JPH0234858A - Preparation of developing solution for photoresist - Google Patents
Preparation of developing solution for photoresistInfo
- Publication number
- JPH0234858A JPH0234858A JP27996888A JP27996888A JPH0234858A JP H0234858 A JPH0234858 A JP H0234858A JP 27996888 A JP27996888 A JP 27996888A JP 27996888 A JP27996888 A JP 27996888A JP H0234858 A JPH0234858 A JP H0234858A
- Authority
- JP
- Japan
- Prior art keywords
- ethylene oxide
- trimethylamine
- mole
- choline
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims abstract description 58
- 238000006243 chemical reaction Methods 0.000 claims abstract description 28
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000002156 mixing Methods 0.000 claims abstract description 15
- 239000007864 aqueous solution Substances 0.000 claims description 27
- 238000011161 development Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 34
- 229960001231 choline Drugs 0.000 description 34
- 239000007795 chemical reaction product Substances 0.000 description 23
- 238000007086 side reaction Methods 0.000 description 23
- 239000000243 solution Substances 0.000 description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- -1 halide salt Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000007970 homogeneous dispersion Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000012264 purified product Substances 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は、フォトレジスト現像液の製造方法に関し、さ
らに詳しくはフォトレジスト現像液として力価が有効に
制御されるとともに、高純度であり、かつ作業上及び保
存上の安定性が優れたコリン水溶液の製造方法に関する
。[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for producing a photoresist developer, and more specifically, the present invention relates to a method for producing a photoresist developer, and more specifically, a method for producing a photoresist developer, in which the titer is effectively controlled, and The present invention relates to a method for producing an aqueous choline solution that is highly pure and has excellent operational and storage stability.
(従来技術)
半導体表面の洗浄、食刻、感光性樹脂の現像等の半導体
処理剤として、強い塩基性を有する水酸化第四アンモニ
ウムが有用であることは既に知られている(特公昭55
−40181号、特公昭55−40183号、特公昭5
5−41529号公報参照)、 大部分の水酸化第四ア
ンモニウムの製造方法は、先ず第四アンモニウム塩基の
ハロゲン化塩、vA酸塩、その他の酸根との塩を得たの
ち、その塩に銀、バリウム、その他の金属の酸化物、水
酸化物等を作用させて、酸根を水酸基に置換するか、或
はその塩を隔WA電解法により処理するかして製造する
のが、従来から一般的に行われてきた方法である。 と
ころが酸根を水酸基に置換する方法においては、溶解度
積以下の金属イオンが不純物として混入するのは避けら
れないし、また隔FM電解法においては、陽極の溶解物
が混入するおそれがある。(Prior art) It is already known that quaternary ammonium hydroxide, which has strong basicity, is useful as a semiconductor processing agent for cleaning semiconductor surfaces, etching, developing photosensitive resins, etc.
-40181, Special Publication No. 55-40183, Special Publication No. 55
5-41529), the method for producing most quaternary ammonium hydroxides is to first obtain a halide salt of a quaternary ammonium base, a vA salt, or a salt with other acid groups, and then add silver to the salt. Traditionally, it has been generally produced by reacting barium, oxides, hydroxides, etc. of other metals to replace acid groups with hydroxyl groups, or by treating the salts with hydroxyl groups. This is the method that has been used in the past. However, in the method of substituting acid radicals with hydroxyl groups, it is inevitable that metal ions having a solubility product or less are mixed in as impurities, and in the FM electrolysis method, there is a risk that dissolved substances from the anode may be mixed in.
