JPH0233444U - - Google Patents

Info

Publication number
JPH0233444U
JPH0233444U JP11176188U JP11176188U JPH0233444U JP H0233444 U JPH0233444 U JP H0233444U JP 11176188 U JP11176188 U JP 11176188U JP 11176188 U JP11176188 U JP 11176188U JP H0233444 U JPH0233444 U JP H0233444U
Authority
JP
Japan
Prior art keywords
mold
semiconductor device
recording area
encapsulated semiconductor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11176188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11176188U priority Critical patent/JPH0233444U/ja
Publication of JPH0233444U publication Critical patent/JPH0233444U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11176188U 1988-08-25 1988-08-25 Pending JPH0233444U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11176188U JPH0233444U (fr) 1988-08-25 1988-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11176188U JPH0233444U (fr) 1988-08-25 1988-08-25

Publications (1)

Publication Number Publication Date
JPH0233444U true JPH0233444U (fr) 1990-03-02

Family

ID=31350097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11176188U Pending JPH0233444U (fr) 1988-08-25 1988-08-25

Country Status (1)

Country Link
JP (1) JPH0233444U (fr)

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