JPH0233444U - - Google Patents
Info
- Publication number
- JPH0233444U JPH0233444U JP11176188U JP11176188U JPH0233444U JP H0233444 U JPH0233444 U JP H0233444U JP 11176188 U JP11176188 U JP 11176188U JP 11176188 U JP11176188 U JP 11176188U JP H0233444 U JPH0233444 U JP H0233444U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- semiconductor device
- recording area
- encapsulated semiconductor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11176188U JPH0233444U (fr) | 1988-08-25 | 1988-08-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11176188U JPH0233444U (fr) | 1988-08-25 | 1988-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0233444U true JPH0233444U (fr) | 1990-03-02 |
Family
ID=31350097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11176188U Pending JPH0233444U (fr) | 1988-08-25 | 1988-08-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0233444U (fr) |
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1988
- 1988-08-25 JP JP11176188U patent/JPH0233444U/ja active Pending