しかるに、半導体処理剤にとっては、なるべく不純物が
少ないことが望ましく、就中無機元素が皆無に近いこと
が重要な条件である。 この点コリン(水酸化2−オキ
シエチルトリメチルアンモニラi [HOCH,−C
H2−N”÷CH3)、]OH−3は、トリメチルアミ
ン水溶液にエチレンオキシドを、気体、液体又は水溶液
の状態で加えることにより容易に製造することができ、
上記原料も高純度のものが得られるから、Na 、Cu
、A(1等の不純物が極めて少ない半導体処理剤が得ら
れるという利点がある。 加えて、コリン0.1N水溶
液の25℃におけるpHは12,8であって、苛性ソー
ダ0.1N水溶液の25℃におけるDHとほぼ同程度の
塩基性を有する。 このように、半導体処理剤としてコ
リン水溶液が特に賞用できることも既に知られている(
特公昭53−20376号、特公昭53−20377号
公報参照)。However, it is desirable for a semiconductor processing agent to contain as few impurities as possible, and an especially important condition is that it should contain almost no inorganic elements. At this point, choline (2-oxyethyltrimethylammonyl hydroxide [HOCH, -C
H2-N"÷CH3), ]OH-3 can be easily produced by adding ethylene oxide to an aqueous trimethylamine solution in the form of a gas, liquid or aqueous solution,
Since the above raw materials can also be obtained with high purity, Na, Cu
, A(1, etc.) has the advantage of providing a semiconductor processing agent with very few impurities. In addition, the pH of a 0.1N aqueous solution of choline at 25°C is 12.8, and the pH of a 0.1N aqueous solution of caustic soda at 25°C It has almost the same level of basicity as DH in (
(See Japanese Patent Publication No. 53-20376 and Japanese Patent Publication No. 53-20377).
しかしながら、上記のように製造されたコリン水溶液を
希釈調整し、コリン濃度を一定にして、半導体表面の洗
浄、食刻、感光性樹脂の現像等に用いた場合に、コリン
の製造ロヅト毎に食刻速度や現像速度などのバラツキが
あり、半導体処理剤として作業上または保存上の安定性
に欠けるという問題があった。However, when the aqueous choline solution produced as described above is diluted to maintain a constant choline concentration and used for cleaning semiconductor surfaces, etching, developing photosensitive resins, etc., the amount of choline produced is There was a problem that there were variations in engraving speed, developing speed, etc., and that it lacked operational and storage stability as a semiconductor processing agent.
なおコリン水溶液がフォトレジスト現像液とし。Note that choline aqueous solution is used as a photoresist developer.
て使用されることは公知であるが(特開昭53−519
71号公報)、コリン副反応生成物が現像に関与するこ
とは知られておらず、またコリン反応の副反応生成物に
ついての公知事項は特公昭37−9558号公報に開示
されているが、フォトレジスト現像液に関与することは
示唆されていない。Although it is known that it is used as
No. 71), it is not known that choline side reaction products are involved in development, and known matters regarding side reaction products of choline reaction are disclosed in Japanese Patent Publication No. 37-9558. There is no suggestion that photoresist developer is involved.
(発明が解決しようとする課題)
従って、本発明の目的は、半導体処理剤としてのコリン
水溶液が、金属イオン等の有害な不純物を含まないこと
は勿論、半導体処理剤として一定の条件下で一定の食刻
速度、現像速度が得られるようなフォトレジスト現像液
を簡単で安価に製造する方法を提供することにある。(Problems to be Solved by the Invention) Therefore, an object of the present invention is to ensure that an aqueous choline solution as a semiconductor processing agent does not contain harmful impurities such as metal ions, and that it remains stable under certain conditions as a semiconductor processing agent. It is an object of the present invention to provide a simple and inexpensive method for producing a photoresist developer capable of obtaining etching and developing speeds of .
[発明の構成]
(課題を解決するための手段と作用)
本発明者らは、この問題について種々検討した結果、ト
リメチルアミンとエチレンオキシドとの反応は、次式(
I)の主反応と次式(II)及び(III)の副反応か
らなるものと考え、(HOC82CH2N” (CH,
))OHコリン水溶液中の溶質全体に対するコリン含量
を高めるとともに、副反応生成物を共存させることによ
り、現像速度が制御できることを見いだした。[Structure of the Invention] (Means and Effects for Solving the Problem) As a result of various studies on this problem, the present inventors found that the reaction between trimethylamine and ethylene oxide is expressed by the following formula (
Considering that it consists of the main reaction of I) and the side reactions of the following formulas (II) and (III), (HOC82CH2N" (CH,
)) It has been found that the development rate can be controlled by increasing the choline content relative to the total solutes in the OH choline aqueous solution and allowing side reaction products to coexist.
