JPH0233442U - - Google Patents

Info

Publication number
JPH0233442U
JPH0233442U JP11266988U JP11266988U JPH0233442U JP H0233442 U JPH0233442 U JP H0233442U JP 11266988 U JP11266988 U JP 11266988U JP 11266988 U JP11266988 U JP 11266988U JP H0233442 U JPH0233442 U JP H0233442U
Authority
JP
Japan
Prior art keywords
support plate
metal support
main surface
resin
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11266988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11266988U priority Critical patent/JPH0233442U/ja
Publication of JPH0233442U publication Critical patent/JPH0233442U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11266988U 1988-08-26 1988-08-26 Pending JPH0233442U (US06277897-20010821-C00009.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11266988U JPH0233442U (US06277897-20010821-C00009.png) 1988-08-26 1988-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11266988U JPH0233442U (US06277897-20010821-C00009.png) 1988-08-26 1988-08-26

Publications (1)

Publication Number Publication Date
JPH0233442U true JPH0233442U (US06277897-20010821-C00009.png) 1990-03-02

Family

ID=31351817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11266988U Pending JPH0233442U (US06277897-20010821-C00009.png) 1988-08-26 1988-08-26

Country Status (1)

Country Link
JP (1) JPH0233442U (US06277897-20010821-C00009.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244311A (ja) * 1992-07-28 1994-09-02 Nec Corp 半導体装置の製造方法
WO2024095788A1 (ja) * 2022-11-04 2024-05-10 ローム株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244311A (ja) * 1992-07-28 1994-09-02 Nec Corp 半導体装置の製造方法
WO2024095788A1 (ja) * 2022-11-04 2024-05-10 ローム株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JPH0233442U (US06277897-20010821-C00009.png)
JPH02114943U (US06277897-20010821-C00009.png)
JPH0325245U (US06277897-20010821-C00009.png)
JPH0336137U (US06277897-20010821-C00009.png)
JPH0428449U (US06277897-20010821-C00009.png)
JPH0229539U (US06277897-20010821-C00009.png)
JPS62134239U (US06277897-20010821-C00009.png)
JPS60130644U (ja) 半導体装置
JPH0226261U (US06277897-20010821-C00009.png)
JPH0268452U (US06277897-20010821-C00009.png)
JPS63172149U (US06277897-20010821-C00009.png)
JPH01135736U (US06277897-20010821-C00009.png)
JPH038445U (US06277897-20010821-C00009.png)
JPH0330437U (US06277897-20010821-C00009.png)
JPH01174946U (US06277897-20010821-C00009.png)
JPH01160851U (US06277897-20010821-C00009.png)
JPH0426547U (US06277897-20010821-C00009.png)
JPS6190244U (US06277897-20010821-C00009.png)
JPH0338647U (US06277897-20010821-C00009.png)
JPH0176040U (US06277897-20010821-C00009.png)
JPS6194358U (US06277897-20010821-C00009.png)
JPH0173935U (US06277897-20010821-C00009.png)
JPS63142849U (US06277897-20010821-C00009.png)
JPH0377454U (US06277897-20010821-C00009.png)
JPS61100147U (US06277897-20010821-C00009.png)