JPH0233456U - - Google Patents

Info

Publication number

JPH0233456U

JPH0233456U JP11071088U JP11071088U JPH0233456U JP H0233456 U JPH0233456 U JP H0233456U JP 11071088 U JP11071088 U JP 11071088U JP 11071088 U JP11071088 U JP 11071088U JP H0233456 U JPH0233456 U JP H0233456U

Authority

JP

Japan

Prior art keywords

master

slicing

semiconductor device

aluminum wiring

wiring

Prior art date

1988-08-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000000034 method Methods 0.000 claims description 8
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
• 229910052782 aluminium Inorganic materials 0.000 claims description 5
• 239000004065 semiconductor Substances 0.000 claims description 4
• 239000010410 layer Substances 0.000 description 2
• 239000002356 single layer Substances 0.000 description 2
• 238000010586 diagram Methods 0.000 description 1