また両反応液を反応器中に一度に投入し、速やかに均一
に混合すること、またエチレンオキシドに対してトリメ
チルアミンを1モル以上で反応させることにより、副反
応生成物を減少安定させることができ、これによってフ
ォトレジスト現像液としての力価を予期せぬ程に安定な
レベルにまで上げることを見いだして本発明をなすに至
った。In addition, by charging both reaction solutions into the reactor at once and mixing them quickly and uniformly, and by reacting trimethylamine with ethylene oxide in an amount of 1 mole or more, side reaction products can be reduced and stabilized. The inventors have discovered that this increases the potency of the photoresist developer to an unexpectedly stable level, leading to the present invention.
即ち、本発明のフォトレジスト現像液製造方法は、エチ
レンオキシド1モルに対し1モル以上のトリメチルアミ
ンを含有するトリメチルアミン水溶液と、エチレンオキ
シド水溶液又は液状エチレンオキシドの両液を、反応器
中に一度に投入し、速やかに均一分散状態となるように
混合して反応させることを特徴とするものである。That is, in the method for producing a photoresist developer of the present invention, a trimethylamine aqueous solution containing 1 mole or more of trimethylamine per 1 mole of ethylene oxide, and an ethylene oxide aqueous solution or liquid ethylene oxide are both charged into a reactor at once, and then It is characterized by mixing and reacting so as to obtain a uniformly dispersed state.
以下に本発明製造方法について説明する。The manufacturing method of the present invention will be explained below.
コリン生成反応に使用するトリメチルアミンは水溶液と
して用いる。 その濃度は制限されないが、15〜35
重量%の濃度のものを用いて十分目的を達成することが
できる。 同様にエチレンオキシド水溶液の濃度にも制
限がなく、10〜20ff量%の濃度のものを用いるこ
とができる。エチレンオキシドの沸点は10.7℃であ
り、液状のエチレンオキシドも支障なく用いることがで
きる。Trimethylamine used in the choline production reaction is used as an aqueous solution. The concentration is not limited, but 15-35
The purpose can be sufficiently achieved using a concentration of % by weight. Similarly, there is no limit to the concentration of the ethylene oxide aqueous solution, and a concentration of 10 to 20 ff% can be used. The boiling point of ethylene oxide is 10.7°C, and liquid ethylene oxide can also be used without any problem.
トリメチルアミン水溶液とエチレンオキシドの反応液と
は、両液を反応器中に一度に投入することが必要である
。 その意味は、一方の反応液を他方の反応液に時間を
かけて滴下したり、一方の・反応液に他方の反応液の一
部を投入して反応後、他方の反応液の残部を投入して反
応させてはならず、一方の反応液が徐々に投入されるな
らば他方の反応液ら一方の反応液に対して常に所定のモ
ル比を維持するように徐々に投入する(下記実験番号5
参照)ということである、 また、反応器中に投入され
た両液は速やかに均−分散状態となるように混合しなけ
ればならない、 均一分散状態とは通常の意味で、例え
ばトレーサ溶液が実質的に均一に分布する状態の意味で
用いている。 速やかにその状態にするとは、混合反応
の最高温度(通常は常温の両液を混合して30〜60℃
となるが)に達するまでの時間の115の時間以内であ
ることが好ましく、その時間はできるだけ短いのがよい
、 そのような速やかな混合状態は、低粘度用邪魔板付
プロペラ式攪拌機によって容易にその状態にすることが
でき、また筒状のスタティックミキサーに両液夫々の流
入口を設け、所定の割合で流入混合させれば、瞬時に目
的の混合状態にすることができる。It is necessary to charge both the trimethylamine aqueous solution and the ethylene oxide reaction solution into the reactor at once. This means dropping one reaction solution into the other reaction solution over time, or adding a portion of the other reaction solution to one reaction solution, and then adding the remainder of the other reaction solution after the reaction. If one reaction solution is added gradually, the other reaction solution should be added gradually so as to always maintain a predetermined molar ratio to one reaction solution. number 5
In addition, both liquids introduced into the reactor must be quickly mixed to become a homogeneous dispersion state. A homogeneous dispersion state is the usual meaning, for example, when the tracer solution is substantially It is used to mean a state of uniform distribution. To quickly achieve this state means to raise the maximum temperature of the mixing reaction (usually 30 to 60°C by mixing both liquids at room temperature).
