conventional examples.
First, in order to obtain magnetic properties and to prevent the formation of an oxide film on the surface, annealing is performed in a vacuum.Then, pretreatment for plating includes degreasing with an organic solvent, degreasing with an alkali, pickling, and further acid washing. After silicon oxide removal treatment using a mixed solution of nickel and inhibitor, nickel-boron electroless chemical plating is applied to harden the surface of the treated material without damaging its magnetic properties. be.
［実施例］
まず素材として３％ケイ素鋼を用い、所定の部
品形状に加工しておく。このケイ素鋼は磁気特性
はすぐれているが、表面が活性のため酸化膜
（SiO2）を形成しやすい材料である。[Example] First, 3% silicon steel is used as a material and processed into a predetermined part shape. This silicon steel has excellent magnetic properties, but because of its active surface, it is a material that tends to form an oxide film (SiO 2 ).
本発明による処理法は、第一ステツプとして、
ケイ素鋼本来の磁気特性を得る目的とともにケイ
素鋼表面に酸化膜の形成防止を兼ねて、真空中に
おいて850℃、１時間の焼鈍をおこなう。この場
合、真空雰囲気以外のN2、Ar等の無酸化雰囲気
は表面見かけ上光輝に仕上がるが、最終的なメツ
キ仕上り後の密着性が不十分であり、真空雰囲気
による熱処理が必要とされる。 In the treatment method according to the present invention, as a first step,
In order to obtain the original magnetic properties of silicon steel and also to prevent the formation of an oxide film on the silicon steel surface, annealing is performed at 850°C for 1 hour in a vacuum. In this case, a non-oxidizing atmosphere such as N2 or Ar other than a vacuum atmosphere will give the surface a bright appearance, but the adhesion after the final plating finish will be insufficient, and heat treatment in a vacuum atmosphere will be required.
第二のステツプとして、無電解Niメツキの前
処理として次の工程の処理をする。 As a second step, the next process is performed as a pretreatment for electroless Ni plating.
(1) 脱脂処理として、主に鉱物油の除去を目的と
して有機溶剤による処理をする。有機溶剤とし
て、例えば１−１−１トルクロルエタンの液中
に超音波をかけて約３分間浸漬する。(1) Degreasing treatment is performed using organic solvents mainly to remove mineral oil. The sample is immersed in an organic solvent such as 1-1-1 torchloroethane for about 3 minutes by applying ultrasonic waves.
(2) ついで第二の脱脂処理として、主に動、植物
油の除去を目的として、アルカリと表面活性剤
の混合液、たとえば、オルソケイ酸ソーダのよ
うな市販のアルカリ脱脂剤で、被処理材を揺動
しながら約３分間液中に浸漬する。(2) Next, as a second degreasing treatment, the material to be treated is treated with a mixture of an alkali and a surfactant, such as a commercially available alkaline degreaser such as sodium orthosilicate, mainly for the purpose of removing animal and vegetable oils. Immerse in the liquid for about 3 minutes while shaking.
(3) つぎに主に鉄の酸化物の除去を目的として、
７％の塩酸水溶液中で約10〜30秒被処理材を揺
動しながら浸漬する。(3) Next, mainly for the purpose of removing iron oxides,
The material to be treated is immersed in a 7% hydrochloric acid aqueous solution for about 10 to 30 seconds while rocking.
(4) さらに主にシリコンの酸化物の除去を目的と
して、フツ素化合物を主成分とした、酸とイン
ヒビターの混合液の希釈液中に被処理物を揺動
しながら10〜30秒間浸漬する。(4) Furthermore, the object to be treated is immersed for 10 to 30 seconds while rocking in a diluted mixture of acid and inhibitor, mainly containing fluorine compounds, for the purpose of removing silicon oxides. .
上記１〜４の前処理を施した後、最後に被処理
物の耐久性を上げる目的で、ジメチルアミンボラ
ンを還元剤としたニツケル無電解メツキ液中に浸
漬して、ニツケルに１％程度のボロンを添加した
無電解化学Niメツキ層を８〜12μｍ程度付着させ
る。8μｍ未満では十分な耐久性を得ることはで
きず、12μｍを超えると密着性に難が生じてく
る。 After performing the pretreatments 1 to 4 above, finally, in order to increase the durability of the workpiece, it is immersed in a nickel electroless plating solution using dimethylamine borane as a reducing agent. An electroless chemical Ni plating layer containing boron is deposited to a thickness of about 8 to 12 μm. If it is less than 8 μm, sufficient durability cannot be obtained, and if it exceeds 12 μm, adhesion becomes difficult.
以上の工程を経て得られた被処理材はNi−Ｂ
系のメツキによる表面硬度はHV700以上得られ、
耐久性が向上する。 The treated material obtained through the above process is Ni-B
The surface hardness obtained by plating the system is over HV700,
Improves durability.
インパクト型ドツトプリンタの印字機構のヨー
クに本発明の処理を施したものを用いて、従来の
Niメツキのものを使つたプリンタと印字回数を
比較すると、従来のものでは3000万字程度の耐久
性であつたのに対し、本発明のものでは約１億字
と耐久性が飛躍的に向上した。 By using the yoke of the printing mechanism of an impact-type dot printer that has undergone the treatment of the present invention, it is possible to
Comparing the number of prints with a printer using Ni plating, the durability of the conventional printer was approximately 30 million characters, while the durability of the printer of the present invention was dramatically improved to approximately 100 million characters. .
［発明の効果］
この発明によれば、軟磁性精密部品に対し、磁
性特性を保ちながら、密着性よくメツキによる硬
化層を形成することができる。[Effects of the Invention] According to the present invention, a hardened layer can be formed on a soft magnetic precision component by plating with good adhesion while maintaining magnetic properties.
Claims (1)
空中で焼鈍する工程と、 メツキの前処理として、有機溶剤による脱脂処
理、アルカリによる脱脂処理、酸洗い処理、さら
に酸とインヒビターの混合液によるシリコン酸化
物除去処理を順次ほどこす工程と、 ニツケル・ボロン系無電解化学メツキを施す工
程、 とを含む軟磁性精密部品の表面硬化処理方法。[Claims] 1 Precision parts made of soft magnetic silicon steel are annealed in a vacuum, and pre-treatment for plating includes degreasing with an organic solvent, degreasing with an alkali, pickling, and further with acid. A method for surface hardening of soft magnetic precision parts, comprising the steps of sequentially applying silicon oxide removal treatment using an inhibitor mixture, and applying nickel-boron electroless chemical plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27199185A JPH0235032B2 (en) | 1985-12-03 | 1985-12-03 | NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27199185A JPH0235032B2 (en) | 1985-12-03 | 1985-12-03 | NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133080A JPS62133080A (en) | 1987-06-16 |
| JPH0235032B2 true JPH0235032B2 (en) | 1990-08-08 |
Family
ID=17507626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27199185A Expired - Lifetime JPH0235032B2 (en) | 1985-12-03 | 1985-12-03 | NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235032B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY139405A (en) | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| JP4887410B2 (en) | 2009-09-09 | 2012-02-29 | 株式会社沖データ | Print head and printing device |
-
1985
- 1985-12-03 JP JP27199185A patent/JPH0235032B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62133080A (en) | 1987-06-16 |
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