JPH0233476U - - Google Patents

Info

Publication number

JPH0233476U

JPH0233476U JP11136288U JP11136288U JPH0233476U JP H0233476 U JPH0233476 U JP H0233476U JP 11136288 U JP11136288 U JP 11136288U JP 11136288 U JP11136288 U JP 11136288U JP H0233476 U JPH0233476 U JP H0233476U

Authority

JP

Japan

Prior art keywords

copper foil

conductive hole

foil pad

solder resist

insulating layer

Prior art date

1988-08-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 7
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 239000011889 copper foil Substances 0.000 claims description 5
• 238000005192 partition Methods 0.000 claims 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1