It is preferable that the mixing time is within 115 hours of the time it takes to reach 115 minutes, and that time should be as short as possible.Such a rapid mixing state can be easily achieved using a propeller type stirrer with a baffle for low viscosity. Furthermore, if a cylindrical static mixer is provided with an inlet for each of the two liquids and the two liquids are introduced and mixed at a predetermined ratio, the desired mixed state can be instantaneously achieved.
(実施例)
以上の投入混合方法について具体的に述べれば、17.
2重量%濃度のトリメチルアミン水溶液と11.6重量
%濃度のエチレンオキシド水溶液とを、エチレンオキシ
ド1モルに対しトリメチルアミン1.10モルの割合で
、両液を邪魔板付撹拌機を設けた反応器又はスタティッ
クミキサーを用い、第1表の条件で投入混合し、反応し
たコリンの溶質に対する重量百分率を求めた。(Example) To specifically describe the above input mixing method, 17.
A trimethylamine aqueous solution with a concentration of 2% by weight and an aqueous solution of ethylene oxide with a concentration of 11.6% by weight were mixed in a ratio of 1.10 moles of trimethylamine to 1 mole of ethylene oxide, and both solutions were mixed in a reactor equipped with a stirrer with a baffle plate or a static mixer. The mixture was added and mixed under the conditions shown in Table 1, and the weight percentage of the reacted choline to the solute was determined.
第1表にみるように、両液を一度に投入し遠やかに混合
することによって、コリンの溶質中に占める割合が99
,6%以上という極めて高純度で、バラツキの少ない安
定な水溶液を得ることができ、これをコリン以外の副反
応生成物という面からみると、両液を一度に投入し速や
かに混合したものの4,6重量%コリン水溶液中におけ
る副反応生成物は100〜sooppmの範囲にある。As shown in Table 1, by adding both solutions at once and mixing them remotely, the proportion of choline in the solute can be reduced to 99%.
, a stable aqueous solution with extremely high purity of 6% or more and little variation can be obtained.From the perspective of side reaction products other than choline, even though both solutions were added at once and mixed quickly, , the side reaction products in a 6 wt % choline aqueous solution are in the range of 100 to sooppm.
ここで、この副反応生成物の濃度は、反応生成水溶液
を陽イオン交換樹脂によりアルカリ分を除き、ガスクロ
マイグラフ分析を行った結果得られたエチレングリコー
ルとポリオキシエチレングリコールとの!tめ和であり
、以下に示される副反応生成物の濃度はすべてこの方法
による。Here, the concentration of this side reaction product is the difference between ethylene glycol and polyoxyethylene glycol obtained by removing the alkaline content from the reaction product aqueous solution using a cation exchange resin and performing gas chromigraph analysis. The concentrations of side reaction products shown below are all based on this method.
得られた反応液の現像液力価である現像時間を、コリン
濃度4.6重量%にしたときの現像時間Aとそのバラツ
キ、さらにそのバラツキをよりわかりやすくするために
現像時間が40秒になるようにコリン濃度を調整したと
きの現像時間Bのバラツキの二点から調べた。 すなわ
ち、反応液は反応後の過剰なトリメチルアミンを加熱吸
引して除去したのち、それぞれコリン濃度を調整し、石
炭酸ホルマリン縮合物にスルホン基を介してキノンアザ
イドが結合した型のレジストを用いて現像時間A及びB
を測定した。 その結果、副反応生成物が共存するフォ
トレジスト現像液によって、現像時間が速くなるととも
に副反応生成物の量によって現像時間が制御できること
がわかる。 また第1表にみるように、攪拌が不十分な
場合や、滴下攪拌した場合に、現像時間が大きく変動す
るのに対し、−度に投入し速やかに混合するという製造
方法によって得られた反応液はいずれも現像時間A及び
Bが40±0.5秒と安定した性能を示した。The development time A, which is the developer titer of the obtained reaction solution, is the development time A when the choline concentration is 4.6% by weight, its variation, and the development time is changed to 40 seconds to make the variation easier to understand The investigation was made from two points: the variation in development time B when the choline concentration was adjusted so that That is, after the reaction solution was heated and suctioned to remove excess trimethylamine after the reaction, the choline concentration was adjusted, and a resist in which quinone azide was bonded to a carbonic acid-formalin condensate via a sulfone group was used for development for a period of A. and B
was measured. The results show that a photoresist developer in which side reaction products coexist can speed up the development time, and that the development time can be controlled by the amount of side reaction products. In addition, as shown in Table 1, the development time fluctuates greatly when stirring is insufficient or when stirring is carried out dropwise. Both solutions exhibited stable performance with development times A and B of 40±0.5 seconds.
次にコリン含量が高く副反応生成物が減少安定して、現
像液力価が安定したものは、エチレンオキシド1モルに
対してトリメチルアミン1モル以上、より好ましくは1
.05〜1.10モルの割合で混合反応させて得たもの
である。 エチレンオキシドのほうがトリメチルアミン
に対して過剰にあるとエチレングリコールなど副反応生
成物が不安定に高まる。 一方トリメチルアミンが1モ
ル以上であってしかも過剰になっている場合は、反応終
了後、液を40〜70℃に保ち、吸引しなからN2ガス
を吹き込むと、容易に揮発除去することができ、より安
定なフォトレジスト現像液が得られるという利点がある
。 なお、反応に用いるエチレンオキシド水溶液は、エ
チレングリコールなどの副反応生成物が徐々に生成する
ので、調整後1時間以内に用いるのがよい、 第2表に
トリメチルアミン/エチレンオキシドのモル比に対する
、反応液(コリン4,6重量%水溶液に調!1)の溶質
中のコリン重量百分率、コリン4.6重量%水溶液にお
ける副反応生成物の量、コリン4,6重量%水溶液の現
像時間Aにおけるバラツキ、及び現像時間40秒にコリ
ン濃度をほぼ調整したときの現像時間Bにおけるバラツ
キとの関係を示す。Next, those with a high choline content, reduced side reaction products, and stable developer titer are 1 mole or more of trimethylamine per 1 mole of ethylene oxide, more preferably 1 mole or more of trimethylamine.
.. It was obtained by mixing and reacting at a ratio of 0.05 to 1.10 moles. If ethylene oxide is in excess relative to trimethylamine, side reaction products such as ethylene glycol will become unstable. On the other hand, if the amount of trimethylamine is 1 mole or more and is in excess, it can be easily removed by volatilization by keeping the liquid at 40 to 70°C and blowing N2 gas without suctioning it after the reaction is completed. This has the advantage that a more stable photoresist developer can be obtained. The ethylene oxide aqueous solution used in the reaction is preferably used within 1 hour after preparation, as side reaction products such as ethylene glycol are gradually generated. Adjust to a 4.6 wt% choline aqueous solution!1) The weight percentage of choline in the solute, the amount of side reaction products in the 4.6 wt% choline aqueous solution, the variation in the development time A of the 4.6 wt% choline aqueous solution, and The relationship with the variation in the development time B when the choline concentration is approximately adjusted to a development time of 40 seconds is shown.
第2表にみるように、トリメチルアミンをエチレンオキ
シド1モルに対し1モル以上の割合に混合した場合には
、コリンの含有が99.3%以上の高純度のものが得ら
れ、特に1.05〜1.10モルの割合に混合した場合
には9965%以上の高純度になる。As shown in Table 2, when trimethylamine is mixed at a ratio of 1 mole or more to 1 mole of ethylene oxide, a highly purified product with a choline content of 99.3% or more can be obtained, especially from 1.05 to 1.05%. When mixed at a ratio of 1.10 mol, the purity is as high as 9965% or more.
このことは現像時間A及びBのバラツキにW4著にあら
れれ、特に現像時間を40秒に調整したときの現像時間
Bのバラツキは、トリメチルアミン1モル以上で極めて
安定している。 特にトリメチルアミン1.05〜1.
10の範囲では現像時間Bは±0.5秒の範囲にある。This is caused by the variation in the development times A and B, and in particular, the variation in the development time B when the development time is adjusted to 40 seconds is extremely stable at 1 mole or more of trimethylamine. Especially trimethylamine 1.05-1.
In the range of 10, the development time B is in the range of ±0.5 seconds.
これに対してトリメチルアミン1モル未満では、実験
番号11のように、40±10秒と工程管理のできない
程度のバラツキがある。On the other hand, when the amount of trimethylamine is less than 1 mole, as in Experiment No. 11, there is a variation of 40±10 seconds, which is such that process control is impossible.
次に本発明製造方法によって得られたフォトレジスト現
像液を詳しく説明すると、トリメチルアミン水溶液とエ
チレンオキシド水溶液又は液状エチレンオキシドの両液
を混合反応させた水酸化−2−オキシエチルトリメチル
アンモニウム(コリン)水溶液は、この反応特有の副反
応生成物を含有する、 この反応の副反応生成物には、
前記したようにエチレングリコール及びその多量体を含
み、そして副反応生成物はその量が極めて微量であるに
しかかわらず、フォトレジスト現像液の力価である現像
時間の制御にとって極めて有効なものである。 本発明
のフォトレジスト現像液はこの知見に基づくものである
。Next, to explain in detail the photoresist developer obtained by the production method of the present invention, an aqueous solution of 2-oxyethyltrimethylammonium hydroxide (choline) obtained by mixing and reacting a trimethylamine aqueous solution and an ethylene oxide aqueous solution or liquid ethylene oxide is as follows: Contains side reaction products specific to this reaction. The side reaction products of this reaction include:
As mentioned above, the side reaction product contains ethylene glycol and its polymers, and although the amount thereof is extremely small, it is extremely effective in controlling the development time, which is the titer of the photoresist developer. . The photoresist developer of the present invention is based on this knowledge.
また、上記した第1表及び第2表にみたように、エチレ
ンオキシド1モルに対しトリメチルアミンを1モル以上
で反応させ、現像時間Bのバラツキが±3.0秒以下で
ある実験番号のものはすべて、副反応生成物が100〜
5001)l)lの範囲にあり、−方副反応生成物が1
00〜500 ppmの範囲外にあるものはすべて、現
像時間Bのバラツキが±10秒以上である。 従ってエ
チレンオキシド1モルに対しトリメチルアミンを1モル
以上として両者を反応させ、4.6重量%コリン水溶液
における副反応生成物の量を100〜soo ppnの
割合としたときのフォトレジスト現像液は、たしかに現
像時間のバラツキを著しく減少させることができる。
そして、コリン濃度を4.6重量%以外の値、例えば×
重量%にする場合には、副反応生成物を同じ比で、(X
/4.6 ) X1001)I)II 〜(x/4.6
) x500ppnの範囲に抑えればよい、 なお副
反応生成物の量は、溶質のコリン量を測定し、その値か
らコリン以外の溶質をコリン濃度4.6重量%水溶液の
ppm(重量)として求めるものである。In addition, as shown in Tables 1 and 2 above, all experiments with experiment numbers in which 1 mole of ethylene oxide was reacted with 1 mole or more of trimethylamine and the variation in development time B was ±3.0 seconds or less , side reaction products are 100~
5001)l)l, and the side reaction product is 1
In all cases outside the range of 00 to 500 ppm, the variation in development time B is ±10 seconds or more. Therefore, when 1 mole of ethylene oxide is mixed with 1 mole or more of trimethylamine and the two are reacted, and the amount of side reaction products in a 4.6% choline aqueous solution is set at a ratio of 100 to soo ppn, the photoresist developer will certainly be Time variations can be significantly reduced.
Then, set the choline concentration to a value other than 4.6% by weight, for example ×
When expressed as weight percent, the side reaction products are added in the same ratio (X
/4.6) X1001)I)II ~(x/4.6
) The amount of side reaction products can be determined by measuring the amount of choline in the solute and calculating the amount of solutes other than choline as ppm (weight) of an aqueous solution with a choline concentration of 4.6% by weight. It is something.
なお、本発明の製造方法により得られた4、6重量%コ
リン水溶液に含まれる有害金属イオンは、銀、カドミウ
ム、銅、カルシウム、カリウム、マグネシウム、鉛が0
.005 ppn以下、鉄、ナトリウム、亜鉛が0.0
1 pp11以下と極めて少なかった。It should be noted that the harmful metal ions contained in the 4.6% by weight choline aqueous solution obtained by the production method of the present invention include 0 silver, cadmium, copper, calcium, potassium, magnesium, and lead.
.. 005 ppn or less, iron, sodium, zinc 0.0
It was extremely low, less than 1 pp11.
[発明の効果]
以上説明したように、本発明のフォトレジスト現像液の
製造方法によれば、半導体にとって有害な金属イオンを
含まず、また現像時間が有効に制御されるとともに安定
した現像速度のコリン含有レジスト現像液が簡単で安価
に得られ、半導体装置製造上はかり知れない効果を及ぼ
すことができる。[Effects of the Invention] As explained above, according to the method for producing a photoresist developer of the present invention, it does not contain metal ions harmful to semiconductors, the development time is effectively controlled, and a stable development rate can be maintained. A choline-containing resist developer can be obtained easily and inexpensively, and can have immeasurable effects on the manufacturing of semiconductor devices.
Claims (1)
チルアミンを含有するトリメチルアミン水溶液と、エチ
レンオキシド水溶液又は液状エチレンオキシドの両液を
、反応器中に投入し、速かに均一分散状態となるように
混合して反応させることを特徴とするフォトレジスト現
像液の製造方法。 2、前記両液を、これら両液の混合反応最高温度に達す
るまでの時間の1/5の時間以内に均一分散状態にする
ことを特徴とする特許請求の範囲第1項記載のフォトレ
ジスト現像液の製造方法。[Claims] 1. A trimethylamine aqueous solution containing 1 mole or more of trimethylamine per 1 mole of ethylene oxide, and both the ethylene oxide aqueous solution or liquid ethylene oxide are put into a reactor and quickly become uniformly dispersed. A method for producing a photoresist developer, characterized by mixing and reacting as follows. 2. Photoresist development according to claim 1, characterized in that both the liquids are brought into a uniformly dispersed state within 1/5 of the time required for the mixing reaction of these two liquids to reach the maximum temperature. Method of manufacturing liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27996888A JPH0234858A (en) | 1988-11-05 | 1988-11-05 | Preparation of developing solution for photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27996888A JPH0234858A (en) | 1988-11-05 | 1988-11-05 | Preparation of developing solution for photoresist |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12071681A Division JPS5821825A (en) | 1981-08-03 | 1981-08-03 | Preparation of semiconductor treating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0234858A true JPH0234858A (en) | 1990-02-05 |
Family
ID=17618445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27996888A Pending JPH0234858A (en) | 1988-11-05 | 1988-11-05 | Preparation of developing solution for photoresist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0234858A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171654A (en) * | 1990-08-21 | 1992-12-15 | Konica Corporation | Toners for developing electrostatic images |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5351971A (en) * | 1976-10-21 | 1978-05-11 | Toshiba Corp | Manufacture for semiconductor |
JPS5474432A (en) * | 1977-10-25 | 1979-06-14 | Eastman Kodak Co | Method of developing photosensitive quinone diazide composition |
JPS561935A (en) * | 1979-06-18 | 1981-01-10 | Eastman Kodak Co | Stabilized developing material composition |
-
1988
- 1988-11-05 JP JP27996888A patent/JPH0234858A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5351971A (en) * | 1976-10-21 | 1978-05-11 | Toshiba Corp | Manufacture for semiconductor |
JPS5474432A (en) * | 1977-10-25 | 1979-06-14 | Eastman Kodak Co | Method of developing photosensitive quinone diazide composition |
JPS561935A (en) * | 1979-06-18 | 1981-01-10 | Eastman Kodak Co | Stabilized developing material composition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171654A (en) * | 1990-08-21 | 1992-12-15 | Konica Corporation | Toners for developing electrostatic images |
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